Patents by Inventor Kwok Lam Kwan

Kwok Lam Kwan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a dual-interface IC card and a card formed of such a method
    Patent number: 6881605
    Abstract: There is disclosed a method of forming a card embedded with an integrated circuit (IC) and an antenna coil, which method including the steps of (a) embedding an antenna coil onto a core sheet; (b) laminating the core sheet with a number of outer sheets to form a laminated panel; (c) forming a first cavity in the laminated panel to expose part of the antenna coil; (d) pulling out two ends of the antenna coil from the core sheet; and (e) securing the integrated circuit with the antenna coil, e.g. by soldering or thermo compression bonding.
    Type: Grant
    Filed: January 15, 2002
    Date of Patent: April 19, 2005
    Assignee: Billion Apex Limited
    Inventors: Chi Keung Lee, Kwok Lam Kwan
  • Method of forming a dual-interface IC card and a card formed of such a method
    Publication number: 20030000070
    Abstract: There is disclosed a method of forming a card embedded with an integrated circuit (IC) and an antenna coil, which method including the steps of (a) embedding an antenna coil onto a core sheet; (b) laminating the core sheet with a number of outer sheets to form a laminated panel; (c) forming a first cavity in the laminated panel to expose part of the antenna coil; (d) pulling out two ends of the antenna coil from the core sheet; and (e) securing the integrated circuit with the antenna coil, e.g. by soldering or thermo compression bonding.
    Type: Application
    Filed: January 15, 2002
    Publication date: January 2, 2003
    Inventors: Chi Keung Lee, Kwok Lam Kwan