Abstract: During a deposition process, material may deposit not only on the substrate, but also on other chamber components. In a MOCVD chamber, one of those components is the gas distribution showerhead. The showerhead may be cleaned by bombarding the showerhead with radicals generated by a plasma that includes an inert gas and chlorine. In order to generate the plasma, the showerhead may be negatively biased or floating relative to the substrate support. The showerhead may comprise stainless steel and be coated with a ceramic coating.

Abstract: Embodiments of the present invention relate to methods and apparatus for supporting substrates during processing. One embodiment of the present invention provides a substrate carrier comprising a body configured to provide structure support to one or more substrates. One or more pockets are formed in the body from a top surface. Each pocket is configured to retain one substrate by contacting only a portion of a back side of the substrate. Each pocket has a bottom surface and sidewalls surrounding the bottom surface. The sidewalls define an opening larger than a surface area of the substrate so that at least a majority portion of a bevel edge of the substrate is not in contact with the sidewalls.

Abstract: During a deposition process, material may deposit not only on the substrate, but also on other chamber components. In a MOCVD chamber, one of those components is the gas distribution showerhead. The showerhead may be cleaned by bombarding the showerhead with radicals generated by a plasma that includes an inert gas and chlorine. In order to generate the plasma, the showerhead may be negatively biased or floating relative to the substrate support. The showerhead may comprise stainless steel and be coated with a ceramic coating.