Patents by Inventor Kyle MCELHINNY

Kyle MCELHINNY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250218879
    Abstract: Embodiments disclosed herein include components that are embedded within a core of a package substrate. In an embodiment, the component is supported on a pad provided at a bottom of a cavity through the core. In an embodiment, such an apparatus may comprise a substrate with a cavity through a thickness of the substrate. In an embodiment, the cavity comprises sidewalls. In an embodiment, a layer spans an opening of the cavity, and the layer covers at least a portion of the sidewalls of the cavity. In an embodiment, a component is coupled to the layer, and the component is at least partially within the cavity.
    Type: Application
    Filed: December 29, 2023
    Publication date: July 3, 2025
    Inventors: Hiroki TANAKA, Kyle MCELHINNY, Robert Alan MAY, Bai NIE, Bohan SHAN, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN
  • Publication number: 20240105576
    Abstract: Embodiments disclosed herein include package substrates and methods of forming package substrates. In an embodiment, the package substrate comprises a core and a pad over the core. In an embodiment, a solder resist is over the pad, and an opening into the solder resist exposes a portion of the pad. In an embodiment, the package substrate further comprises a surface finish over the pad and within the opening.
    Type: Application
    Filed: September 26, 2022
    Publication date: March 28, 2024
    Inventors: Kyle MCELHINNY, Xiaoying GUO, Hiroki TANAKA, Haobo CHEN
  • Publication number: 20240105580
    Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a core, and a pad over the core. In an embodiment, a shell is around the core, and a surface finish is over the shell. In an embodiment, the electronic package further comprises a solder resist over the pad, where an opening is formed through the solder resist to expose the surface finish.
    Type: Application
    Filed: September 26, 2022
    Publication date: March 28, 2024
    Inventors: Kristof DARMAWIKARTA, Srinivas V. PIETAMBARAM, Kyle MCELHINNY, Hiroki TANAKA
  • Publication number: 20240105575
    Abstract: Embodiments disclosed herein include package substrates and methods of forming package substrates. In an embodiment, the package substrate comprises a core, and a pad over the core, where the pad has a first width. In an embodiment, a surface finish is over the pad, where the surface finish has a second width that is substantially equal to the first width. In an embodiment, the package substrate further comprises a solder resist over the pad, where the solder resist comprises an opening that exposes a portion of the surface finish. In an embodiment, the opening has a third width that is smaller than the second width.
    Type: Application
    Filed: September 26, 2022
    Publication date: March 28, 2024
    Inventors: Jason M. GAMBA, Haifa HARIRI, Kristof DARMAWIKARTA, Srinivas V. PIETAMBARAM, Hiroki TANAKA, Kyle MCELHINNY, Xiaoying GUO, Steve S. CHO, Ali LEHAF, Haobo CHEN, Bai NIE, Numair AHMED
  • Publication number: 20230090350
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a package substrate, and a first pad over the package substrate. In an embodiment, a layer is over the package substrate, where the layer is an insulating material. In an embodiment, the electronic package further comprises a via through the layer and in contact with the first pad. In an embodiment a first end of the via has a first width and a second end of the via that is in contact with the first pad has a second width that is larger than the first width. In an embodiment, the electronic package further comprises a second pad over the via.
    Type: Application
    Filed: September 17, 2021
    Publication date: March 23, 2023
    Inventors: Kyle MCELHINNY, Haobo CHEN, Hongxia FENG, Xiaoying GUO, Leonel ARANA