Patents by Inventor Kwangduk D. Lee

Kwangduk D. Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • AMORPHOUS CARBON FOR GAP FILL
    Publication number: 20220076945
    Abstract: Methods for depositing an amorphous carbon layer on a substrate and for filling a substrate feature with an amorphous carbon gap fill are described. The method comprises performing a deposition cycle comprising: introducing a hydrocarbon source into a processing chamber; introducing a plasma initiating gas into the processing chamber; generating a plasma in the processing chamber at a temperature of greater than 600° C.; forming an amorphous carbon layer on a substrate with a deposition rate of greater than 200 nm/hr; and purging the processing chamber.
    Type: Application
    Filed: September 8, 2020
    Publication date: March 10, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Xiaoquan Min, Kwangduk D. Lee