Abstract: The present invention relates to a method for manufacturing a light-emitting device and the light-emitting device manufactured using same, which can reduce manufacturing costs, form nanopatterns in a large area, and increase light extraction efficiency. One embodiment of the present invention discloses the method for manufacturing a light-emitting device, comprising: a light-emitting structure preparation step for preparing a light-emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, which are formed sequentially; a light extraction layer formation step for forming the upper part of the second conductive semiconductor layer as a light extraction layer having an uneven pattern; a dipping step for dipping the light-emitting structure having the light extraction layer in a solution in which nanomaterials are dispersed; and an adsorption step for adsorbing the nanomaterials to the light extraction layer.

Abstract: Provided are a method of controlling an amount of adsorbed carbon nanotubes (CNTs) and a method of fabricating a CNT device. The method of controlling an amount of adsorbed CNTs includes adsorbing CNT particles onto a semiconductor structure, and removing some of the adsorbed CNTs by performing an oxygen plasma treatment on the adsorbed CNT particles.

Abstract: Provided are a method of controlling an amount of adsorbed carbon nanotubes (CNTs) and a method of fabricating a CNT device. The method of controlling an amount of adsorbed CNTs includes adsorbing CNT particles onto a semiconductor structure, and removing some of the adsorbed CNTs by performing an oxygen plasma treatment on the adsorbed CNT particles.

Abstract: Provided is a method and apparatus for mounting a plurality of electronic components. The method comprises mounting a first electronic component on a substrate; forming a mask on the substrate to expose the first electronic component and a region of the substrate on which a solder paste is to be applied; forming a guide on a portion of the mask disposed around the first electronic component; applying the solder paste onto the substrate by using a squeezer contacting a portion of the mask disposed around the region of the substrate on which the solder paste is to be applied; removing the guide and the mask; and mounting a second electronic component on the solder paste.

Abstract: Provided is a method and apparatus for mounting a plurality of electronic components. The method comprises mounting a first electronic component on a substrate; forming a mask on the substrate to expose the first electronic component and a region of the substrate on which a solder paste is to be applied; forming a guide on a portion of the mask disposed around the first electronic component; applying the solder paste onto the substrate by using a squeezer contacting a portion of the mask disposed around the region of the substrate on which the solder paste is to be applied; removing the guide and the mask; and mounting a second electronic component on the solder paste.