Patents by Inventor Kwanyong Pak

Kwanyong Pak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220069045
    Abstract: A display apparatus includes a main display area, and a component area including pixel groups spaced apart from each other and a transmission area between the pixel groups. The display apparatus further includes a substrate including a first base layer, a compensation layer, a first barrier layer, and a second barrier layer sequentially stacked on one another, a bottom metal layer between the first barrier layer and the second barrier layer, a buffer layer on the second barrier layer, main display elements on the substrate of the main display area, and auxiliary display elements on the substrate of the component area.
    Type: Application
    Filed: June 24, 2021
    Publication date: March 3, 2022
    Inventors: Kohei Ebisuno, Kwanyong Pak, Youngwon Kim, Jinseok Oh, Jin Jeon, Jingoo Jung, Kyunghyun Choi
  • Patent number: 10535514
    Abstract: Provided are methods of sealing open pores of a surface of a porous dielectric material using an initiated chemical vapor deposition (iCVD) process. In one example method of sealing open pores, since the polymer thin film having a significantly thin thickness may be formed by a solvent-free vapor deposition method without plasma treatment, it is possible to minimize deterioration of characteristics of the dielectric material vulnerable to plasma and a chemical solution.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: January 14, 2020
    Assignees: Korea Advanced Institute of Science and Technology, Lam Research Corporation
    Inventors: Byung Jin Cho, Sung Gap Im, Seong Jun Yoon, Kwanyong Pak, Hyungsuk Alexander Yoon
  • Publication number: 20180277362
    Abstract: Provided are a method of locally sealing only pores present in a surface part of a porous dielectric material by forming a polymer thin film through an initiated chemical vapor deposition (iCVD) method using an initiator, and a method of minimizing an increase in a dielectric constant induced therefrom.
    Type: Application
    Filed: March 16, 2018
    Publication date: September 27, 2018
    Inventors: Byung Jin Cho, Sung Gap Im, Seong Jun Yoon, Kwanyong Pak, Hyungsuk Alexander Yoon
  • Publication number: 20170358488
    Abstract: Provided are methods of sealing open pores of a surface of a porous dielectric material using an initiated chemical vapor deposition (iCVD) process. In one example method of sealing open pores, since the polymer thin film having a significantly thin thickness may be formed by a solvent-free vapor deposition method without plasma treatment, it is possible to minimize deterioration of characteristics of the dielectric material vulnerable to plasma and a chemical solution.
    Type: Application
    Filed: August 25, 2016
    Publication date: December 14, 2017
    Inventors: Byung Jin Cho, Sung Gap Im, Seong Jun Yoon, Kwanyong Pak, Hyungsuk Alexander Yoon