Abstract: A display device and a backlight unit are provided. A display device including a first side on which a light source is disposed to face the first side, the display device includes an optical member including a light guide plate, a light source assembly disposed adjacent to the first side of the optical member, a lower accommodation container accommodating the light source assembly and the optical member, a backlight unit disposed on the lower accommodation container and including a middle accommodation container including a central opening; and a display panel disposed on the backlight unit and the middle accommodation container, wherein the middle accommodation container includes a middle chassis located at the first side, and a middle mold fastened to the middle chassis and disposed along at least one side of the display device other than the first side, and the middle chassis is formed of a material having a greater heat conductivity than the middle mold.

Abstract: A backlight unit includes a light guide plate (LGP), a housing that receives the LGP, and a first LGP guide member coupled to the housing. The housing includes a bottom surface, a first sidewall, and a second sidewall. The first and second sidewalls are connected to edges of the bottom surface, are disposed adjacent to each other, and are spaced apart from each other. A first corner of the bottom surface is disposed between the first and second sidewalls, and the first LGP guide member is disposed in a gap between the first and second sidewalls.

Abstract: A backlight unit includes a light guide plate (LGP), a housing that receives the LGP, and a first LGP guide member coupled to the housing. The housing includes a bottom surface, a first sidewall, and a second sidewall. The first and second sidewalls are connected to edges of the bottom surface, are disposed adjacent to each other, and are spaced apart from each other. A first corner of the bottom surface is disposed between the first and second sidewalls, and the first LGP guide member is disposed in a gap between the first and second sidewalls.

Abstract: Disclosed herein is a method for manufacturing a printed circuit board, wherein a protective film for stripping and a metal layer closely adhered to the protective film for stripping are formed on an inner layer pad to protect the inner layer pad at the time of laser processing related to cavity processing and applying an etchant, thereby making it possible to improve reliability of a product.

Abstract: Disclosed herein is a method for manufacturing a printed circuit board, wherein a protective film for stripping and a metal layer closely adhered to the protective film for stripping are formed on an inner layer pad to protect the inner layer pad at the time of laser processing related to cavity processing and applying an etchant, thereby making it possible to improve reliability of a product.