Abstract: Systems and methods for selectively etching features in an electronic substrate via a precision dispense apparatus and precision etchant dispense tool are disclosed. The method includes creating a toolpath instruction for etching at least one feature in the substrate, programming the precision dispense apparatus to execute the created toolpath instruction, and causing the precision dispense tool to deposit etchant material onto the surface of the substrate to etch the substrate surface to produce the at least one feature according to the created toolpath instruction. The capabilities of the systems and methods disclosed herein extend to 3D substrates and post-build processing, among others.

Abstract: A system may include an array of interconnected memristors. Each memristor may include a first electrode, a second electrode, and a memristor material positioned between the first electrode and the second electrode. The system may further include a controller communicatively coupled to the array of interconnected memristors. The controller may be configured to tune the array of interconnected memristors.

Abstract: Systems and methods for custom photolithography masking via a precision dispense apparatus and process are disclosed. Methods include creating a toolpath instruction for depositing opaque onto a substrate, programming a precision dispense apparatus to execute the created toolpath instruction, and causing the precision dispense tool to deposit opaque material onto the substrate to form the photomask. The substrate may be an optically transparent plate or film or may be an electronic substrate where the opaque material is deposited directly onto a photoresist coating. Capabilities of the systems and methods disclosed herein extend to 3D substrates and custom photolithography masking, among others.

Abstract: An electrical device with thermally controlled performance is disclosed. The electrical device includes at least one die with a plurality of device components disposed upon or at least partially embedded within the die. The electrical device further includes a plurality of signal paths interconnecting the plurality of device components. The electrical device further includes a plurality of temperature sensors disposed upon or at least partially embedded within the die. The temperature sensors are configured to detect thermal loads at respective portions of the die. The electrical device further includes at least one controller disposed upon or at least partially embedded within the die. The controller is configured to adjust one or more operating parameters for one or more of the device components based on the thermal loads detected by the temperature sensors.

Abstract: A system may include a first conductive plate configured at least to receive an input signal. The system may include a second conductive plate configured at least to output an output signal. The system may further include a memristor material positioned between the first conductive plate and the second conductive plate.

Abstract: A system may include a multi-lead memristor. The multi-lead memristor may include a first lead, a second lead, a third lead, a first memristor material, and a second memristor material. The second lead may be positioned between the first lead and the third lead. The first memristor material may be positioned between the first lead and the second lead. The second memristor material may be positioned between the second lead and the third lead.

Abstract: A system may include a first conductive plate configured at least to receive an input signal and a second conductive plate configured at least to output an output signal. The system may further include a first memristor material positioned between the first conductive plate and the second conductive plate. The system may further include a second memristor material positioned between the first conductive plate and the second conductive plate. The first memristor material and the second memristor material may be in parallel electrically. The first memristor material may be different from the second memristor material.

Abstract: A system may include a multi-lead memristor. The multi-lead memristor may include a first lead, a second lead, a third lead, a first memristor material, and a second memristor material. The second lead may be positioned between the first lead and the third lead. The first memristor material may be positioned between the first lead and the second lead. The second memristor material may be positioned between the second lead and the third lead.

Abstract: A system may include an array of interconnected memristors. Each memristor may include a first electrode, a second electrode, and a memristor material positioned between the first electrode and the second electrode. The system may further include a controller communicatively coupled to the array of interconnected memristors. The controller may be configured to tune the array of interconnected memristors.

Abstract: An electronic device fabrication system may include, but is not limited to: a conductive material deposition device configured for deposition of a conductive material; at least one electronic device substrate configured to receive deposited conductive material; and at least one mask configured to selectively transmit the conductive material to the electronic device substrate, wherein the at least one mask configured to selectively transmit the conductive material to the electronic device substrate includes: at least a first side disposed at an angle relative to an adjacent second side.

Abstract: A system may include a first conductive plate configured at least to receive an input signal and a second conductive plate configured at least to output an output signal. The system may further include a first memristor material positioned between the first conductive plate and the second conductive plate. The system may further include a second memristor material positioned between the first conductive plate and the second conductive plate. The first memristor material and the second memristor material may be in parallel electrically. The first memristor material may be different from the second memristor material.

Abstract: A system may include a first conductive plate configured at least to receive an input signal. The system may include a second conductive plate configured at least to output an output signal. The system may further include a memristor material positioned between the first conductive plate and the second conductive plate.

Abstract: An electrical device with printed interconnects between packaged integrated circuit components and a substrate as well as a method for printing interconnects between packaged integrated circuit components and a substrate are disclosed. An electrical device with printed interconnects may include a dielectric layer forming a continuous surface between a substrate and a terminal face of an integrated circuit component. The electrical device may further include interconnects formed from a layer of material printed across the continuous surface formed by the dielectric layer to connect electrical terminals on the substrate to electrical terminals on the terminal face of the integrated circuit component.