Patents by Inventor Kwang-Yong Oh
Kwang-Yong Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250089427Abstract: A display apparatus including a panel substrate, a TFT panel part including a plurality of connection electrodes disposed on an upper surface of the panel substrate, and a light emitting diode part disposed on the TFT panel part and including a plurality of light emitting modules adjacent to each other, in which each of the light emitting modules includes a plurality of pixels, each of the pixels includes three sub-pixels, and the three sub-pixels include blue light emitting diodes, green light emitting diodes, and red light emitting diodes.Type: ApplicationFiled: November 25, 2024Publication date: March 13, 2025Applicant: Seoul Semiconductor Co., Ltd.Inventors: Motonobu TAKEYA, Young Hyun KIM, Jong Ik LEE, Kwang Yong OH
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Publication number: 20250065996Abstract: A method of calculating a collision risk of a ship according to an embodiment of the present disclosure may include: calculating an available velocity area based on maneuvering performance of a host ship; calculating a velocity obstacle area where there is a possibility of collision between an object and the host ship; and calculating a collision risk based on at least one of the available velocity area, the velocity obstacle area, and a preset weight.Type: ApplicationFiled: October 30, 2024Publication date: February 27, 2025Inventors: Kwang Sung KO, In Beom KIM, Jin Mo PARK, Hui Yong CHOI, Hu Jae CHOI, Su Rim KIM, Gwang Hyeok CHOI, Do Yeop LEE, Do Yeon JUNG, Jin Young OH, Je Hyun CHA, Ji Yoon PARK, Won Chul YOO
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Publication number: 20250048807Abstract: A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.Type: ApplicationFiled: October 23, 2024Publication date: February 6, 2025Inventors: Myung Jin KIM, Kwang Yong Oh
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Patent number: 12199226Abstract: A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.Type: GrantFiled: March 10, 2023Date of Patent: January 14, 2025Assignee: Seoul Semiconductor Co., Ltd.Inventors: Myung Jin Kim, Kwang Yong Oh
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Patent number: 12155024Abstract: A display apparatus including a panel substrate, a TFT panel part including a plurality of connection electrodes disposed on an upper surface of the panel substrate, and a light emitting diode part disposed on the TFT panel part and including a plurality of light emitting modules adjacent to each other, in which each of the light emitting modules includes a plurality of pixels, each of the pixels includes three sub-pixels, and the three sub-pixels include blue light emitting diodes, green light emitting diodes, and red light emitting diodes.Type: GrantFiled: April 14, 2023Date of Patent: November 26, 2024Assignee: Seoul Semiconductor Co., Ltd.Inventors: Motonobu Takeya, Young Hyun Kim, Jong Ik Lee, Kwang Yong Oh
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Publication number: 20230253537Abstract: A display apparatus including a panel substrate, a TFT panel part including a plurality of connection electrodes disposed on an upper surface of the panel substrate, and a light emitting diode part disposed on the TFT panel part and including a plurality of light emitting modules adjacent to each other, in which each of the light emitting modules includes a plurality of pixels, each of the pixels includes three sub-pixels, and the three sub-pixels include blue light emitting diodes, green light emitting diodes, and red light emitting diodes.Type: ApplicationFiled: April 14, 2023Publication date: August 10, 2023Inventors: Motonobu TAKEYA, Young Hyun KIM, Jong Ik LEE, Kwang Yong OH
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Publication number: 20230215994Abstract: A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.Type: ApplicationFiled: March 10, 2023Publication date: July 6, 2023Inventors: Myung Jin KIM, Kwang Yong OH
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Patent number: 11677056Abstract: A display apparatus including a panel substrate, a TFT panel part including a plurality of connection electrodes disposed on an upper surface of the panel substrate, and a light emitting diode part disposed on the TFT panel part and including a plurality of light emitting modules adjacent to each other, in which each of the light emitting modules includes a plurality of pixels, each of the pixels includes three sub-pixels, and the three sub-pixels include blue light emitting diodes, green light emitting diodes, and red light emitting diodes.Type: GrantFiled: August 3, 2020Date of Patent: June 13, 2023Assignee: Seoul Semiconductor Co., Ltd.Inventors: Motonobu Takeya, Young Hyun Kim, Jong Ik Lee, Kwang Yong Oh
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Patent number: 11605763Abstract: A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.Type: GrantFiled: July 30, 2020Date of Patent: March 14, 2023Assignee: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Myung Jin Kim, Kwang Yong Oh
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Publication number: 20230056190Abstract: A light emitting diode package including: a housing; a light emitting diode chip arranged in the housing; a wavelength conversion unit arranged on the light emitting diode chip; a first fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the cyan wavelength band; and a second fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the red wavelength band, wherein the peak wavelength of light emitted from the light emitting diode chip is located within a range of 415 nm to 430 nm.Type: ApplicationFiled: November 3, 2022Publication date: February 23, 2023Inventors: Myung Jin Kim, Kwang Yong Oh, Ki Bum Nam, Ji Youn Ho, San Shin Park, Michael Lim
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Patent number: 11545599Abstract: A light emitting diode package includes: a housing; a light emitting diode chip arranged in the housing; a wavelength conversion unit arranged on the light emitting diode chip; a first fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the cyan wavelength band; and a second fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the red wavelength band, wherein the peak wavelength of light emitted from the light emitting diode chip is located within a range of 415 nm to 430 nm.Type: GrantFiled: October 15, 2020Date of Patent: January 3, 2023Assignee: Seoul Semiconductor Co., Ltd.Inventors: Myung Jin Kim, Kwang Yong Oh, Ki Bum Nam, Ji Youn Oh, Sang Shin Park, Michael Lim
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Patent number: 11024784Abstract: A light emitting diode apparatus including a substrate, a plurality of light emitting diodes regularly arranged on the substrate and configured to emit ultraviolet (UV) light, the light emitting diodes including first, second, and third sub-light emitting diodes, a plurality of phosphor layers disposed on the light emitting diodes and to convert the wavelength of light emitted from the light emitting diodes, the phosphor layers including first, second, and third phosphor layers disposed on the first, second, and third sub-light emitting diodes, respectively, and a control unit configured to supply power to the light emitting diodes, in which the phosphor layers are spaced apart from each other by a blocking region, and the control unit is configured to cause at least a portion of the light emitting diodes to emit light.Type: GrantFiled: June 4, 2018Date of Patent: June 1, 2021Assignee: Seoul Semiconductor Co., Ltd.Inventors: Motonobu Takeya, Young Hyun Kim, Jong Ik Lee, Kwang Yong Oh
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Patent number: 11024786Abstract: A display apparatus including a panel substrate including a TFT drive circuit for active matrix driving, a plurality of light emitting diodes, and an anisotropic conductive film electrically connecting the light emitting diodes to the panel substrate, in which the anisotropic conductive film includes an adhesive organic insulation material and conductive particles dispersed in the adhesive organic insulation material.Type: GrantFiled: November 14, 2019Date of Patent: June 1, 2021Assignee: Seoul Semiconductor Co., Ltd.Inventors: Motonobu Takeya, Young Hyun Kim, Jong Ik Lee, Kwang Yong Oh
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Publication number: 20210028334Abstract: A light emitting diode package includes: a housing; a light emitting diode chip arranged in the housing; a wavelength conversion unit arranged on the light emitting diode chip; a first fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the cyan wavelength band; and a second fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the red wavelength band, wherein the peak wavelength of light emitted from the light emitting diode chip is located within a range of 415 nm to 430 nm.Type: ApplicationFiled: October 15, 2020Publication date: January 28, 2021Inventors: Myung Jin Kim, Kwang Yong Oh, Ki Bum Nam, Ji Youn Oh, Sang Shin Park, Michael Lim
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Publication number: 20200365786Abstract: A display apparatus including a panel substrate, a TFT panel part including a plurality of connection electrodes disposed on an upper surface of the panel substrate, and a light emitting diode part disposed on the TFT panel part and including a plurality of light emitting modules adjacent to each other, in which each of the light emitting modules includes a plurality of pixels, each of the pixels includes three sub-pixels, and the three sub-pixels include blue light emitting diodes, green light emitting diodes, and red light emitting diodes.Type: ApplicationFiled: August 3, 2020Publication date: November 19, 2020Inventors: Motonobu Takeya, Young Hyun Kim, Jong Ik Lee, Kwang Yong Oh
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Publication number: 20200357965Abstract: A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.Type: ApplicationFiled: July 30, 2020Publication date: November 12, 2020Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Myung Jin KIM, Kwang Yong OH
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Patent number: 10811572Abstract: A light emitting diode package includes: a housing; a light emitting diode chip arranged in the housing; a wavelength conversion unit arranged on the light emitting diode chip; a first fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the cyan wavelength band; and a second fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the red wavelength band, wherein the peak wavelength of light emitted from the light emitting diode chip is located within a range of 415 nm to 430 nm.Type: GrantFiled: October 7, 2015Date of Patent: October 20, 2020Assignee: Seoul Semiconductor Co., Ltd.Inventors: Myung Jin Kim, Kwang Yong Oh, Ki Bum Nam, Ji Youn Oh, Sang Shin Park, Michael Lim
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Patent number: 10784239Abstract: A light emitting diode package including a housing, first and second light emitting diode chips disposed in the housing, and a wavelength conversion part including a phosphor to absorb light emitted from the first light emitting diode chip and emit light having a different wavelength than that emitted from the first light emitting diode chip, in which light emitted from the first light emitting diode chip has a shorter wavelength than light emitted from the second light emitting diode chip, the wavelength conversion part is configured to emit red light having a peak wavelength of 580 nm to 700 nm and exhibiting at least three peaks at a wavelength of 600 nm to 660 nm, and the light emitting diode package is configured to emit white light by mixing light emitted from the first light emitting diode chip, the second light emitting diode chip, and the wavelength conversion part.Type: GrantFiled: September 10, 2019Date of Patent: September 22, 2020Assignee: Seoul Semiconductor Co., Ltd.Inventors: Myung Jin Kim, Kwang Yong Oh, Seung Ryeol Ryu
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Publication number: 20200083422Abstract: A display apparatus including a panel substrate including a TFT drive circuit for active matrix driving, a plurality of light emitting diodes, and an anisotropic conductive film electrically connecting the light emitting diodes to the panel substrate, in which the anisotropic conductive film includes an adhesive organic insulation material and conductive particles dispersed in the adhesive organic insulation material.Type: ApplicationFiled: November 14, 2019Publication date: March 12, 2020Inventors: Motonobu TAKEYA, Young Hyun Kim, Jong lk Lee, Kwang Yong Oh
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Publication number: 20200006298Abstract: A light emitting diode package including a housing, first and second light emitting diode chips disposed in the housing, and a wavelength conversion part including a phosphor to absorb light emitted from the first light emitting diode chip and emit light having a different wavelength than that emitted from the first light emitting diode chip, in which light emitted from the first light emitting diode chip has a shorter wavelength than light emitted from the second light emitting diode chip, the wavelength conversion part is configured to emit red light having a peak wavelength of 580 nm to 700 nm and exhibiting at least three peaks at a wavelength of 600 nm to 660 nm, and the light emitting diode package is configured to emit white light by mixing light emitted from the first light emitting diode chip, the second light emitting diode chip, and the wavelength conversion part.Type: ApplicationFiled: September 10, 2019Publication date: January 2, 2020Inventors: Myung Jin KIM, Kwang Yong Oh, Seung Ryeol Ryu