Patents by Inventor Kyle Fukuchi

Kyle Fukuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation approach in chip on board assembly by using stacked copper Microvias
    Patent number: 9918377
    Abstract: The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: March 13, 2018
    Assignee: Google LLC
    Inventors: Zuowei Shen, Kyle Fukuchi, Melanie Beauchemin, Ryohei Urata
  • Heat dissipation approach in chip on board assembly by using stacked copper microvias
    Patent number: 9641254
    Abstract: The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: May 2, 2017
    Assignee: Google Inc.
    Inventors: Zuowei Shen, Kyle Fukuchi, Melanie Beauchemin, Ryohei Urata