Patents by Inventor Kwang Hyun Park
Kwang Hyun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250148268Abstract: An apparatus and method analyze oscillation frequency data based on an artificial intelligence structure including a fully connected network (FCN), which generates output data by being inserted into at least one of the encoder and the decoder and analyzing the relationship of all data. The apparatus includes a sensor unit configured to sense oscillation signals generated from a vehicle part in a time series manner by having a plurality sensors disposed thereon and includes a computing device configured to analyze oscillation frequency data based on sensing data provided from the plurality of sensors.Type: ApplicationFiled: November 7, 2024Publication date: May 8, 2025Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)Inventors: Kyung Woo Lee, Dae Un Sung, Young Rock Chung, Yong Hyun Ryu, Seul Ki Lee, Kwang Ryeol Park
-
Patent number: 12283497Abstract: The present disclosure provides a semiconductor deposition monitoring device comprising a supporting table, a chamber, a lamp, an optical sensor, a conduit, a plurality of sensors in the conduit, and a heat exchanger. The supporting table supports a deposition target wafer on which a deposition material is deposited. The chamber comprises an upper dome and a lower dome. The lamp emits light to the chamber. The optical sensor receives the irradiated light and measures the deposition material formed in the chamber. The conduit has an inlet conduit through which air is injected into the chamber and an outlet conduit through which the air is discharged from the chamber. The plurality of sensors sense information of the air. The sensed information may be used to control the heat exchanger.Type: GrantFiled: January 22, 2021Date of Patent: April 22, 2025Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young Uk Choi, Yeon Tae Kim, Tae Soon Park, Kee Soo Park, Sung-Gyu Park, Kwang-Hyun Yang, Seung Hun Lee
-
Publication number: 20250126999Abstract: A display device includes a main display area, and a first sub-display area and a second sub-display area around the main display area and located adjacent to each other, a plurality of pixel electrodes in the main display area and spaced from each other, a plurality of first sub-pixel electrodes in the first sub-display area and spaced from each other, a plurality of first copy pixel electrodes in the first sub-display area and connected to the first sub-pixel electrodes via a first bridge electrode, a first pixel defining layer in the main display area and the first sub-display area, and having a plurality of openings therein that overlaps the plurality of pixel electrodes, the plurality of first sub-pixel electrodes, and the plurality of first copy pixel electrodes, a plurality of second sub-pixel electrodes and second copy pixel electrodes in the second sub-display area and spaced from each other.Type: ApplicationFiled: October 14, 2024Publication date: April 17, 2025Inventors: Dong Hwan SHIM, Kwang Woo PARK, Hye Min PARK, Jin Yong LEE, Cheol JANG, Sang Hyun HAN
-
Patent number: 12270079Abstract: Provided is an analytical method for providing information necessary for a diagnosis of urolithiasis, including measuring an expression level of a gene encoding a YOD1, USP6, USP19, PSMD14, or USP26 protein in a biological sample from a subject to be diagnosed; and a kit for a diagnosis of urolithiasis which is used in the analytical method.Type: GrantFiled: January 22, 2020Date of Patent: April 8, 2025Assignee: CHA UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATIONInventors: Kwang-Hyun Baek, Jun-Hyeok Park
-
Publication number: 20250099390Abstract: Provided is a method for preventing, ameliorating, or treating inflammatory diseases by administering a composition containing extracellular vesicles (EVs) derived from Roseburia spp. strains and/or Bifidobacterium spp. strains, wherein the EVs exhibits effectiveness in improving inflammatory bowel disease (IBD), and additionally, all EVs derived from congeneric strains corresponding to Roseburia spp. strains or Bifidobacterium spp. strains. have been confirmed to exhibit strong anti-inflammatory effect, and the strains and EVs derived therefrom can be provided as a composition for preventing, ameliorating, or treating a variety of inflammatory diseases.Type: ApplicationFiled: January 18, 2023Publication date: March 27, 2025Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Ki Young CHOI, Kwang-Hyun CHA, Hwa Seung HAN, Jin Soo PARK, Dae-geun SONG, Myung Suk KIM, Hak Cheol KWON
-
Patent number: 12259358Abstract: The present invention relates to an eddy current sensor for detecting a crack in a battery cell, and a system for detecting a crack of a battery cell including the eddy current sensor. According to the present invention, it is possible to easily detect a crack generated in an electrode, an electrode tab or a welded portion.Type: GrantFiled: October 27, 2021Date of Patent: March 25, 2025Assignee: LG ENERGY SOLUTION, LTD.Inventors: Ji Won Park, Kwang Hyun Kim, Yeon Hyuk Heo, Jae Won Jeong, Eun Gu Han, Min Su Hwang, Myung Han Lee
-
Publication number: 20250090563Abstract: The present disclosure relates to a composition for the prevention, amelioration or treatment of inflammatory bowel disease, comprising a galacto-oligosaccharide as an active ingredient. The galacto-oligosaccharide composition of the present disclosure has an anti-inflammatory effect of ameliorating DAI and reducing the levels of inflammatory cytokines and MPO in inflammatory bowel disease model mice, and thus can be effectively used as a drug or food for the prevention, amelioration or treatment of inflammatory bowel disease.Type: ApplicationFiled: January 21, 2022Publication date: March 20, 2025Inventors: Jae-Hwan KIM, Kwang-Soon SHIN, Jung-Cheul SHIN, Hye-Ryung PARK, Na-Ri KIM, Young-Jin BAEK, Dong-Hyun EOM
-
Patent number: 12255266Abstract: Lighting module disclosed in an embodiment of the invention, a substrate; a plurality of light emitting devices disposed on the substrate; a first reflective layer disposed on the substrate; a resin layer disposed on the first reflective layer and the light emitting device; and a second reflective layer disposed on the resin layer, wherein the resin layer is a front side surface on which light generated from the plurality of light emitting devices is emitted, a rear side surface facing the front side surface, and first and second side surfaces connecting the front side surface and the rear side surface with each other.Type: GrantFiled: February 22, 2024Date of Patent: March 18, 2025Assignee: LG INNOTEK CO., LTD.Inventors: Se Eun Kang, Kwang Hyun Ko, Moo Ryong Park
-
Patent number: 12244292Abstract: A bulk acoustic resonator comprises a membrane including a piezoelectric film having multiple layers of piezoelectric material. At least one of the multiple layers of piezoelectric material has a different dopant concentration than another of the multiple layers of piezoelectric material.Type: GrantFiled: October 12, 2022Date of Patent: March 4, 2025Assignee: SKYWORKS GLOBAL PTE. LTD.Inventors: Kwang Jae Shin, Renfeng Jin, Benjamin Paul Abbott, Jong Duk Han, Myung Hyun Park, Myeong Gweon Gu
-
Publication number: 20250065996Abstract: A method of calculating a collision risk of a ship according to an embodiment of the present disclosure may include: calculating an available velocity area based on maneuvering performance of a host ship; calculating a velocity obstacle area where there is a possibility of collision between an object and the host ship; and calculating a collision risk based on at least one of the available velocity area, the velocity obstacle area, and a preset weight.Type: ApplicationFiled: October 30, 2024Publication date: February 27, 2025Inventors: Kwang Sung KO, In Beom KIM, Jin Mo PARK, Hui Yong CHOI, Hu Jae CHOI, Su Rim KIM, Gwang Hyeok CHOI, Do Yeop LEE, Do Yeon JUNG, Jin Young OH, Je Hyun CHA, Ji Yoon PARK, Won Chul YOO
-
Patent number: 12228461Abstract: A temperature sensing device including a first temperature sensor having a first resistor and a first capacitor and generating a first voltage applied to at least one of the first resistor or the first capacitor based on a first clock signal and a second clock signal generated by delaying the first clock signal, a second temperature sensor having a second resistor and a second capacitor and generating a second voltage applied to at least one of the second resistor or the second capacitor based on the first and second clock signals, a controller generating code data based on the first voltage and the second voltage and generating a control signal based on the code data, and a delay locked loop circuit delaying the first clock signal based on the control signal to generate the second clock signal may be provided.Type: GrantFiled: December 27, 2021Date of Patent: February 18, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Jung Hyun Park, Kwang Ho Kim, Joo Seong Kim, Jun Hyeok Yang
-
Patent number: 12230831Abstract: One aspect of the present invention provides a stretching apparatus for manufacturing a separator including a first stretching machine and a second stretching machine arranged in parallel with each other, in which the first stretching machine includes a plurality of first unit sections having different stretching ratios, and the second stretching machine includes a plurality of second unit sections having different stretching ratios, the overall stretching ratio by each of the first stretching machine and the second stretching machine is the same each other, and at least one stretching ratio of the first unit section and at least one stretching ratio of the second unit section are different from each other and a method of manufacturing a separator using the same.Type: GrantFiled: July 1, 2022Date of Patent: February 18, 2025Assignees: W-SCOPE KOREA CO., LTD., W-SCOPE CHUNGJU PLANT CO., LTD.Inventors: Kyoung Sun Ryu, Won Keun Choi, Kwang Ho Choi, Pyung Yong Park, Byung Hyun Kim
-
Patent number: 12228262Abstract: The lighting device disclosed at an embodiment includes a substrate; a plurality of light sources arranged on the substrate; a resin layer scaling the plurality of light sources; a reflective member disposed between the resin layer and the substrate; and an antenna pattern disposed in a first region between the reflective member and the substrate.Type: GrantFiled: September 16, 2022Date of Patent: February 18, 2025Assignee: LG INNOTEK CO., LTD.Inventors: Kwang Hyun Ko, Moo Ryong Park, Woo Kil Jung, So Yeon Ham
-
Patent number: 12225747Abstract: A quantum dot device including an anode and a cathode, a light emitting layer disposed between the anode and the cathode, the light emitting layer comprising quantum dots, a first hole auxiliary layer disposed on the anode, the first hole auxiliary layer including poly(3,4-ethylenedioxythiophene)-polystyrenesulfonate or a derivative thereof (PEDOT:PSS), a second hole auxiliary layer disposed on the first hole auxiliary layer and including a hole transport material different from the PEDOT:PSS, wherein the light emitting layer is disposed on the second hole auxiliary layer, wherein the first hole auxiliary layer has a first surface facing the anode and a second surface facing the second hole auxiliary layer, and the second surface includes a surface modification region including a surface modification material having a carboxylic acid group, a phosphonic acid group, a sulfonic acid group, or a salt thereof. An electronic device that includes the quantum dot device.Type: GrantFiled: November 17, 2023Date of Patent: February 11, 2025Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Won Sik Yoon, Ju Hyun Kim, Ha Il Kwon, Kwang Hee Kim, Taehyung Kim, Su Jin Park, Dae Young Chung
-
Publication number: 20250023552Abstract: A wafer-level package module includes a first substrate having a first bulk acoustic wave (BAW) device mounted thereon with a first aluminum nitride piezoelectric layer. The wafer-level package module further includes a second substrate having a second BAW device mounted thereon with a second aluminum nitride piezoelectric layer. The first BAW device has a electromechanical coupling coefficient (kt2) different from the second BAW device.Type: ApplicationFiled: July 11, 2024Publication date: January 16, 2025Inventors: Kwang Jae Shin, Alexandre Augusto Shirakawa, Yiliu Wang, Tetsuya Tsurunari, Myung Hyun Park, Nobufumi Matsuo
-
Patent number: 11830641Abstract: A chip resistor component, includes: a substrate having one surface, and one side surface and the other side surface facing each other in one direction; an terminal including an internal electrode disposed on the one surface, and an external electrode disposed on the one side surface to be connected to the internal electrode; a resistive layer disposed on the one surface, and including an outermost pattern connected to the internal electrode; and a protective layer disposed on the one surface to cover the resistive layer. The outermost pattern of the resistive layer has a first region in contact with the internal electrode and a second region extending, in the one direction, from the first region towards the other side surface. A ratio of a length of the second region in the one direction to a length of the chip resistor component in the one direction is 0.02 or more.Type: GrantFiled: December 8, 2021Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ah Ra Cho, Kwang Hyun Park
-
Publication number: 20220270790Abstract: A chip resistor component, includes: a substrate having one surface, and one side surface and the other side surface facing each other in one direction; an terminal including an internal electrode disposed on the one surface, and an external electrode disposed on the one side surface to be connected to the internal electrode; a resistive layer disposed on the one surface, and including an outermost pattern connected to the internal electrode; and a protective layer disposed on the one surface to cover the resistive layer. The outermost pattern of the resistive layer has a first region in contact with the internal electrode and a second region extending, in the one direction, from the first region towards the other side surface. A ratio of a length of the second region in the one direction to a length of the chip resistor component in the one direction is 0.02 or more.Type: ApplicationFiled: December 8, 2021Publication date: August 25, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ah Ra Cho, Kwang Hyun Park
-
Patent number: 11315708Abstract: A chip resistor includes: an insulating substrate; a resistor portion disposed on one surface of the insulating substrate and including a plurality of resistor bodies spaced apart from each other and a plurality of internal electrodes connecting the plurality of resistor bodies to each other; and a first external electrode and a second external electrode disposed on the one surface of the insulating substrate to be spaced apart from each other and respectively connected to the resistor portion, wherein each of the plurality of resistor bodies has a first end adjacent to the first external electrode and a second end opposing the first end and adjacent to the second external electrode, and each of the first end and the second end of each of the plurality of resistor bodies is connected to one of the plurality of internal electrodes, the first external electrode, or the second external electrode.Type: GrantFiled: February 23, 2021Date of Patent: April 26, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Hyun Park, Ah Ra Cho
-
Patent number: 11139091Abstract: A resistor component includes an insulating substrate, a resistor layer disposed on one surface of the insulating substrate and having one end and the other end opposing each other in a first direction, and first and second terminals disposed on the insulating substrate and spaced apart from each other to oppose each other in a second direction perpendicular to the first direction, and connected to the resistor layer. A slit in the resistor layer extends in the first direction, and a ratio of a length of the slit in the first direction to a length of the resistor layer in the first direction is greater than 0.7 and equal to or lower than 0.9.Type: GrantFiled: June 22, 2020Date of Patent: October 5, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ah Ra Cho, Ji Sook Yoon, Kwang Hyun Park
-
Patent number: 11094436Abstract: A resistor component includes an insulating substrate; a resistance layer disposed on one surface of the insulating substrate; and first and second terminals disposed on the insulating substrate to be spaced apart from each other and connected to the resistance layer, wherein each the first and second terminals comprises an inner electrode layer disposed on the resistance layer, and a via electrode penetrating the resistance layer to be in contact with the one surface of the insulating substrate and the inner electrode layer.Type: GrantFiled: June 2, 2020Date of Patent: August 17, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Sook Yoon, Kwang Hyun Park