Patents by Inventor Kye Jeong Park

Kye Jeong Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230150008
    Abstract: The present disclosure provides a method of manufacturing a hot stamping component, the method includes inserting a blank into a heating furnace, heating the blank, and transferring the heated blank from the heating furnace to a mold, wherein an air cooling time of the blank in the transferring of the blank satisfies Equation 1.
    Type: Application
    Filed: December 7, 2022
    Publication date: May 18, 2023
    Inventors: Jae Myoung Park, Je Youl Kong, Kye Jeong Park, Seung Chae Yoon