Patents by Inventor Kwang Hyun Park

Kwang Hyun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12259358
    Abstract: The present invention relates to an eddy current sensor for detecting a crack in a battery cell, and a system for detecting a crack of a battery cell including the eddy current sensor. According to the present invention, it is possible to easily detect a crack generated in an electrode, an electrode tab or a welded portion.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: March 25, 2025
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Ji Won Park, Kwang Hyun Kim, Yeon Hyuk Heo, Jae Won Jeong, Eun Gu Han, Min Su Hwang, Myung Han Lee
  • Publication number: 20250090563
    Abstract: The present disclosure relates to a composition for the prevention, amelioration or treatment of inflammatory bowel disease, comprising a galacto-oligosaccharide as an active ingredient. The galacto-oligosaccharide composition of the present disclosure has an anti-inflammatory effect of ameliorating DAI and reducing the levels of inflammatory cytokines and MPO in inflammatory bowel disease model mice, and thus can be effectively used as a drug or food for the prevention, amelioration or treatment of inflammatory bowel disease.
    Type: Application
    Filed: January 21, 2022
    Publication date: March 20, 2025
    Inventors: Jae-Hwan KIM, Kwang-Soon SHIN, Jung-Cheul SHIN, Hye-Ryung PARK, Na-Ri KIM, Young-Jin BAEK, Dong-Hyun EOM
  • Patent number: 12255266
    Abstract: Lighting module disclosed in an embodiment of the invention, a substrate; a plurality of light emitting devices disposed on the substrate; a first reflective layer disposed on the substrate; a resin layer disposed on the first reflective layer and the light emitting device; and a second reflective layer disposed on the resin layer, wherein the resin layer is a front side surface on which light generated from the plurality of light emitting devices is emitted, a rear side surface facing the front side surface, and first and second side surfaces connecting the front side surface and the rear side surface with each other.
    Type: Grant
    Filed: February 22, 2024
    Date of Patent: March 18, 2025
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Se Eun Kang, Kwang Hyun Ko, Moo Ryong Park
  • Patent number: 12244292
    Abstract: A bulk acoustic resonator comprises a membrane including a piezoelectric film having multiple layers of piezoelectric material. At least one of the multiple layers of piezoelectric material has a different dopant concentration than another of the multiple layers of piezoelectric material.
    Type: Grant
    Filed: October 12, 2022
    Date of Patent: March 4, 2025
    Assignee: SKYWORKS GLOBAL PTE. LTD.
    Inventors: Kwang Jae Shin, Renfeng Jin, Benjamin Paul Abbott, Jong Duk Han, Myung Hyun Park, Myeong Gweon Gu
  • Publication number: 20250065996
    Abstract: A method of calculating a collision risk of a ship according to an embodiment of the present disclosure may include: calculating an available velocity area based on maneuvering performance of a host ship; calculating a velocity obstacle area where there is a possibility of collision between an object and the host ship; and calculating a collision risk based on at least one of the available velocity area, the velocity obstacle area, and a preset weight.
    Type: Application
    Filed: October 30, 2024
    Publication date: February 27, 2025
    Inventors: Kwang Sung KO, In Beom KIM, Jin Mo PARK, Hui Yong CHOI, Hu Jae CHOI, Su Rim KIM, Gwang Hyeok CHOI, Do Yeop LEE, Do Yeon JUNG, Jin Young OH, Je Hyun CHA, Ji Yoon PARK, Won Chul YOO
  • Patent number: 12228461
    Abstract: A temperature sensing device including a first temperature sensor having a first resistor and a first capacitor and generating a first voltage applied to at least one of the first resistor or the first capacitor based on a first clock signal and a second clock signal generated by delaying the first clock signal, a second temperature sensor having a second resistor and a second capacitor and generating a second voltage applied to at least one of the second resistor or the second capacitor based on the first and second clock signals, a controller generating code data based on the first voltage and the second voltage and generating a control signal based on the code data, and a delay locked loop circuit delaying the first clock signal based on the control signal to generate the second clock signal may be provided.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: February 18, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung Hyun Park, Kwang Ho Kim, Joo Seong Kim, Jun Hyeok Yang
  • Patent number: 12230831
    Abstract: One aspect of the present invention provides a stretching apparatus for manufacturing a separator including a first stretching machine and a second stretching machine arranged in parallel with each other, in which the first stretching machine includes a plurality of first unit sections having different stretching ratios, and the second stretching machine includes a plurality of second unit sections having different stretching ratios, the overall stretching ratio by each of the first stretching machine and the second stretching machine is the same each other, and at least one stretching ratio of the first unit section and at least one stretching ratio of the second unit section are different from each other and a method of manufacturing a separator using the same.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: February 18, 2025
    Assignees: W-SCOPE KOREA CO., LTD., W-SCOPE CHUNGJU PLANT CO., LTD.
    Inventors: Kyoung Sun Ryu, Won Keun Choi, Kwang Ho Choi, Pyung Yong Park, Byung Hyun Kim
  • Patent number: 12228262
    Abstract: The lighting device disclosed at an embodiment includes a substrate; a plurality of light sources arranged on the substrate; a resin layer scaling the plurality of light sources; a reflective member disposed between the resin layer and the substrate; and an antenna pattern disposed in a first region between the reflective member and the substrate.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: February 18, 2025
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Kwang Hyun Ko, Moo Ryong Park, Woo Kil Jung, So Yeon Ham
  • Patent number: 12225747
    Abstract: A quantum dot device including an anode and a cathode, a light emitting layer disposed between the anode and the cathode, the light emitting layer comprising quantum dots, a first hole auxiliary layer disposed on the anode, the first hole auxiliary layer including poly(3,4-ethylenedioxythiophene)-polystyrenesulfonate or a derivative thereof (PEDOT:PSS), a second hole auxiliary layer disposed on the first hole auxiliary layer and including a hole transport material different from the PEDOT:PSS, wherein the light emitting layer is disposed on the second hole auxiliary layer, wherein the first hole auxiliary layer has a first surface facing the anode and a second surface facing the second hole auxiliary layer, and the second surface includes a surface modification region including a surface modification material having a carboxylic acid group, a phosphonic acid group, a sulfonic acid group, or a salt thereof. An electronic device that includes the quantum dot device.
    Type: Grant
    Filed: November 17, 2023
    Date of Patent: February 11, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Won Sik Yoon, Ju Hyun Kim, Ha Il Kwon, Kwang Hee Kim, Taehyung Kim, Su Jin Park, Dae Young Chung
  • Publication number: 20250023552
    Abstract: A wafer-level package module includes a first substrate having a first bulk acoustic wave (BAW) device mounted thereon with a first aluminum nitride piezoelectric layer. The wafer-level package module further includes a second substrate having a second BAW device mounted thereon with a second aluminum nitride piezoelectric layer. The first BAW device has a electromechanical coupling coefficient (kt2) different from the second BAW device.
    Type: Application
    Filed: July 11, 2024
    Publication date: January 16, 2025
    Inventors: Kwang Jae Shin, Alexandre Augusto Shirakawa, Yiliu Wang, Tetsuya Tsurunari, Myung Hyun Park, Nobufumi Matsuo
  • Patent number: 11830641
    Abstract: A chip resistor component, includes: a substrate having one surface, and one side surface and the other side surface facing each other in one direction; an terminal including an internal electrode disposed on the one surface, and an external electrode disposed on the one side surface to be connected to the internal electrode; a resistive layer disposed on the one surface, and including an outermost pattern connected to the internal electrode; and a protective layer disposed on the one surface to cover the resistive layer. The outermost pattern of the resistive layer has a first region in contact with the internal electrode and a second region extending, in the one direction, from the first region towards the other side surface. A ratio of a length of the second region in the one direction to a length of the chip resistor component in the one direction is 0.02 or more.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: November 28, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ah Ra Cho, Kwang Hyun Park
  • Publication number: 20220270790
    Abstract: A chip resistor component, includes: a substrate having one surface, and one side surface and the other side surface facing each other in one direction; an terminal including an internal electrode disposed on the one surface, and an external electrode disposed on the one side surface to be connected to the internal electrode; a resistive layer disposed on the one surface, and including an outermost pattern connected to the internal electrode; and a protective layer disposed on the one surface to cover the resistive layer. The outermost pattern of the resistive layer has a first region in contact with the internal electrode and a second region extending, in the one direction, from the first region towards the other side surface. A ratio of a length of the second region in the one direction to a length of the chip resistor component in the one direction is 0.02 or more.
    Type: Application
    Filed: December 8, 2021
    Publication date: August 25, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ah Ra Cho, Kwang Hyun Park
  • Patent number: 11315708
    Abstract: A chip resistor includes: an insulating substrate; a resistor portion disposed on one surface of the insulating substrate and including a plurality of resistor bodies spaced apart from each other and a plurality of internal electrodes connecting the plurality of resistor bodies to each other; and a first external electrode and a second external electrode disposed on the one surface of the insulating substrate to be spaced apart from each other and respectively connected to the resistor portion, wherein each of the plurality of resistor bodies has a first end adjacent to the first external electrode and a second end opposing the first end and adjacent to the second external electrode, and each of the first end and the second end of each of the plurality of resistor bodies is connected to one of the plurality of internal electrodes, the first external electrode, or the second external electrode.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: April 26, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Hyun Park, Ah Ra Cho
  • Patent number: 11139091
    Abstract: A resistor component includes an insulating substrate, a resistor layer disposed on one surface of the insulating substrate and having one end and the other end opposing each other in a first direction, and first and second terminals disposed on the insulating substrate and spaced apart from each other to oppose each other in a second direction perpendicular to the first direction, and connected to the resistor layer. A slit in the resistor layer extends in the first direction, and a ratio of a length of the slit in the first direction to a length of the resistor layer in the first direction is greater than 0.7 and equal to or lower than 0.9.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: October 5, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ah Ra Cho, Ji Sook Yoon, Kwang Hyun Park
  • Patent number: 11094436
    Abstract: A resistor component includes an insulating substrate; a resistance layer disposed on one surface of the insulating substrate; and first and second terminals disposed on the insulating substrate to be spaced apart from each other and connected to the resistance layer, wherein each the first and second terminals comprises an inner electrode layer disposed on the resistance layer, and a via electrode penetrating the resistance layer to be in contact with the one surface of the insulating substrate and the inner electrode layer.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: August 17, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Sook Yoon, Kwang Hyun Park
  • Patent number: 11071748
    Abstract: When using a pharmaceutical composition for preventing or treating malignant hyperthermia, containing NAADP antagonists, of the present invention, malignant hyperthermia can be effectively prevented or treated through the inhibition of an oxygen consumption rate abnormal increase, which is associated with a ryanodine receptor (RYR) of skeletal muscles. In addition, the present invention can be used even after the onset of malignant hyperthermia and can inhibit an oxygen consumption rate abnormal increase even at concentrations lower than those of conventional agents for treating malignant hyperthermia, thereby enabling conventional agents for treating malignant hyperthermia to be replaced, and can be stably used, thereby being effectively usable in relevant industries.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: July 27, 2021
    Assignee: Industrial Cooperation Foundation Chonbuk National University
    Inventors: Uh Hyun Kim, Dae Ryoung Park, Kwang Hyun Park
  • Publication number: 20210202137
    Abstract: A resistor component includes an insulating substrate; a resistance layer disposed on one surface of the insulating substrate; and first and second terminals disposed on the insulating substrate to be spaced apart from each other and connected to the resistance layer, wherein each the first and second terminals comprises an inner electrode layer disposed on the resistance layer, and a via electrode penetrating the resistance layer to be in contact with the one surface of the insulating substrate and the inner electrode layer.
    Type: Application
    Filed: June 2, 2020
    Publication date: July 1, 2021
    Inventors: Ji Sook Yoon, Kwang Hyun Park
  • Publication number: 20210183544
    Abstract: A resistor component includes an insulating substrate, a resistor layer disposed on one surface of the insulating substrate and having one end and the other end opposing each other in a first direction, and first and second terminals disposed on the insulating substrate and spaced apart from each other to oppose each other in a second direction perpendicular to the first direction, and connected to the resistor layer. A slit in the resistor layer extends in the first direction, and a ratio of a length of the slit in the first direction to a length of the resistor layer in the first direction is greater than 0.7 and equal to or lower than 0.9.
    Type: Application
    Filed: June 22, 2020
    Publication date: June 17, 2021
    Inventors: Ah Ra Cho, Ji Sook Yoon, Kwang Hyun Park
  • Patent number: 10964461
    Abstract: A resistor element includes a base substrate having a first surface and a second surface, a resistive layer having a first surface disposed on the second surface of the base substrate, a second surface opposing the first surface of the resistive layer, and first to fourth sides connecting the first surface of the resistive layer to the second surface of the resistive layer, and internal electrodes spaced apart from each other on the second surface of the base substrate. The first and second sides of the resistive layer face each other in a direction in which the internal electrodes are spaced apart, and the third and fourth sides of the resistive layer connect the first and second sides. With the second surface of the base substrate, an angle between each of the third and fourth sides is greater than an angle between each of the first and second sides.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: March 30, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yeon Hee Shin, Ji Sook Yoon, Kwang Hyun Park
  • Patent number: 10846676
    Abstract: The present invention relates to a financial device and a control method and system thereof. The financial device may comprise: one or more selection portions; and a control unit configured to process any one of a plurality of financial processes, when any one of the one or more selection portions is input.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: November 24, 2020
    Assignee: ATEC AP CO., LTD.
    Inventors: Yong Gyun Choi, Kyung Hee Kim, Kwang Hyun Park, Han Yong Park, So Young Kim