Patents by Inventor Kwok Wah TONG

Kwok Wah TONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die bonding tool and system
    Patent number: 10096568
    Abstract: Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: October 9, 2018
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Kwok Yuen Cheung, Kwok Wah Tong, Jin Hui Meng, Wan Yin Yau, Man Kit Chow
  • DIE BONDING TOOL AND SYSTEM
    Publication number: 20160086830
    Abstract: Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.
    Type: Application
    Filed: September 18, 2014
    Publication date: March 24, 2016
    Inventors: Kwok Yuen CHEUNG, Kwok Wah TONG, Jin Hui MENG, Wan Yin YAU, Man Kit CHOW