Patents by Inventor Kwon Chil

Kwon Chil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10340263
    Abstract: An integrated circuit includes a plurality of power rail pairs and a circuit chain. Each of the plurality of power rail pairs includes one of a plurality of high power rails configured to provide a first power supply voltage and one of a plurality of low power rails configured to provide a second power supply voltage that is lower than the first power supply voltage. The circuit chain includes a plurality of unit circuits that are cascade-connected such that an output of a previous unit circuit is provided as an input of a next unit circuit. The plurality of unit circuits are connected distributively to the plurality of power rail pairs.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: July 2, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyo Sig Won, Chan Uk Shin, Kwang Ok Jeong, Kwon Chil Kang
  • Publication number: 20180166432
    Abstract: An integrated circuit includes a plurality of power rail pairs and a circuit chain. Each of the plurality of power rail pairs includes one of a plurality of high power rails configured to provide a first power supply voltage and one of a plurality of low power rails configured to provide a second power supply voltage that is lower than the first power supply voltage. The circuit chain includes a plurality of unit circuits that are cascade-connected such that an output of a previous unit circuit is provided as an input of a next unit circuit. The plurality of unit circuits are connected distributively to the plurality of power rail pairs.
    Type: Application
    Filed: September 28, 2017
    Publication date: June 14, 2018
    Inventors: HYO SIG WON, CHAN UK SHIN, KWANG OK JEONG, KWON CHIL KANG
  • Publication number: 20050050772
    Abstract: An improved expandable shoe and inner assembly are disclosed. The expandable shoe includes an outer shell and an adjustable inner assembly is disposed within the outer shell. The inner assembly has a first board portion and a second board portion in overlapping engagement with each other and a control to adjust the position of the first board portion relative to the second board portion. A lighted visualization window provides a visualization window to the inner assembly. The inner assembly may include size markings through the visualization window so that a size of the adjusted shoe may be determined as shoe size is adjusted.
    Type: Application
    Filed: May 14, 2004
    Publication date: March 10, 2005
    Inventors: Harry Miller, Byong Shin, Kwon Chil