Abstract: A document classification system and method for classifying documents includes providing a set of electronic documents to be classified. The documents may be compared to templates of known documents, run through a neural network that is trained to determine common features within a classification, or analyzed as a vector to similar vectors of classified documents to determine appropriate classification. The classification may include parameters defined to extract data from the document, such as anchor objects that define a location relative to the anchor where known data may be extracted. The extracted data may be associated with the classified document.

Abstract: A mask useful for photolithography that can be electronically reconfigured is described. In one embodiment, a photolithography system has an illumination system, a reticle scanning stage, a wafer scanning stage, and a reticle mounted to the reticle scanning stage, the reticle having an electronically reconfigurable mask.

Abstract: An embodiment of the present invention is a technique to generate particles for use in a slurry solution for chemical mechanical planarization (CMP). Reverse micelles are formed using at least one of an oxide and a metal in a mixture. The size of the reverse micelles is tuned to a desired size. The particles are formed inside the reverse micelles. The particles are precipitated and transferred to a slurry solution.

Abstract: Systems and techniques involving optical coatings for semiconductor devices. An implementation includes a substantially isotropic, heterogeneous anti-reflective coating having a substantially equal thickness normal to any portion of a substrate independent of the orientation of the portion.

Abstract: An optically tuned SLAM (Sacrificial Light-Absorbing Material) may be used in a via-first dual damascene patterning process to facilitate removal of the SLAM. The monomers used to produce the optically tuned SLAM may be modified to place an optically sensitive structure in the backbone of the SLAM polymer. The wafer may be exposed to a wavelength to which the SLAM is tuned prior to etching and/or ashing steps to degrade the optically tuned SLAM and facilitate removal.