Patents by Inventor Kyeongmun Kim

Kyeongmun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polycarbonate Resin and Method for Preparing Same
    Publication number: 20240150521
    Abstract: A polycarbonate resin including a unit of Chemical Formula 1, a method for preparing the same, a polycarbonate resin composition including the same, and a molded article including the polycarbonate resin composition are described: wherein all the variables are described herein.
    Type: Application
    Filed: February 8, 2023
    Publication date: May 9, 2024
    Applicant: LG Chem, Ltd.
    Inventors: Il Hwan Choi, Kyeongmun Kim, Hye Jin Yim, Jaesoon Bae, Jonghwa Baek, Hyeonah Shin, Min Suk Jung
  • Resin and Method for Manufacturing Same
    Publication number: 20240141100
    Abstract: A resin including a unit represented by Chemical Formula 1, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition is described: wherein all the variables are described herein.
    Type: Application
    Filed: May 16, 2022
    Publication date: May 2, 2024
    Applicant: LG Chem, Ltd.
    Inventors: Min Suk Jung, Kyeongmun Kim, Jaesoon Bae, Jonghwa Baek, Hyeonah Shin, Kyeongmin Kim, Bora Shin, Hye Jin Yim, Il Hwan Choi
  • Resin, Preparation Method Therefor, Resin Composition, and Molded Article
    Publication number: 20240043610
    Abstract: A resin, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition are disclosed in herein. In some embodiments, a resin includes a unit of Chemical Formula 1 and a unit of Chemical Formula 2: wherein, in Chemical Formulae 1 and 2, Ar1, Ar2, R1, r1, X1 to X4, X9, X10, Z1, Z2, Z5, La, La?, a, b, p, t, m, n, L11, l11, X11 to X16, Z11 to Z13, Lb, Lb?, a?, b?, p?, C?, m? and n? are defined herein.
    Type: Application
    Filed: September 2, 2022
    Publication date: February 8, 2024
    Applicant: LG Chem, Ltd.
    Inventors: Il Hwan Choi, Kyeongmun Kim, Min Suk Jung, Jaesoon Bae, Hyeonah Shin, Hye Jin Yim
  • Resin, Preparation Method Therefor, Resin Composition, and Molded Product
    Publication number: 20230407005
    Abstract: A resin, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition are disclosed herein. In some embodiments, the resin includes a unit of Chemical Formula 1 and a unit of Chemical Formula 2 wherein, in Chemical Formulae 1 and 2, Ar1, Ar2, R1 to R3, r1 to r3, L1, L2, X1 to X10, X?9, X?10, Z1 to Z6, La, La?, La?, La??, a, b, c, d, p, q, t, t?, m, n, m? and n? are defined herein.
    Type: Application
    Filed: August 12, 2022
    Publication date: December 21, 2023
    Applicant: LG Chem, Ltd.
    Inventors: Il Hwan Choi, Kyeongmun Kim, Min Suk Jung, Jaesoon Bae, Hyeonah Shin, Hye Jin Yim
  • Resin and Preparation Method Therefor
    Publication number: 20230303767
    Abstract: A resin includes a unit represented by Chemical Formula 1, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition in Chemical Formula 1, Ar1, Ar2, R1, r1, X1 to X4, Z1, Z2, a and b are described herein.
    Type: Application
    Filed: May 16, 2022
    Publication date: September 28, 2023
    Applicant: LG Chem, Ltd.
    Inventors: Min Suk Jung, Kyeongmun Kim, Jaesoon Bae, Hyeonah Shin, Hye Jin Yim, Il Hwan Choi, Kyeongmin Kim, Bora Shin
  • Resin and Method for Producing Same
    Publication number: 20230295372
    Abstract: The present application relates to a resin including a unit represented by Chemical Formula 1, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition.
    Type: Application
    Filed: May 16, 2022
    Publication date: September 21, 2023
    Applicant: LG Chem, Ltd.
    Inventors: Min Suk Jung, Jaesoon Bae, Hyeonah Shin, Kyeongmun Kim, Kyeongmin Kim, Bora Shin