Patents by Inventor Kyle Avery Woolrich

Kyle Avery Woolrich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12615709
    Abstract: A multi-embedded circuit board includes a first circuit board and a first cold plate thermally coupled to the first circuit board. The first circuit board includes a substrate and a power amplifier within the substrate, the power amplifier electrically coupled to one or more electromagnetic signal interfaces. The first cold plate includes one or more first cooling elements configured to extract heat from the power amplifier.
    Type: Grant
    Filed: May 25, 2023
    Date of Patent: April 28, 2026
    Assignee: THE BOEING COMPANY
    Inventors: Kyle Avery Woolrich, Paul Christian Werntz
  • Publication number: 20240397605
    Abstract: A multi-embedded circuit board includes a first circuit board and a first cold plate thermally coupled to the first circuit board. The first circuit board includes a substrate and a power amplifier within the substrate, the power amplifier electrically coupled to one or more electromagnetic signal interfaces. The first cold plate includes one or more first cooling elements configured to extract heat from the power amplifier.
    Type: Application
    Filed: May 25, 2023
    Publication date: November 28, 2024
    Inventors: Kyle Avery Woolrich, Paul Christian Werntz