Abstract: In one example, an electronic device includes a substrate including a substrate first side, a conductive structure, and a substrate sidewall on the substrate first side. The substrate sidewall forms a perimeter, the substrate first side within the perimeter defines a substrate base, and the substrate sidewall and the substrate base form a substrate cavity. An electronic component includes a component first side, a component second side, and a component lateral side. The electronic component is disposed over a first portion of the substrate base within the substrate cavity and is coupled to the conductive structure. An encapsulant encapsulates at least a portion of the component lateral side, and a lid is over at least a portion of the component first side. At least a portion of the component first side is devoid of the encapsulant. Other examples and related methods are also disclosed herein.

Abstract: The present invention relates to a pi truss structure. A pi truss structure, in which a bracing part is coupled to a coupling groove defined on the inside of each upper and lower pi parts, respectively, and wherein web members having two rows of the pi parts are disposed and coupled so as to face each other at a right angle within a plate-shaped flange member, and the coupling groove having a shape is defined inward in the lengthwise direction. Also, one side of each of the web members is disposed on the flange member, the other side being bent outward so as to form a reinforcing flange part. The coupling grooves of the upper and lower pi parts are disposed facing each other so as to couple coupling members to the coupling grooves, respectively. Also, the bracing part is coupled to the coupling members.