Abstract: A header tank for a heat exchanger comprises a casing having a hollow interior and a header assembly coupled to the casing. The header assembly comprises a header having a plurality of tube openings formed therein and a stiffening element coupled to the header. The stiffening element includes a stiffening wall extending from a first longitudinal side of the header to an opposing second longitudinal side of the header to provide additional bending stiffness to the header assembly.

Abstract: An integrated heat exchanger assembly comprises a first header tank, a second header tank, a first heat exchanger core extending between the first header tank and the second header tank, a second heat exchanger core extending between the first header tank and the second header tank, and a third heat exchanger core extending between the first header tank and the second header tank. The first heat exchanger core is in fluid communication with a liquid coolant and a refrigerant, the second heat exchanger core in fluid communication with a first portion of a flow of air and the refrigerant, and the third heat exchanger core in fluid communication with a second portion of the flow of the air and the liquid coolant.

Abstract: A header tank for a heat exchanger comprises a casing having a hollow interior and a header assembly coupled to the casing. The header assembly comprises a header having a plurality of tube openings formed therein and a stiffening element coupled to the header. The stiffening element includes a stiffening wall extending from a first longitudinal side of the header to an opposing second longitudinal side of the header to provide additional bending stiffness to the header assembly.

Abstract: An integrated heat exchanger assembly comprises a first header tank, a second header tank, a first heat exchanger core extending between the first header tank and the second header tank, a second heat exchanger core extending between the first header tank and the second header tank, and a third heat exchanger core extending between the first header tank and the second header tank. The first heat exchanger core is in fluid communication with a liquid coolant and a refrigerant, the second heat exchanger core in fluid communication with a first portion of a flow of air and the refrigerant, and the third heat exchanger core in fluid communication with a second portion of the flow of the air and the liquid coolant.

Abstract: An electrical rotating machine, such as a generator or motor, communicates power from a stationary location to the rotating rotor of the rotating machine via opposed pairs of capacitor plates, one plate of each pair rotating with the rotor and one plate of each pair fixed not to rotate. In one embodiment, separation between the plates of the pair is provided by a cushion of entrapped air.

Abstract: An electrical rotating machine, such as a generator or motor, communicates power from a stationary location to the rotating rotor of the rotating machine via opposed pairs of capacitor plates, one plate of each pair rotating with the rotor and one plate of each pair fixed not to rotate. In one embodiment, separation between the plates of the pair is provided by a cushion of entrapped air.

Abstract: An electrical rotating machine, such as a generator or motor, communicates power from a stationary location to the rotating rotor of the rotating machine via opposed pairs of capacitor plates, one plate of each pair rotating with the rotor and one plate of each pair fixed not to rotate. In one embodiment, separation between the plates of the pair is provided by a cushion of entrapped air.

Abstract: An electrical rotating machine, such as a generator or motor, communicates power from a stationary location to the rotating rotor of the rotating machine via opposed pairs of capacitor plates, one plate of each pair rotating with the rotor and one plate of each pair fixed not to rotate. In one embodiment, separation between the plates of the pair is provided by a cushion of entrapped air.

Abstract: Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having an electrode and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrode. The chamber further includes a nonporous barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The nonporous barrier is configured to allow cations or anions to flow through the barrier between the first and second processing fluids.

Abstract: An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel.

Abstract: An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel.

Abstract: An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel.

Abstract: A method and apparatus for processing a microfeature workpiece. In one embodiment, the apparatus includes a support member configured to carry a microfeature workpiece at a workpiece plane, and a vessel positioned at least proximate to the support member. The vessel has a vessel surface facing toward the support member and positioned to carry a processing liquid. The vessel surface is shaped to provide an at least approximately uniform current density at the workpiece plane. At least one electrode, such as a thieving electrode, is disposed within the vessel. In a further aspect of this embodiment, the thieving electrode can be easily removable along with conductive material it attracts from the processing liquid. The shape of the vessel surface, the current supplied to the thieving electrode and/or the diameter of an aperture upstream of the workpiece are changed dynamically in other embodiments.

Abstract: Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing liquid. The vessel has a thermally transmissive wall for transferring heat to and/or from the processing liquid within. A heat transfer device, such as a reservoir that receives processing liquid spilling over from the process vessel, transfers heat to or from the processing liquid within the process vessel. The heat transfer device can also transfer heat to or from an internal or external heat source, such as a conduit carrying a heat transfer fluid, or an electrical resistance heater.

Abstract: A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas or air is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against an angled annular surface on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. Outlets through the rotor allow gas to flow out of the rotor.

Abstract: A wet chemical processing chamber comprising a fixed unit, a detachable unit releasably coupled to the fixed unit, a seal contacting the fixed unit and the detachable unit, and a processing component disposed in the fixed unit and/or the detachable unit. The fixed unit can have a first flow system configured to direct a processing liquid through the fixed unit and a mounting fixture for fixedly attaching the fixed unit to a platform or deck of an integrated processing tool. The detachable unit can include a second flow system configured to direct the processing liquid to and/or from the first flow system of the fixed unit. The seal has an orifice through which processing liquid can flow between the first and second flow systems, and the processing component can impart a property to the processing liquid for processing a surface on a microfeature workpiece having submicron microfeatures.

Abstract: Reactors, systems and methods for electroplating and/or electro-etching microfeature workpieces. Reactors in accordance with the invention have a first chamber configured to direct a first processing solution to a processing zone, a second chamber configured to contain a second processing solution different than the first processing solution, and an ion exchange membrane between the first chamber and the second chamber. The reactors also include (a) a support member in the first chamber that contacts the ion exchange membrane across the surface of the membrane, and (b) a counter electrode in the second chamber. The ion exchange membrane enables a low conductivity catholyte to be used in the first chamber and an inert counter electrode in the second chamber.

Abstract: A wafer processor has a process head engageable with a process chamber. A rotor on the process head has multiple wafer holding positions offset from the rotor axis. A wafer retaining device holds the wafers in place, in the holding positions, during processing. As the rotor spins, wafers retained in the wafer holding positions revolve around the axis. Multiple smaller size wafers may be simultaneously processed within a single processor.

Abstract: The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current photoresist deposition technology. This system enables the application of electrophoretic resists in automated equipment that meets the standards for cleanliness and production throughput desired by the microelectronic fabrication industry.

Abstract: A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins or surfaces on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. An angled surface helps to deflect spent process liquid away from the workpiece. The head is moveable into multiple different engagement positions with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece. A moving end point detector may be used to detect an end point of processing.