Patents by Inventor Kwang-Yong Oh

Kwang-Yong Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250089427
    Abstract: A display apparatus including a panel substrate, a TFT panel part including a plurality of connection electrodes disposed on an upper surface of the panel substrate, and a light emitting diode part disposed on the TFT panel part and including a plurality of light emitting modules adjacent to each other, in which each of the light emitting modules includes a plurality of pixels, each of the pixels includes three sub-pixels, and the three sub-pixels include blue light emitting diodes, green light emitting diodes, and red light emitting diodes.
    Type: Application
    Filed: November 25, 2024
    Publication date: March 13, 2025
    Applicant: Seoul Semiconductor Co., Ltd.
    Inventors: Motonobu TAKEYA, Young Hyun KIM, Jong Ik LEE, Kwang Yong OH
  • Publication number: 20250065996
    Abstract: A method of calculating a collision risk of a ship according to an embodiment of the present disclosure may include: calculating an available velocity area based on maneuvering performance of a host ship; calculating a velocity obstacle area where there is a possibility of collision between an object and the host ship; and calculating a collision risk based on at least one of the available velocity area, the velocity obstacle area, and a preset weight.
    Type: Application
    Filed: October 30, 2024
    Publication date: February 27, 2025
    Inventors: Kwang Sung KO, In Beom KIM, Jin Mo PARK, Hui Yong CHOI, Hu Jae CHOI, Su Rim KIM, Gwang Hyeok CHOI, Do Yeop LEE, Do Yeon JUNG, Jin Young OH, Je Hyun CHA, Ji Yoon PARK, Won Chul YOO
  • Publication number: 20250048807
    Abstract: A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.
    Type: Application
    Filed: October 23, 2024
    Publication date: February 6, 2025
    Inventors: Myung Jin KIM, Kwang Yong Oh
  • Patent number: 12199226
    Abstract: A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.
    Type: Grant
    Filed: March 10, 2023
    Date of Patent: January 14, 2025
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Myung Jin Kim, Kwang Yong Oh
  • Patent number: 12155024
    Abstract: A display apparatus including a panel substrate, a TFT panel part including a plurality of connection electrodes disposed on an upper surface of the panel substrate, and a light emitting diode part disposed on the TFT panel part and including a plurality of light emitting modules adjacent to each other, in which each of the light emitting modules includes a plurality of pixels, each of the pixels includes three sub-pixels, and the three sub-pixels include blue light emitting diodes, green light emitting diodes, and red light emitting diodes.
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: November 26, 2024
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Motonobu Takeya, Young Hyun Kim, Jong Ik Lee, Kwang Yong Oh
  • Publication number: 20230253537
    Abstract: A display apparatus including a panel substrate, a TFT panel part including a plurality of connection electrodes disposed on an upper surface of the panel substrate, and a light emitting diode part disposed on the TFT panel part and including a plurality of light emitting modules adjacent to each other, in which each of the light emitting modules includes a plurality of pixels, each of the pixels includes three sub-pixels, and the three sub-pixels include blue light emitting diodes, green light emitting diodes, and red light emitting diodes.
    Type: Application
    Filed: April 14, 2023
    Publication date: August 10, 2023
    Inventors: Motonobu TAKEYA, Young Hyun KIM, Jong Ik LEE, Kwang Yong OH
  • Publication number: 20230215994
    Abstract: A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.
    Type: Application
    Filed: March 10, 2023
    Publication date: July 6, 2023
    Inventors: Myung Jin KIM, Kwang Yong OH
  • Patent number: 11677056
    Abstract: A display apparatus including a panel substrate, a TFT panel part including a plurality of connection electrodes disposed on an upper surface of the panel substrate, and a light emitting diode part disposed on the TFT panel part and including a plurality of light emitting modules adjacent to each other, in which each of the light emitting modules includes a plurality of pixels, each of the pixels includes three sub-pixels, and the three sub-pixels include blue light emitting diodes, green light emitting diodes, and red light emitting diodes.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: June 13, 2023
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Motonobu Takeya, Young Hyun Kim, Jong Ik Lee, Kwang Yong Oh
  • Patent number: 11605763
    Abstract: A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: March 14, 2023
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Myung Jin Kim, Kwang Yong Oh
  • Publication number: 20230056190
    Abstract: A light emitting diode package including: a housing; a light emitting diode chip arranged in the housing; a wavelength conversion unit arranged on the light emitting diode chip; a first fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the cyan wavelength band; and a second fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the red wavelength band, wherein the peak wavelength of light emitted from the light emitting diode chip is located within a range of 415 nm to 430 nm.
    Type: Application
    Filed: November 3, 2022
    Publication date: February 23, 2023
    Inventors: Myung Jin Kim, Kwang Yong Oh, Ki Bum Nam, Ji Youn Ho, San Shin Park, Michael Lim
  • Patent number: 11545599
    Abstract: A light emitting diode package includes: a housing; a light emitting diode chip arranged in the housing; a wavelength conversion unit arranged on the light emitting diode chip; a first fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the cyan wavelength band; and a second fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the red wavelength band, wherein the peak wavelength of light emitted from the light emitting diode chip is located within a range of 415 nm to 430 nm.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: January 3, 2023
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Myung Jin Kim, Kwang Yong Oh, Ki Bum Nam, Ji Youn Oh, Sang Shin Park, Michael Lim
  • Patent number: 11024784
    Abstract: A light emitting diode apparatus including a substrate, a plurality of light emitting diodes regularly arranged on the substrate and configured to emit ultraviolet (UV) light, the light emitting diodes including first, second, and third sub-light emitting diodes, a plurality of phosphor layers disposed on the light emitting diodes and to convert the wavelength of light emitted from the light emitting diodes, the phosphor layers including first, second, and third phosphor layers disposed on the first, second, and third sub-light emitting diodes, respectively, and a control unit configured to supply power to the light emitting diodes, in which the phosphor layers are spaced apart from each other by a blocking region, and the control unit is configured to cause at least a portion of the light emitting diodes to emit light.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: June 1, 2021
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Motonobu Takeya, Young Hyun Kim, Jong Ik Lee, Kwang Yong Oh
  • Patent number: 11024786
    Abstract: A display apparatus including a panel substrate including a TFT drive circuit for active matrix driving, a plurality of light emitting diodes, and an anisotropic conductive film electrically connecting the light emitting diodes to the panel substrate, in which the anisotropic conductive film includes an adhesive organic insulation material and conductive particles dispersed in the adhesive organic insulation material.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: June 1, 2021
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Motonobu Takeya, Young Hyun Kim, Jong Ik Lee, Kwang Yong Oh
  • Publication number: 20210028334
    Abstract: A light emitting diode package includes: a housing; a light emitting diode chip arranged in the housing; a wavelength conversion unit arranged on the light emitting diode chip; a first fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the cyan wavelength band; and a second fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the red wavelength band, wherein the peak wavelength of light emitted from the light emitting diode chip is located within a range of 415 nm to 430 nm.
    Type: Application
    Filed: October 15, 2020
    Publication date: January 28, 2021
    Inventors: Myung Jin Kim, Kwang Yong Oh, Ki Bum Nam, Ji Youn Oh, Sang Shin Park, Michael Lim
  • Publication number: 20200365786
    Abstract: A display apparatus including a panel substrate, a TFT panel part including a plurality of connection electrodes disposed on an upper surface of the panel substrate, and a light emitting diode part disposed on the TFT panel part and including a plurality of light emitting modules adjacent to each other, in which each of the light emitting modules includes a plurality of pixels, each of the pixels includes three sub-pixels, and the three sub-pixels include blue light emitting diodes, green light emitting diodes, and red light emitting diodes.
    Type: Application
    Filed: August 3, 2020
    Publication date: November 19, 2020
    Inventors: Motonobu Takeya, Young Hyun Kim, Jong Ik Lee, Kwang Yong Oh
  • Publication number: 20200357965
    Abstract: A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.
    Type: Application
    Filed: July 30, 2020
    Publication date: November 12, 2020
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Myung Jin KIM, Kwang Yong OH
  • Patent number: 10811572
    Abstract: A light emitting diode package includes: a housing; a light emitting diode chip arranged in the housing; a wavelength conversion unit arranged on the light emitting diode chip; a first fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the cyan wavelength band; and a second fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the red wavelength band, wherein the peak wavelength of light emitted from the light emitting diode chip is located within a range of 415 nm to 430 nm.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: October 20, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Myung Jin Kim, Kwang Yong Oh, Ki Bum Nam, Ji Youn Oh, Sang Shin Park, Michael Lim
  • Patent number: 10784239
    Abstract: A light emitting diode package including a housing, first and second light emitting diode chips disposed in the housing, and a wavelength conversion part including a phosphor to absorb light emitted from the first light emitting diode chip and emit light having a different wavelength than that emitted from the first light emitting diode chip, in which light emitted from the first light emitting diode chip has a shorter wavelength than light emitted from the second light emitting diode chip, the wavelength conversion part is configured to emit red light having a peak wavelength of 580 nm to 700 nm and exhibiting at least three peaks at a wavelength of 600 nm to 660 nm, and the light emitting diode package is configured to emit white light by mixing light emitted from the first light emitting diode chip, the second light emitting diode chip, and the wavelength conversion part.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: September 22, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Myung Jin Kim, Kwang Yong Oh, Seung Ryeol Ryu
  • Publication number: 20200083422
    Abstract: A display apparatus including a panel substrate including a TFT drive circuit for active matrix driving, a plurality of light emitting diodes, and an anisotropic conductive film electrically connecting the light emitting diodes to the panel substrate, in which the anisotropic conductive film includes an adhesive organic insulation material and conductive particles dispersed in the adhesive organic insulation material.
    Type: Application
    Filed: November 14, 2019
    Publication date: March 12, 2020
    Inventors: Motonobu TAKEYA, Young Hyun Kim, Jong lk Lee, Kwang Yong Oh
  • Publication number: 20200006298
    Abstract: A light emitting diode package including a housing, first and second light emitting diode chips disposed in the housing, and a wavelength conversion part including a phosphor to absorb light emitted from the first light emitting diode chip and emit light having a different wavelength than that emitted from the first light emitting diode chip, in which light emitted from the first light emitting diode chip has a shorter wavelength than light emitted from the second light emitting diode chip, the wavelength conversion part is configured to emit red light having a peak wavelength of 580 nm to 700 nm and exhibiting at least three peaks at a wavelength of 600 nm to 660 nm, and the light emitting diode package is configured to emit white light by mixing light emitted from the first light emitting diode chip, the second light emitting diode chip, and the wavelength conversion part.
    Type: Application
    Filed: September 10, 2019
    Publication date: January 2, 2020
    Inventors: Myung Jin KIM, Kwang Yong Oh, Seung Ryeol Ryu