Patents by Inventor Kwok Wah Li

Kwok Wah Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6274010
    Abstract: An apparatus for electroplating at least one substrate is disclosed as including a trough, two anodes, at least one bath and two poly-tetrafluoroethylene sheets or a number of substantially rigid polypropylene plates, in which the trough supports the substrate and is in an electrically conductive relationship therewith, and the bath contains the anodes, the trough and an electrolyte, in which, in operation, an electric field exists in the electrolyte between the trough and the anodes, and in which the poly-tetrafluoroethylene sheets or the polypropylene plates are movable to vary the amount of electric current passing between the trough and the anodes.
    Type: Grant
    Filed: July 13, 1998
    Date of Patent: August 14, 2001
    Assignee: Process Automation International Limited
    Inventors: Paul Henington, Chun Pan Fung, Kwok Wah Li, Chi Chung Lee
  • Patent number: 6251234
    Abstract: An electroplating machine is disclosed as including an electrode positioning apparatus, an electrolyte delivery apparatus, an apparatus for covering a roller, an apparatus for dissolving copper oxide powder in an electrolyte passing through the apparatus, and an apparatus allowing the variation of the distance between two rollers. The electrode positioning apparatus has a first open end and a second end joined by two sets of connecting members, in which the connecting members in each set are parallel to one another and equally spaced from the adjacent member. The electrolyte delivery apparatus includes a pipe connected to a source of electrolyte and a nozzle through which the electrolyte is deliverable to an electrode mounted on the electrode positioning apparatus. The covering apparatus is elongate in shape and includes a cavity for accommodating a majority part of the outside surface of a roller.
    Type: Grant
    Filed: November 8, 1999
    Date of Patent: June 26, 2001
    Assignees: Process Automation International, Ltd., Shipley Company, LLC
    Inventors: Paul Henington, Kwok Wah Li, Kwok Wing Ng, Chi Chung Lee, Pin Chun Huang, Fang Hao Lee, Marlin Vance Marsh, Carl John Colangelo
  • Patent number: 6174417
    Abstract: An electroplating machine is disclosed as including an electrode positioning apparatus, an electrolyte delivery apparatus, an apparatus for covering a roller, an apparatus for dissolving copper oxide powder in an electrolyte passing through the apparatus, and an apparatus allowing the variation of the distance between two rollers. The electrode positioning apparatus has a first open end and a second end joined by two sets of connecting members, in which the connecting members in each set are parallel to one another and equally spaced from the adjacent member. The electrolyte delivery apparatus includes a pipe connected to a source of electrolyte and a nozzle through which the electrolyte is deliverable to an electrode mounted on the electrode positioning apparatus. The nozzle includes an elongate gap and the electrolyte exits the nozzle continuously along the entire length of the elongate gap. The electrode positioning and the electrolyte delivery apparatus are slidably engageable with each other.
    Type: Grant
    Filed: August 28, 1998
    Date of Patent: January 16, 2001
    Assignees: Process Automation International Ltd., Shipley Company, L.L.C.
    Inventors: Paul Henington, Kwok Wah Li, Kwok Wing Ng, Chi Chung Lee, Pin Chun Huang, Fang Hao Lee, Marlin Vance Marsh, Carl John Colangelo