Abstract: A method of producing optical modules comprising transferring liquid polymer to a lens mold array by dipping an array of fingers of a transfer device into a liquid polymer, bringing the array of fingers into proximity with recesses of the lens mold array so that the liquid polymer is received in the recesses, then separating the array of fingers and the lens mold array so that liquid polymer is retained in the recesses, and forming lenses on optical devices by bringing the lens mold array into proximity with the array of optical devices so that the liquid polymer contacts a surface of the optical devices, and curing the liquid polymer to form the lenses on the optical devices.

Abstract: A method of fabricating one or more optoelectronic devices each comprising at least one passive optical component. The method comprises providing a first carrier, depositing a soluble adhesive onto a surface of the first carrier, and placing a plurality of integrated circuit devices onto said surface and curing the soluble adhesive to fix the integrated circuit devices to the carrier.

Abstract: An integrated circuit substrate via system, and method of manufacture therefor, includes: a substrate having a substrate via in the substrate; a buffer layer patterned over the substrate via, the buffer layer having a planar surface; and a substrate via cap patterned over the buffer layer, the substrate via cap having a planar surface based on the planar surface of the buffer layer.

Abstract: An integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is over the substrate. A second metallurgy layer is over the first metallurgy layer. A protective layer is over the first contact pad.

Abstract: An integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is over the substrate. A second metallurgy layer is over the first metallurgy layer. A protective layer is over the first contact pad.

Abstract: A method for manufacturing an integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is formed over the substrate. A second metallurgy layer is formed over the first metallurgy layer. The first metallurgy layer is removed while leaving a portion thereof over the second contact pad. The second metallurgy layer is removed while leaving a portion thereof over the second contact pad. A protective layer is formed over the first contact pad while removing the first metallurgy layer.