Abstract: A device containing a solar cell is provided in the form of a stacked package that has a planar arrangement of conductive laminates at or below the surface of a heat sink. The planar alignment allows placement of electrical connections below the surface of the heat sink and reduces the vertical profile of the device, making it easier to be hermetically sealed. In specific embodiments the solar cell substrate is embedded within the heat sink during the manufacturing phase, eliminating the need for a thermally conductive substrate between the solar cell and the heat sink.

Abstract: A stacked package for a solar cell is provided with a planar arrangement of conductive laminates on the surface of the heat sink. The layered conductive laminate offers multi-directional orientation of the solar cell within the package by eliminating any orientation requirements between the chip and the substrate, and offers multiple options for placement of standard or flipped bypass diodes. The packaged solar cell of the invention provides a smaller horizontal and vertical profile than standard solar cell packages, making it easier to hermetically seal the package.

Abstract: A device containing a solar cell is provided in the form of a stacked package that has a planar arrangement of conductive laminates at or below the surface of a heat sink. The planar alignment allows placement of electrical connections below the surface of the heat sink and reduces the vertical profile of the device, making it easier to be hermetically sealed. In specific embodiments the solar cell substrate is embedded within the heat sink during the manufacturing phase, eliminating the need for a thermally conductive substrate between the solar cell and the heat sink.