Patents by Inventor Kyeongwoon CHO

Kyeongwoon CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition, metal laminate and printed circuit board using same, and method for manufacturing metal laminate
    Patent number: 11820885
    Abstract: A resin composition, a metal laminate, and a printed circuit board which use the resin composition are disclosed. A method for manufacturing the metal laminate is also disclosed. The resin composition contains at least one elastomer selected from the group consisting of a fluoroelastomer or a styrene-based elastomer; a fluororesin filler; and an inorganic filler.
    Type: Grant
    Filed: September 2, 2019
    Date of Patent: November 21, 2023
    Assignee: DOOSAN CORPORATION
    Inventors: Jinsoo Lee, Hyungkyu Kim, Kyeongwoon Cho
  • RESIN COMPOSITION, METAL LAMINATE AND PRINTED CIRCUIT BOARD USING SAME, AND METHOD FOR MANUFACTURING METAL LAMINATE
    Publication number: 20220025167
    Abstract: A resin composition, a metal laminate, and a printed circuit board which use the resin composition are disclosed. A method for manufacturing the metal laminate is also disclosed. The resin composition contains at least one elastomer selected from the group consisting of a fluoroelastomer or a styrene-based elastomer; a fluororesin filler; and an inorganic filler.
    Type: Application
    Filed: September 2, 2019
    Publication date: January 27, 2022
    Applicant: DOOSAN CORPORATION
    Inventors: Jinsoo LEE, Hyungkyu KIM, Kyeongwoon CHO