Patents by Inventor Kwok Kei WONG

Kwok Kei WONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for bonding substrates to each other
    Patent number: 8905109
    Abstract: An apparatus for bonding at least two substrates to each other comprises a plurality of substrate bonding machines arranged adjacent to one another and an input transporter extending adjacent to the plurality of substrate bonding machines which is operative to deliver the substrates to each of the substrate bonding machines. The input transporter is supplied with substrates by an onloading station. An output transporter extending adjacent to the plurality of substrate bonding machines is operative to receive bonded substrates from each of the substrate bonding machines and deliver the bonded substrates to an offloading station for removal from the apparatus.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: December 9, 2014
    Assignee: ASM Technology Singapore Pte. Ltd.
    Inventors: Man Chung Ng, Wai Lik Chan, Kwok Kei Wong
  • APPARATUS FOR BONDING SUBSTRATES TO EACH OTHER
    Publication number: 20130149839
    Abstract: An apparatus for bonding at least two substrates to each other comprises a plurality of substrate bonding machines arranged adjacent to one another and an input transporter extending adjacent to the plurality of substrate bonding machines which is operative to deliver the substrates to each of the substrate bonding machines. The input transporter is supplied with substrates by an onloading station. An output transporter extending adjacent to the plurality of substrate bonding machines is operative to receive bonded substrates from each of the substrate bonding machines and deliver the bonded substrates to an offloading station for removal from the apparatus.
    Type: Application
    Filed: December 12, 2011
    Publication date: June 13, 2013
    Applicant: ASM TECHNOLOGY SINGAPORE PTE. LTD.
    Inventors: Man Chung NG, Wai Lik CHAN, Kwok Kei WONG