Abstract: An automatic focus control apparatus includes a light detector, which receives light reflected by a surface of a wafer and generates a light reception signal based on the received signal, a controller, which generates a driving signal, the driving signal being one of a first signal and a second signal, the driving signal indicating whether to perform automatic focus control based on the light reception signal, a focus error corrector, which generates a focus error correction signal based on the driving signal, and a stage driver, which displaces a wafer stage supporting the wafer by adjusting the z-axis position of the wafer stage based on the focus error correcting signal if the driving signal is the first signal, and maintains the z-axis position of the wafer stage based on the focus error correction signal if the driving signal is the second signal.

Abstract: An automatic focus control apparatus includes a light detector, which receives light reflected by a surface of a wafer and generates a light reception signal based on the received signal, a controller, which generates a driving signal, the driving signal being one of a first signal and a second signal, the driving signal indicating whether to perform automatic focus control based on the light reception signal, a focus error corrector, which generates a focus error correction signal based on the driving signal, and a stage driver, which displaces a wafer stage supporting the wafer by adjusting the z-axis position of the wafer stage based on the focus error correcting signal if the driving signal is the first signal, and maintains the z-axis position of the wafer stage based on the focus error correction signal if the driving signal is the second signal.

Abstract: For an automatic defect inspection of an edge exposure area of a wafer, an optical unit supplies a light beam onto the edge portion of a wafer and a detection unit detects light reflected from the edge portion. The detection unit converts the detected light into an electrical signal to transmit the electrical signal to a processing unit. The processing unit analyzes the electrical signal to measure the reflectivity of the edge portion, compares the measured reflectivity with a reference reflectivity, and calculates the width of the edge exposure area. The processing unit compares the calculated width with a reference width to detect any defect in the edge exposure area.

Abstract: A system and method of measuring a distance of semiconductor patterns is provided. The system includes a microscope and a control unit. The control unit calculates standard coordinates of standard points in view-fields that include spots, spot coordinates of spots with respect to standard points, real coordinates of spots from both of the standard coordinates and spot coordinates, and finally the distance between the two spots from the first and second real coordinates. Coordinates are determined using high magnification, in conjunction with pixel counting, allowing more precise distance measurements.

Abstract: A system and method of measuring a distance of semiconductor patterns is provided. The system includes a microscope and a control unit. The control unit calculates standard coordinates of standard points in view-fields that include spots, spot coordinates of spots with respect to standard points, real coordinates of spots from both of the standard coordinates and spot coordinates, and finally the distance between the two spots from the first and second real coordinates. Coordinates are determined using high magnification, in conjunction with pixel counting, allowing more precise distance measurements.

Abstract: For an automatic defect inspection of an edge exposure area of a wafer, an optical unit supplies a light beam onto the edge portion of a wafer and a detection unit detects light reflected from the edge portion. The detection unit converts the detected light into an electrical signal to transmit the electrical signal to a processing unit. The processing unit analyzes the electrical signal to measure the reflectivity of the edge portion, compares the measured reflectivity with a reference reflectivity, and calculates the width of the edge exposure area. The processing unit compares the calculated width with a reference width to detect any defect in the edge exposure area.

Abstract: A method of reconstructing a tomogram of an X-ray apparatus. The tomogram reconstructing method includes obtaining model information and a transmission image of a subject. A tomogram is reconstructed from the transmission image using the model information. The reconstructed tomogram obtained is then displayed.

Abstract: A method of reconstructing a tomogram of an X-ray apparatus. The tomogram reconstructing method includes obtaining model information and a transmission image of a subject. A tomogram is reconstructed from the transmission image using the model information. The reconstructed tomogram obtained is then displayed.

Abstract: Disclosed herein is a battery inspection system. The battery inspection system includes a battery feeding conveyor for feeding batteries to be inspected. One or more transfer robots are positioned near the rear end of the battery feeding conveyor for transferring batteries fed through the battery feeding conveyor to inspection and discharge positions. An X-ray generator is positioned under the transfer robots for applying X-rays to batteries transferred by the transfer robots. A satisfactory battery discharging conveyor is positioned near the transfer robots for discharging satisfactory battery moved by the transfer robots and having been inspected. A defective battery discharging robot is positioned near the front end of the satisfactory battery discharging conveyor for removing defective batteries from batteries moving along the satisfactory battery discharging conveyor and having been inspected.

Abstract: Disclosed herein is a battery inspection system. The battery inspection system includes a battery feeding conveyor for feeding batteries to be inspected. One or more transfer robots are positioned near the rear end of the battery feeding conveyor for transferring batteries fed through the battery feeding conveyor to inspection and discharge positions. An X-ray generator is positioned under the transfer robots for applying X-rays to batteries transferred by the transfer robots. A satisfactory battery discharging conveyor is positioned near the transfer robots for discharging satisfactory battery moved by the transfer robots and having been inspected. A defective battery discharging robot is positioned near the front end of the satisfactory battery discharging conveyor for removing defective batteries from batteries moving along the satisfactory battery discharging conveyor and having been inspected.

Abstract: Disclosed herein is a three-dimensional image constructing method using an X-ray apparatus. In the three-dimensional image constructing method, a construction space of a subject and information for the construction space are set. Thereafter, a plurality of transmission images of the subject are obtained. The data of the construction space are calculated on the basis of the information for the construction space set at the setting step and the transmission images obtained at the image obtaining step. The construction space is constructed on the basis of the data calculated at the image processing step.