Patents by Inventor Kwi Jong Lee

Kwi Jong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11211193
    Abstract: An electronic component includes a magnetic body including a resin and first magnetic powder and having a recess on a lower surface of the magnetic body, an internal coil portion embedded in the magnetic body, and external electrodes disposed on opposing ends of the magnetic body in a length direction of the magnetic body and connected to ends of the internal coil portion, wherein the first magnetic powder disposed on a surface of the recess may have a cut surface.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: December 28, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Ho Ku, Kwi Jong Lee, Yoon Soo Lee, Won Joong Kim
  • Publication number: 20210202148
    Abstract: A coil component includes a support substrate; a coil portion disposed on the support substrate; a body embedding the support substrate and the coil portion therein, and having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other and respectively connecting the first and second surfaces; lead-out portions extending from the coil portion and respectively exposed from the third and fourth surfaces of the body; a surface-insulating layer disposed on the third and fourth surfaces of the body and having openings respectively exposing the lead-out portions; and external electrodes arranged on the surface-insulating layer and respectively connected to the lead-out portions respectively exposed through the openings, wherein a width of each of the external electrodes is narrower than a width of the body.
    Type: Application
    Filed: June 25, 2020
    Publication date: July 1, 2021
    Inventors: Kwi Jong LEE, Jung Min KIM, Sung Jin HUH, Jin Hyuck YANG, Jae Wook LEE, Ji Hyun EOM
  • Publication number: 20210193373
    Abstract: A coil component includes a support substrate and a coil portion disposed on the support substrate, a body in which the support substrate and the coil portion are embedded, first and second lead portions extending from the coil portion and respectively exposed to a surface of the body, a surface insulating layer disposed on the surface of the body and having openings respectively exposing the first and second lead portions, and first and second external electrodes disposed on the surface insulating layer and connected to the first and second lead portions exposed through the openings. Each of the first and second external electrodes includes a first metal layer formed of a metal and in direct contact with the first and second lead portions.
    Type: Application
    Filed: June 24, 2020
    Publication date: June 24, 2021
    Inventors: Kwi Jong Lee, Jung Min Kim, Young Seuck Yoo, Sung Jin Huh, Jin Hyuck Yang, Tae Hyun Kim
  • Publication number: 20190252113
    Abstract: An electronic component includes a magnetic body including a resin and first magnetic powder and having a recess on a lower surface of the magnetic body, an internal coil portion embedded in the magnetic body, and external electrodes disposed on opposing ends of the magnetic body in a length direction of the magnetic body and connected to ends of the internal coil portion, wherein the first magnetic powder disposed on a surface of the recess may have a cut surface.
    Type: Application
    Filed: July 20, 2018
    Publication date: August 15, 2019
    Inventors: Jin Ho KU, Kwi Jong LEE, Yoon Soo LEE, Won Joong KIM
  • Publication number: 20160189874
    Abstract: An electrode structure for a capacitor, an electrolytic capacitor, and a method of manufacturing the same are provided. An electrode structure for a capacitor includes a polymer film; a thin-film electrode layer disposed on the polymer film; and a metal oxide layer disposed on the thin-film electrode layer.
    Type: Application
    Filed: December 3, 2015
    Publication date: June 30, 2016
    Inventor: Kwi Jong LEE
  • Publication number: 20160141116
    Abstract: There is provided an electronic component including: a ceramic body; internal electrodes formed within the ceramic body; and external electrodes electrically connected to the internal electrodes, formed on external surfaces of the ceramic body, and including a metal powder having nano protrusions formed of an organic metal on a surface of a metal particle.
    Type: Application
    Filed: November 4, 2015
    Publication date: May 19, 2016
    Inventors: Kwi Jong LEE, Sung Il OH
  • Publication number: 20150284412
    Abstract: The copper organic metal is constituted to combine a copper atom, [R—CO2] and amine based ligand (L), thereby making it possible to be subjected to a low temperature sintering process and having an improved conductivity at the time of forming a conductive pattern.
    Type: Application
    Filed: June 19, 2015
    Publication date: October 8, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwi Jong LEE, Ji Han KWON, Dong Hoon KIM
  • Patent number: 9090635
    Abstract: Disclosed herein are a copper organic metal, a method for preparing a copper organic metal and a copper paste. The copper organic metal is constituted to combine a copper atom, [R—CO2] and amine based ligand (L), thereby making it possible to be subjected to a low temperature sintering process and having an improved conductivity at the time of forming a conductive pattern as compared to the related art.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: July 28, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwi Jong Lee, Ji Han Kwon, Dong Hoon Kim
  • Publication number: 20150028983
    Abstract: A magnetic paste composition for a chip electronic component, a chip electronic component, and a manufacturing method therof are provided. The chip electronic component is capable of being manufactured in a thin-film to allow for thinness and miniaturization thereof, thereby preventing a deterioration in efficiency thereof due to core loss even under high frequency and high current conditions. The chip electronic component exhibits high permeability, high efficiency, and a high Isat value by decreasing porosity.
    Type: Application
    Filed: April 25, 2014
    Publication date: January 29, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Han Wool RYU, Gwang Hwan HWANG, Kwi Jong LEE, Hwan Soo LEE, Hang Kyu CHO
  • Publication number: 20140049874
    Abstract: There is provided an electronic component including: a ceramic body; internal electrodes formed within the ceramic body; and external electrodes electrically connected to the internal electrodes, formed on external surfaces of the ceramic body, and including a metal powder having nano protrusions formed of an organic metal on a surface of a metal particle.
    Type: Application
    Filed: December 17, 2012
    Publication date: February 20, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwi Jong LEE, Sung Il OH
  • Publication number: 20140023779
    Abstract: There are provided a conductive copper paste composition and a method of forming a metal thin film using the same, wherein the conductive copper paste composition includes a back bone chain particle formed of copper (Cu) or a copper alloy containing copper (Cu); and an organic copper compound, have excellent electrical characteristics even at the time of low-temperature heat treatment process and suppress an increase in a viscosity depending on the time.
    Type: Application
    Filed: March 15, 2013
    Publication date: January 23, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Il OH, Kwi Jong LEE, Dong Hoon KIM
  • Publication number: 20130280158
    Abstract: There is provided a method of producing a copper precursor and a copper precursor produced by using the same. The method of producing a copper precursor includes: preparing an aqueous solution including a copper salt or a hydrate thereof; preparing a mixture by mixing urea (CO(NH2)2) with the aqueous solution; and synthesizing the copper precursor by heating the mixture at a temperature of 100 to 120° C.
    Type: Application
    Filed: September 14, 2012
    Publication date: October 24, 2013
    Inventors: Ji Han KWON, Kwi Jong Lee, Chang Hoon Kim, Dong Hoon Kim
  • Patent number: 8496873
    Abstract: The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: July 30, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwi-Jong Lee, Hyuck-Mo Lee, Hyun-Joon Song, Yun-Hwan Jo, Ji-Chan Park, Jung-Up Bang, Dong-Hoon Kim
  • Patent number: 8388725
    Abstract: The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.
    Type: Grant
    Filed: August 4, 2010
    Date of Patent: March 5, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young-Il Lee, Jae-Woo Joung, Byung-Ho Jun, Joon-Rak Choi, Kwi-Jong Lee
  • Publication number: 20120272790
    Abstract: The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.
    Type: Application
    Filed: June 13, 2012
    Publication date: November 1, 2012
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwi-Jong Lee, Hyuck-Mo Lee, Hyun-Joon Song, Yun-Hwan Jo, Ji-Chan Park, Jung-Up Bang, Dong-Hoon Kim
  • Patent number: 8187504
    Abstract: Provided is a metal nanoparticle dispersion capable of suppressing spreadability at a room temperature and drying phenomenon at heating temperature. The metal nanoparticle dispersion includes metal particles; and an organic solvent having a viscosity of 10 mPa·s or more at a room temperature and a flash point of 100° C. or above.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: May 29, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Il Lee, Dong Hoon Kim, Kwi Jong Lee
  • Patent number: 8173210
    Abstract: A method for surface modification of non-dispersible metal nanoparticles comprises mixing metal nanoparticles having an amorphous carbon layer on the surface with an alcohol or thiol solvent, mixing a capping molecule having a carboxylic head group in the mixed solution, and separating the metal nanoparticles from the mixed solution and the metal nanoparticles for inkjet printing thus modified.
    Type: Grant
    Filed: October 10, 2007
    Date of Patent: May 8, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: In-Keun Shim, Jae-Woo Joung, Kwi-Jong Lee
  • Patent number: 8158031
    Abstract: It provides a method for preparing metal nanoparticles using a metal seed and metal nanoparticles including the metal seed, the method including: preparing a solution by adding a polymer surfactant in an alcohol solvent; heating the solution; forming a metal seed by adding a first metal salt of at least one metal salt selected from the group consisting of platinum, palladium and iridium in the heated solution; and adding a second metal salt into the solution including the metal seed. This method allows the production of uniform-sized nanoparticles under high concentration conditions in high yield and mass production in which the metal nanoparticles have high dispersion stability so that they are suitable for various application.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: April 17, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwi-Jong Lee, Hyun-Joo Song, Dae-Ha Seo, Jong-Wook Jung, Dong-Hoon Kim
  • Publication number: 20110267738
    Abstract: The present invention relates to a multi-layer ceramic capacitor printed simultaneously with internal electrode and external electrode by employing an inkjet printing. A method for manufacturing the multi-layer ceramic capacitor comprising first external electrode, dielectric, internal electrode and second external electrode prints simultaneously the first external electrode; the internal electrode which is connected with the first external electrode and formed at an invaginated portion of the dielectric invaginated to allow one side to be opened at one portion; and the second external electrode which is formed integrally with the internal electrode by employing an inkjet printing. According to the present invention, a method for manufacturing the multi-layer ceramic capacitor resolves contact problems by printing integrally the internal electrode and the external electrode and reduces the manufacturing process.
    Type: Application
    Filed: July 14, 2011
    Publication date: November 3, 2011
    Applicant: Samsung Electro-Mechanics Co. Ltd
    Inventors: Kwi-Jong LEE, Young-Soo Oh, Jin-Yong Kim
  • Publication number: 20110236646
    Abstract: There are provided an ink composition, a metal thin film prepared using the same, and a method of preparing the same. The ink composition according to the present invention includes: gold-containing complex compound represented by the following Formula 1 (L and L? are at least one selected from a group consisting of diolefin and derivatives thereof, and X is at least one selected from a group consisting of chlorine (Cl), bromine (Br), and iodine (I), where m=an integer of 1˜10, n=an integer of 1˜10, o=an integer of 0˜10, and p=an integer of 0˜10); and a solvent dispersing the gold-containing complex compound. AumLnL?oXp??Formula 1 The present invention can provide ink composition that can be sintered at low temperature by being optionally printed, a metal thin film prepared using the same, and a method of preparing the same.
    Type: Application
    Filed: October 27, 2010
    Publication date: September 29, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Kwan Seo, Kwi Jong Lee, Dong Hoon Kim