Abstract: Polymer compositions having thermoplastic and elastomeric features are provided. These polymer compositions, which are also characterized by superior compatibility with water-based and solvent-based adhesives, comprise at least one thermoplastic elastomer and at least one maleated ethylene copolymer. The compositions of the invention are useful in articles of manufacture that require flexibility and are fabricated with adhesives, including sporting goods, and particularly athletic shoes.

Abstract: A composition that can be used as foam composition is disclosed, which comprises or is produced from an ethylene acrylate copolymer, an acid copolymer or an ionomer of the acid copolymer or both, or combinations thereof, and optionally a soft ethylene polymer. The ethylene acrylate copolymer comprises repeat units derived from ethylene and at least one alkylacrylate. The acid copolymer comprises repeat units derived from ethylene and acrylic acid, methacrylic acid, or combinations thereof. The soft ethylene polymer comprises ethylene and an ?-olefin, vinyl acetate, or combinations thereof.

Abstract: A composition that can be used as foam composition is disclosed, which comprises or is produced from about 40 to about 95 wt %, or about 50 to about 95 wt %, of an ethylene acrylate copolymer and about 5 to about 60 wt %, or about 5 to about 50 wt %, of a soft ethylene polymer wherein the ethylene acrylate copolymer comprises repeat units derived from ethylene and at least one alkyl acrylate and the soft ethylene polymer comprises copolymer of ethylene and an ?-olefin, copolymer of ethylene and vinyl acetate, or combinations thereof.

Abstract: A device and method for optimally detecting the surface conditions of different types of wafers are disclosed. The device includes a light generating unit for impinging light on a wafer to generate a reflected light from the wafer, a combining unit including a plurality of filters having different light cut-off ratios for reducing the amount of the reflected light to generate a reduced amount of the reflected light depending on the reflection rate of the wafer, and a detection unit for processing the appropriately reduced amount of the reflected light to detect the surface condition of the wafer. A different filter or a different combination of the filters are selected depending on the reflection rate of the wafer being processed in order to appropriately reduce the amount of reflected light to be processed by the detection unit.