Abstract: A method and apparatus for detecting capacitive devices are disclosed. A circuit including two circuit paths is connected to an oscillator voltage source. Connecting a test capacitive device to a path of the circuit modifies the electric potential waveform at a point along the path. Passing the first circuit path through a reference comparator and the second circuit path through a phase-shifting comparator produces two output signals that are phase-shifted with respect to each other when the test capacitive device is functional. Analysis of the output signals allows detection or measurement of the test capacitive device.

Abstract: A method and apparatus for detecting capacitive devices are disclosed. A circuit including two circuit paths is connected to an oscillator voltage source. Connecting a test capacitive device to a path of the circuit modifies the electric potential waveform at a point along the path. Passing the first circuit path through a reference comparator and the second circuit path through a phase-shifting comparator produces two output signals that are phase-shifted with respect to each other when the test capacitive device is functional. Analysis of the output signals allows detection or measurement of the test capacitive device.

Abstract: An apparatus and associated method for testing an integrated circuit for electrical over stress includes a spike source configured to couple to an input of the integrated circuit, and responsively provide a signal spike to the input, and a current sensor configured to couple to a power supply. The power supply is coupled to the integrated circuit to provide power to the integrated circuit. The current sensor provides a sensor output related to the current supply to the integrated circuit from the power supply. The apparatus also includes test circuitry coupled to the sensor output configured to provide a failure output in response to a characteristic increase in power supply current sensed by the current sensor in response to an applied signal spike.

Abstract: An apparatus and associated method for testing an integrated circuit for electrical over stress includes a spike source configured to couple to an input of the integrated circuit, and responsively provide a signal spike to the input, and a current sensor configured to couple to a power supply. The power supply is coupled to the integrated circuit to provide power to the integrated circuit. The current sensor provides a sensor output related to the current supply to the integrated circuit from the power supply. The apparatus also includes test circuitry coupled to the sensor output configured to provide a failure output in response to a characteristic increase in power supply current sensed by the current sensor in response to an applied signal spike.