Patents by Inventor Kwi-Hong PARK

Kwi-Hong PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080224092
    Abstract: An etchant for a metal is described. In one example, the etchant includes ammonium persulfate ((NH4)2S2O8), an azole compound and water. The etchant does not include hydrogen peroxide. Thus, the etchant may etch a metal layer including copper so that an etched copper layer has a tapered profile. Furthermore, the etchant may have a high stability to maintain etching ability for a longer time. Thus, manufacturing margins may be improved so that manufacturing costs may be reduced.
    Type: Application
    Filed: March 14, 2008
    Publication date: September 18, 2008
    Inventors: Jong-Hyun CHOUNG, Hong-Sick PARK, Sun-Young HONG, Bong-Kyun KIM, Byeong-Jin LEE, Ji-Sun LEE, Ki-Beom LEE, Sam-Young CHO, Byung-Soo KU, Hyun-Cheol SHIN, Kwi-Hong PARK, Won-Guk SEO