Patents by Inventor Kyeong-Ho Jang

Kyeong-Ho Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Superconducting wire and manufacturing method thereof
    Patent number: 8265722
    Abstract: Disclosed is a superconducting wire and a method for manufacturing the same, in which spacer are inserted into each space formed between modules, the spacers being different kinds according to a shape of each space when a restacking billet is manufactured in an internal diffusion method for manufacturing a Nb3Sn superconducting wire. One of a copper spacer and a low tin/copper spacer having a sectional area rate of copper/tin more than 6.0 is arranged between three modules as well as between two modules and a diffusion preventing tube, and a high tin/copper spacer having a sectional area rate of copper/tin less than 0.01˜1.5 or a middle tin/copper spacer having a sectional area rate of copper/tin less than 1.5˜6.0 is arranged between four modules.
    Type: Grant
    Filed: December 4, 2007
    Date of Patent: September 11, 2012
    Assignee: K.A.T. Co., Ltd.
    Inventors: Pyeong-Yeol Park, Kyeong-Ho Jang
  • SUPERCONDUCTING WIRE AND MANUFACTURING METHOD THEREOF
    Publication number: 20100317530
    Abstract: Disclosed is a superconducting wire and a method for manufacturing the same, in which spacer are inserted into each space formed between modules, the spacers being different kinds according to a shape of each space when a restacking billet is manufactured in an internal diffusion method for manufacturing a Nb3Sn superconducting wire. One of a copper spacer and a low tin/copper spacer having a sectional area rate of copper/tin more than 6.0 is arranged between three modules as well as between two modules and a diffusion preventing tube, and a high tin/copper spacer having a sectional area rate of copper/tin less than 0.01˜1.5 or a middle tin/copper spacer having a sectional area rate of copper/tin less than 1.5˜6.0 is arranged between four modules.
    Type: Application
    Filed: December 4, 2007
    Publication date: December 16, 2010
    Inventors: Pyeong-Yeol Park, Kyeong-Ho Jang