Patents by Inventor Kwangsic CHOI

Kwangsic CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230098815
    Abstract: A camera module includes: a printed circuit board having a conductive pad exposed on one surface of the printed circuit board, an image sensor disposed on the printed circuit board, a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad, an actuator disposed above the image sensor and configured to adjust a position of a lens assembly, and a shield can surrounding the actuator and electrically connected to the conductive plate. The conductive plate is configured to emit heat generated from the image sensor to the outside of the camera module by contact with the image sensor.
    Type: Application
    Filed: August 2, 2022
    Publication date: March 30, 2023
    Inventors: Minki CHO, Jungsoo KIM, Dohyun AHN, Wonchul CHO, Taeyun KIM, Wonjun JEONG, Kwangsic CHOI, Chonguk HEO
  • Patent number: 11363712
    Abstract: A flexible printed circuit board that includes a signal transmission part that is disposed in a first direction and that includes a signal line that transmits an electrical signal and a ground part disposed in a second direction. The ground part includes a conductive adhesive layer disposed in the first direction and the conductive adhesive layer includes a plurality of conductive balls having electrical conductivity. Various other embodiments are disclosed in the specification.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: June 14, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Manho Kim, Keonyoung Seo, Jongwan Shim, Kwangsic Choi, Jaemin Ryoo, Hwajoong Jung, Kihuk Lee
  • Publication number: 20200329557
    Abstract: A flexible printed circuit board that includes a signal transmission part that is disposed in a first direction and that includes a signal line that transmits an electrical signal and a ground part disposed in a second direction. The ground part includes a conductive adhesive layer disposed in the first direction and the conductive adhesive layer includes a plurality of conductive balls having electrical conductivity. Various other embodiments are disclosed in the specification.
    Type: Application
    Filed: April 9, 2020
    Publication date: October 15, 2020
    Inventors: Manho KIM, Keonyoung SEO, Jongwan SHIM, Kwangsic CHOI, Jaemin RYOO, Hwajoong JUNG, Kihuk LEE