Patents by Inventor Kwansoo Yun
Kwansoo Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8526721Abstract: A method of processing image data, to obtain image data for printing a junction area connecting a circular pad having a radius R with a linear line pattern by forming ink blots having a radius r in an overlapping manner, includes: setting a base pitch P as a base distance between adjacent ink blots; arranging image data of the pad, line pattern, and junction area, which is defined by an extension of the line pattern, in an x-y coordinate system; selecting a first determination point, which corresponds to one side of the junction area; comparing a distance from a center of the pad to the first determination point with a value of (R?r+P); and storing coordinates of the first determination point as print data if the distance from the center of the pad to the first determination point is greater than or equal to the value of (R?r+P).Type: GrantFiled: June 25, 2009Date of Patent: September 3, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Kwansoo Yun, Joshi Akshay, Sangdo Cho, Yongsik Kim, Jaewoo Joung
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Patent number: 8351070Abstract: A method of obtaining image data for printing a circular pad having a radius R by forming ink blots having a radius r in an overlapping manner. The method can include: setting a base pitch as the base distance between adjacent ink blots, arranging the vector data of the pad in an x-y coordinate system, setting a first base point in the coordinate system, selecting a first determination point that is separated from the first base point by a unit distance along each of the x-axis and y-axis in any one direction of 45 degrees and 135 degrees, comparing the distance from the first base point to the first determination point with the base pitch, and storing the coordinates of the first determination point as print data if the distance from the first base point to the first determination point is greater than or equal to the base pitch.Type: GrantFiled: January 13, 2009Date of Patent: January 8, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Kwansoo Yun, Prasad Jvv, Jaewoo Joung, Shanghoon Seo, Sangdo Cho
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Patent number: 8191980Abstract: A method of processing image data is disclosed. According to an embodiment of the present invention, the method, which obtains image data for printing the edge of a circular pad having a radius of R by forming ink blots having a radius of r in an overlapping manner, includes: setting a permissible pitch range as a distance between adjacent ink blots; arranging first image data to the edge of the pad, in an x-y coordinate system; generating second image data with a smaller radius than the first image data, the second image data sharing the center with the first image data; arranging a first base point on the second image data; selecting the first determination point on the second image data separated from the first base point; determining if a distance between the first base point and the first determination point is within the permissible pitch range; and storing a coordinate, located at a shortest distance from the first determination point, as print data.Type: GrantFiled: April 9, 2009Date of Patent: June 5, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Kwansoo Yun, Shashank Goel, Sangdo Cho, Jaewoo Joung
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Publication number: 20120075643Abstract: Provided is a method of revising a printing error in a PCB, including acquiring alignment mark coordinates and recognition mark coordinates formed at corners of each sheet through design specification information of the PCB, acquiring distorted alignment mark coordinates and recognition mark coordinates of each sheet through actually measured information of the PCB, calculating coordinate information acquired from the design specification information of the PCB and coordinate information acquired from the actually measured information of the PCB to acquire a revision coefficient, calculating an actual deformation value of the PCB using the revision coefficient, and converting the actual deformation value into deformation data of a binary image applied to the design specification information to be revised, and performing a printing operation on the PCB using the deformation data as a reference.Type: ApplicationFiled: September 20, 2011Publication date: March 29, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwansoo Yun, Dongik Joo, Yunbae Kim, Yongsik Kim, Sangdo Cho
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Publication number: 20100002031Abstract: A method of processing image data is disclosed. According to an embodiment of the present invention, the method, which obtains image data for printing the edge of a circular pad having a radius of R by forming ink blots having a radius of r in an overlapping manner, includes: setting a permissible pitch range as a distance between adjacent ink blots; arranging first image data to the edge of the pad, in an x-y coordinate system; generating second image data with a smaller radius than the first image data, the second image data sharing the center with the first image data; arranging a first base point on the second image data; selecting the first determination point on the second image data separated from the first base point; determining if a distance between the first base point and the first determination point is within the permissible pitch range; and storing a coordinate, located at a shortest distance from the first determination point, as print data.Type: ApplicationFiled: April 9, 2009Publication date: January 7, 2010Inventors: Kwansoo Yun, Shashank Goel, Sangdo Cho, Jaewoo Joung
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Publication number: 20100002931Abstract: A method of processing image data, to obtain image data for printing a junction area connecting a circular pad having a radius R with a linear line pattern by forming ink blots having a radius r in an overlapping manner, includes: setting a base pitch P as a base distance between adjacent ink blots; arranging image data of the pad, line pattern, and junction area, which is defined by an extension of the line pattern, in an x-y coordinate system; selecting a first determination point, which corresponds to one side of the junction area; comparing a distance from a center of the pad to the first determination point with a value of (R?r+P); and storing coordinates of the first determination point as print data if the distance from the center of the pad to the first determination point is greater than or equal to the value of (R?r+P).Type: ApplicationFiled: June 25, 2009Publication date: January 7, 2010Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwansoo Yun, Joshi Akshay, Sangdo Cho, Yongsik Kim, Jaewoo Joung
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Publication number: 20090310155Abstract: A method of obtaining image data for printing a circular pad having a radius R by forming ink blots having a radius r in an overlapping manner. The method can include: setting a base pitch as the base distance between adjacent ink blots, arranging the vector data of the pad in an x-y coordinate system, setting a first base point in the coordinate system, selecting a first determination point that is separated from the first base point by a unit distance along each of the x-axis and y-axis in any one direction of 45 degrees and 135 degrees, comparing the distance from the first base point to the first determination point with the base pitch, and storing the coordinates of the first determination point as print data if the distance from the first base point to the first determination point is greater than or equal to the base pitch.Type: ApplicationFiled: January 13, 2009Publication date: December 17, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwansoo Yun, Prasad Jvv, Jaewoo Joung, Shanghoon Seo, Sangdo Cho
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Publication number: 20090294162Abstract: Disclosed are a printed circuit board and a manufacturing method thereof. The printed circuit board, having an electronic component mounted thereon, in accordance with an embodiment of the present invention includes: a substrate having a circuit pattern and a pad formed on one side thereof; a solder resist layer formed on one side of the substrate so as to expose the pad; and a dam formed on the solder resist layer by an inkjet printing method and disposed at a position corresponding to where the electronic component is mounted so as to control a flow of an underfill solution injected between the substrate and the electronic component.Type: ApplicationFiled: January 12, 2009Publication date: December 3, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyoung-Jin Jeong, Jaewoo Joung, Kwansoo Yun, Rowoon Lee