Publication number: 20240059829
Abstract: An epoxy compound including a 5-membered aromatic heterocyclic ring represented by Formula 1 or Formula 2, a composition prepared using the epoxy compound, a semiconductor device prepared using the epoxy compound, an electronic device prepared using the epoxy compound, an article prepared using the epoxy compound, and a method of preparing the article: E1-(M1)a1-(L1)b1-M3-(L2)b2-(M2)a2-E2??Formula 1 E1-(M1)a1-(L1)b1-M3-(L2)b2-(M2)a2-(L5)b5-A-(L6)b6-(M4)a3-(L3)b3-M6-(L4)b4-(M5)a4-E2??Formula 2 wherein in Formulae 1 and 2, M1, M2, M3, M4, M5, M6, L1, L2, L3, L4, L5, L6, E1, E2, a1, a2, a3, a4, b1, b2, b3, b4, b5, and b6 are the same as those defined in the detailed description.
Type:
Application
Filed:
October 20, 2023
Publication date:
February 22, 2024
Inventors:
Jonghoon WON, Dahye PARK, Kyeong PANG, In KIM
Patent number: 11827742
Abstract: An epoxy compound including a 5-membered aromatic heterocyclic ring represented by Formula 1 or Formula 2, a composition prepared using the epoxy compound, a semiconductor device prepared using the epoxy compound, an electronic device prepared using the epoxy compound, an article prepared using the epoxy compound, and a method of preparing the article: E1-(M1)a1-(L1)b1-M3-(L2)b2-(M2)a2-E2??Formula 1 E1-(M1)a1-(L1)b1-M3-(L2)b2-(M2)a2-(L5)b5-A-(L6)b6-(M4)a3-(L3)b3-M6-(L4)b4-(M5)a4-E2??Formula 2 wherein in Formulae 1 and 2, M1, M2, M3, M4, M5, M6, L1, L2, L3, L4, L5, L6, E1, E2, a1, a2, a3, a4, b1, b2, b3, b4, b5, and b6 are the same as those defined in the detailed description.
Type:
Grant
Filed:
August 17, 2021
Date of Patent:
November 28, 2023
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
Inventors:
Jonghoon Won, Dahye Park, Kyeong Pang, In Kim
Publication number: 20220056197
Abstract: An epoxy compound including a 5-membered aromatic heterocyclic ring represented by Formula 1 or Formula 2, a composition prepared using the epoxy compound, a semiconductor device prepared using the epoxy compound, an electronic device prepared using the epoxy compound, an article prepared using the epoxy compound, and a method of preparing the article: E1-(M1)a1-(L1)b1-M3-(L2)b2-(M2)a2-E2??Formula 1 E1-(M1)a1-(L1)b1-M3-(L2)b2-(M2)a2-(L5)b5-A-(L6)b6-(M4)a3-(L3)b3-M6-(L4)b4-(M5)a4-E2??Formula 2 wherein in Formulae 1 and 2, M1, M2, M3, M4, M5, M6, L1, L2, L3, L4, L5, L6, E1, E2, a1, a2, a3, a4, b1, b2, b3, b4, b5, and b6 are the same as those defined in the detailed description.
Type:
Application
Filed:
August 17, 2021
Publication date:
February 24, 2022
Inventors:
Jonghoon Won, Dahye Park, Kyeong Pang, In Kim