Patents by Inventor Kye-Ung LEE

Kye-Ung LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyimide film for semiconductor package
    Patent number: 11492519
    Abstract: Disclosed is a semiconductor package polyimide film, which may prevent the stripping of a thermoplastic polyimide layer by reducing a difference in the average coefficient of linear thermal expansion between a substrate film and the thermoplastic polyimide layer, and may be readily detached after a reflow process is completed since the thermoplastic polyimide layer to be attached to a lead frame has a glass transition temperature less than or equal to a reflow process temperature.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: November 8, 2022
    Assignee: IPI TECH INC
    Inventors: Kye Ung Lee, Ju Hwan Chun, Ho Young Park, Tae Seok Lee
  • POLYIMIDE FILM FOR SEMICONDUCTOR PACKAGE
    Publication number: 20220049132
    Abstract: Disclosed is a semiconductor package polyimide film, which may prevent the stripping of a thermoplastic polyimide layer by reducing a difference in the average coefficient of linear thermal expansion between a substrate film and the thermoplastic polyimide layer, and may be readily detached after a reflow process is completed since the thermoplastic polyimide layer to be attached to a lead frame has a glass transition temperature less than or equal to a reflow process temperature.
    Type: Application
    Filed: June 18, 2019
    Publication date: February 17, 2022
    Inventors: Kye Ung LEE, Sung Su KIM, Ho Young PARK, Tae Seok LEE
  • Polyimide film for semiconductor package reflow process, and manufacturing method therefor
    Patent number: 11015089
    Abstract: Disclosed are a polyimide film for a semiconductor package reflow process, and a manufacturing method therefor, the polyimide film being capable of ensuring ease of attachment/detachment of a semiconductor chip after a reflow process is completed, by means of the application of a thermoplastic polyimide layer having a glass transition temperature less than or equal to a reflow process temperature.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: May 25, 2021
    Assignee: IPI TECH INC.
    Inventors: Kye-Ung Lee, Ho-Young Park, Tae-Seok Lee
  • POLYIMIDE FILM FOR SEMICONDUCTOR PACKAGE REFLOW PROCESS, AND MANUFACTURING METHOD THEREFOR
    Publication number: 20190194496
    Abstract: Disclosed are a polyimide film for a semiconductor package reflow process, and a manufacturing method therefor, the polyimide film being capable of ensuring ease of attachment/detachment of a semiconductor chip after a reflow process is completed, by means of the application of a thermoplastic polyimide layer having a glass transition temperature less than or equal to a reflow process temperature.
    Type: Application
    Filed: June 29, 2017
    Publication date: June 27, 2019
    Inventors: Kye-Ung LEE, Ho-Young PARK, Tae-Seok LEE