Abstract: A substrate processing apparatus includes a processing chamber having a processing space in which a substrate is plasma-processed, and having a transparent window; a gas flow unit supplying and discharging process gas to the processing chamber; and a laser irradiator irradiating a laser for heating the substrate to be selectively atomic layer-processed for each of a plurality of thin films formed on the substrate through the transparent window from an external space of the processing chamber.

Abstract: A substrate processing apparatus includes a processing chamber having a processing space in which a substrate is plasma-processed, and having a transparent window; a gas flow unit supplying and discharging process gas to the processing chamber; and a laser irradiator irradiating a laser for heating the substrate to be selectively atomic layer-processed for each of a plurality of thin films formed on the substrate through the transparent window from an external space of the processing chamber.

Abstract: Provided is a substrate processing module including a plurality of substrate processing apparatuses each including a process chamber having a processing space therein, a support unit for supporting a substrate in the processing space, a gas supply unit for supplying a process gas into the processing space, a plasma source for forming plasma from the process gas supplied into the processing space, and a laser unit for heating the substrate by irradiating a laser beam onto the substrate, wherein the substrate processing module further includes a laser beam generator for generating a laser beam, and a laser beam distribution unit for receiving the laser beam from the laser beam generator and distributing the laser beam to the laser units of the plurality of substrate processing apparatuses at time intervals.

Abstract: A substrate treating apparatus includes a process chamber having a processing space in which a substrate is plasma-treated and a laser irradiation unit irradiating the substrate with a plurality of lasers having different pulse widths to heat the substrate to reach a temperature at which the substrate is plasma-treated.

Abstract: A dry-type cleaning apparatus for wafers for dry cleaning of organic residues on a wafer surface includes a laser emitting laser light, an optical collimator receiving the laser light emitted from the laser and generating a first collimated laser light, an energy spreader uniformizing an energy distribution of the first collimated light received from the optical collimator, and a beam expander adjusting a diameter of the first collimated laser light passing through the energy spreader according to a diameter of a wafer to generate second laser light.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a treating space; a substrate support unit provided in the treating space; a window provided at a top of the chamber; and an optical module provided over the window and configured to transmit a laser beam to a substrate through the window, and wherein the optical module includes: a homogenizing optics configured to homogenize the laser beam to a uniform beam profile; and an imaging optics configured to control the size of the laser beam.

Abstract: The inventive concept provides an edge exposure apparatus for performing an edge exposing process by irradiating a light at an edge region of a substrate. The edge exposure apparatus includes a support unit configured to support the substrate; a light irradiation unit having a light source for irradiating the light on the substrate; and a control unit configured to control an output of the light source, and wherein the control unit comprises: a measurement unit configured to measure illuminance values according to the outputs of the light source; and an output control unit configured to set a reference illuminance value among the measured illuminance values by the measurement unit and to control the output of the light source based on the set reference illuminance value.

Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating method includes removing a portion of the thin film by irradiating a laser to the substrate, and after the removing of the portion of the thin film, removing the remaining portion of the thin film by supplying a chemical to the substrate.

Abstract: A filter plate usable with an ink jet head, an ink jet head with the filter plate, and a method of fabricating the filter plate are provided. The filter plate includes a filter substrate having a filter hole region. Filter holes having angled line shapes extend through the filter substrate of the filter hole region. Each of the filter holes may include an upper filter hole formed to have a first angle with respect to the filter substrate at an upper portion of the filter substrate, and a lower filter hole formed at a lower portion of the filter substrate to be connected to the upper filter hole and having a second angle with respect to the filter substrate different from the first angle.

Abstract: An ink jet head having a channel damper, and a method of fabricating the same. The ink jet head includes a heat-generating resistor disposed on a substrate to generate pressure for ink ejection, a chamber layer disposed on the substrate to enclose the heat-generating resistor and having a first height from the substrate in order to provide at least one opened portion, and a channel damper disposed at the opened portion to completely enclose the heat-generating resistor together with the chamber layer and having a second height lower than the first height is disposed at the opened portion. A nozzle layer having a nozzle corresponding to the heat-generating resistor is disposed to be in contact with an upper surface of the chamber layer.

Abstract: An inkjet print head including a chamber layer provided with an ink via, at least one ink chamber having a heater, and at least one ink channel connecting the ink via and the ink chamber; and a nozzle layer provided with at least one nozzle at a position corresponding to the ink chamber. The ink channel is provided with a multi-functional structure. The multi-functional structure performs functions of a filter and a restrictor.

Abstract: An inkjet printer head includes a substrate having a manifold and an ink channel to supply ink, a nozzle plate formed on the substrate, a chamber formed between the substrate and the nozzle plate and extending toward the substrate and the nozzle plate, an electrode formed at an interface between the substrate and the nozzle plate and around the chamber, and a heater having both ends extending in contact with the electrode to be suspended on the chamber in direct contact with the ink and to generate bubbles from both surfaces thereof. The inkjet printer head is capable of improving manufacturing process efficiency by omitting a process of separately forming a heater passivation layer, operating the heater at low electric power by omitting the heater passivation layer, improving integrity of a nozzle by lowering a working voltage, and improving reliability in manufacturing processes by locating the suspended heater to be in parallel with the substrate and the electrode.

Abstract: A filter plate usable with an ink jet head, an ink jet head with the filter plate, and a method of fabricating the filter plate are provided. The filter plate includes a filter substrate having a filter hole region. Filter holes having angled line shapes extend through the filter substrate of the filter hole region. Each of the filter holes may include an upper filter hole formed to have a first angle with respect to the filter substrate at an upper portion of the filter substrate, and a lower filter hole formed at a lower portion of the filter substrate to be connected to the upper filter hole and having a second angle with respect to the filter substrate different from the first angle.

Abstract: An inkjet printer head and method of fabricating the same includes a substrate having an ink-feed hole formed at a bottom surface of the substrate, a lower chamber formed at a top surface of the substrate, and a restrictor to fluid communicate between the ink-feed hole and the lower chamber, an oxide layer formed on the substrate, a heater formed on the oxide layer and disposed parallel to the surface of the substrate to cross the lower chamber, a lead electrically connected to the heater, and a nozzle layer disposed on the heater to configure an ink channel together with the lower chamber and having a nozzle at an upper portion of the nozzle layer. The inkjet printer head is capable of improving a thermal efficiency by heating the ink using both surfaces of the heater since the heater is disposed at a center of the ink chamber, and improving characteristics of the heater by making a current density and a current flow uniform since the heater is formed in a straight line without any bent or curved portion.

Abstract: An inkjet printer head includes a substrate having an ink-feed hole to supply ink stored in a cartridge to an ink chamber and a restrictor in fluid communication with the ink chamber, an oxide layer formed on the substrate, a heater disposed on the oxide layer above the restrictor and having fixed parts disposed on the oxide layer, slopes extending upward and away from the restrictor at an incline, and a parallel part extending between the slopes parallel to the substrate, a lead formed to be in electrical contact with the heater, a chamber layer formed to cover the lead and to define the ink chamber, and a nozzle layer formed on the chamber layer and having a nozzle. In the inkjet printer head, the lifespan of the heater may be extended since the heater is supported by the slopes, which function as a shock absorbing member when ink supply pressure or cavitation force is applied to a surface of the heater.

Abstract: An inkjet print head with a high efficiency heater includes a substrate having an ink-feed hole extending therethrough to receive ink stored in a cartridge, a flow path layer to define an ink chamber in fluid communication with the ink-feed hole, a nozzle plate having a nozzle to discharge the ink from the ink chamber to an exterior, a heater located adjacent to an inner wall of the ink chamber and disposed in contact with the ink in the ink chamber, and a lead electrically connected to the heater. The heater increases thermal efficiency and maintains a stable structure. In addition, since the heater is disposed adjacent to the inner wall of the ink chamber, the heater is barely affected by the ink supply pressure or the cavitation force that results from ink bubbles shrinking.

Abstract: An ink jet head having a filtering member integrally formed with a substrate and method of fabricating the same are provided. The ink jet head includes a plurality of pressure-generating elements disposed on a substrate to generate pressure to provide ink ejection. An ink-feed passage extending through the substrate is disposed to be spaced apart from the pressure-generating elements. A manifold recessed from a top surface of the substrate by a predetermined depth and having a width defined by the ink-feed passage is disposed between the pressure-generating elements and the ink-feed passage. A plurality of filtering pillars is disposed on a bottom surface of the manifold to provide filter openings therebetween. The filtering pillars are integrally formed with the substrate.

Abstract: An ink jet head having a channel damper, and a method of fabricating the same. The ink jet head includes a heat-generating resistor disposed on a substrate to generate pressure for ink ejection, a chamber layer disposed on the substrate to enclose the heat-generating resistor and having a first height from the substrate in order to provide at least one opened portion, and a channel damper disposed at the opened portion to completely enclose the heat-generating resistor together with the chamber layer and having a second height lower than the first height is disposed at the opened portion. A nozzle layer having a nozzle corresponding to the heat-generating resistor is disposed to be in contact with an upper surface of the chamber layer.

Abstract: An inkjet print head including a chamber layer provided with an ink via, at least one ink chamber having a heater, and at least one ink channel connecting the ink via and the ink chamber; and a nozzle layer provided with at least one nozzle at a position corresponding to the ink chamber. The ink channel is provided with a multi-functional structure. The multi-functional structure performs functions of a filter and a restrictor.

Abstract: A method of fabricating an ink-jet print head includes at least one process of forming an ink feeding port. The ink feeding port forming process comprises fixing a wafer to a stage in a chamber, and processing the ink feeding port to a desired depth in the wafer using a liquid-jet guided laser. In addition, the method of fabricating the ink-jet print head includes a process of dicing a wafer in order to cut the wafer in the form of chips. The wafer dicing process comprises fixing the wafer to a stage in a chamber, and dicing the wafer using a liquid-jet guided laser. According to the present invention, the liquid-jet guided laser that combines laser and a micro liquid-jet is used when forming an ink-feeding port of a print head and/or when dicing the wafer formed with a plurality of print heads, whereby it is possible to achieve effects that a thermal damage of the print heads can be prevented, process costs can be saved, and a process time can be reduced.