Abstract: A hygienic cap is provided for sealing a fitting, the hygienic cap includes a rim portion defining a mating surface that is configured to receive a compliant gasket along the mating surface. A central cover portion is integrally formed with the rim portion and defines a cavity having a threshold radius defined by an arcuate internal surface of the cavity. The threshold radius inhibits stagnation of a cleaning fluid along the arcuate internal surface during cleaning operations.

Abstract: An apparatus is provided, comprising: a volatile memory; a non-volatile memory; a first electronic circuit that is configured to operate as a wireless access point, the first electronic circuit including a wireless controller for accessing a wireless network; and a second electronic circuit that is operatively coupled to the first electronic circuit, the second electronic circuit including at least one processor configured to execute: (i) a first virtual machine that includes a wireless network authentication server, and (ii) a second virtual machine that includes a virtual private network (VPN) server, wherein the wireless network authentication server is configured to authenticate devices that attempt to join the wireless network; wherein the VPN server is arranged to encrypt data that is received at the apparatus to produce encrypted data, and forward the encrypted data to the wireless controller for transmission over the wireless network.

Abstract: A fluid cleaning device includes a spheroid-shaped member defining an internal void. The spheroid-shaped member further includes a wall defining a plurality of apertures and at least partially surrounding the internal void and an inlet orifice that receives a cleaning fluid under pressure. A tubular nozzle projects from the inlet orifice and into the internal void to mitigate fluctuation of one of the internal pressure and flow velocity of the cleaning fluid within the spheroid-shaped member.

Abstract: An apparatus is provided, comprising: a volatile memory; a non-volatile memory; a first electronic circuit that is configured to operate as a wireless access point, the first electronic circuit including a wireless controller for accessing a wireless network; and a second electronic circuit that is operatively coupled to the first electronic circuit, the second electronic circuit including at least one processor configured to execute: (i) a first virtual machine that includes a wireless network authentication server, and (ii) a second virtual machine that includes a virtual private network (VPN) server, wherein the wireless network authentication server is configured to authenticate devices that attempt to join the wireless network; wherein the VPN server is arranged to encrypt data that is received at the apparatus to produce encrypted data, and forward the encrypted data to the wireless controller for transmission over the wireless network.

Abstract: An apparatus is provided, comprising: a volatile memory; a non-volatile memory; a first electronic circuit that is configured to operate as a wireless access point, the first electronic circuit including a wireless controller for accessing a wireless network; and a second electronic circuit that is operatively coupled to the first electronic circuit, the second electronic circuit including at least one processor configured to execute: (i) a first virtual machine that includes a wireless network authentication server, and (ii) a second virtual machine that includes a virtual private network (VPN) server, wherein the wireless network authentication server is configured to authenticate devices that attempt to join the wireless network; wherein the VPN server is arranged to encrypt data that is received at the apparatus to produce encrypted data, and forward the encrypted data to the wireless controller for transmission over the wireless network.

Abstract: A sanitary clamp with facing ring halves employs one or more threaded closure devices configured to avoid having any threads exposed to the ambient. A bolt member may have a stepped shaft with a first smooth shaft portion and a male-threaded tip portion. The latter may be the same or a smaller diameter. An associated nut member has a blind bore that extends from a first end of the nut, with a first smooth wall portion and a second female threaded bore portion. The second female threaded portion may have the same bore diameter, or the bore can have a stepped interior diameter with the second female threaded bore portion having a diameter smaller than the first smooth wall portion. A seal member or gland within the smooth wall bore portion closes off a space defined between said the tip portion of the bolt member and the female-threaded bore portion. Once installed, there are no threaded surfaces of the bolt member or the nut member that are exposed to the ambient.

Abstract: Coaxial, dual agitator top-entering mixer has coaxial vertical drive shafts penetrating the center of the head of the vessel, driving a lower-speed outer scraper agitator and a higher-speed inner agitator. An inner rotary seal closes the upper end of an annular space between the inner and outer shafts. An outer rotary seal closes the opening around the outer drive shaft in the head of the vessel. A central bore along the inner drive shaft axis extends from its upper end down to a position just below the inner seal, with one or more cross-bored radial passages to the annular space between the drive shafts. A rotary fitting at the upper end of the inner drive shaft permits the introduction of a cleaning fluid into the central bore. The cleaning fluid passes through the bore and the radial passage into the annular space to clean accumulations from within the annular space. The cleaning fluid exits the annular space into the interior of vessel.

Abstract: Coaxial, dual agitator top-entering mixer has coaxial vertical drive shafts penetrating the center of the head of the vessel, driving a lower-speed outer scraper agitator and a higher-speed inner agitator. An inner rotary seal closes the upper end of an annular space between the inner and outer shafts. An outer rotary seal closes the opening around the outer drive shaft in the head of the vessel. A central bore along the inner drive shaft axis extends from its upper end down to a position just below the inner seal, with one or more cross-bored radial passages to the annular space between the drive shafts. A rotary fitting at the upper end of the inner drive shaft permits the introduction of a cleaning fluid into the central bore. The cleaning fluid passes through the bore and the radial passage into the annular space to clean accumulations from within the annular space. The cleaning fluid exits the annular space into the interior of vessel.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness.