Patents by Inventor Kyle Mitchell Flessner

Kyle Mitchell Flessner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure and method for diminishing delamination of packaged semiconductor devices
    Patent number: 9627299
    Abstract: A semiconductor device (100) comprising a leadframe with a pad (101) and elongated leads (103) made of a base metal plated with a layer enabling metal-to-metal bonding; a semiconductor chip (110) attached to the pad, the chip having terminals. A metallic wire connection (130) from a terminal to a respective lead, the connection including a first ball bond by a first squashed ball (131) attached to the terminal, and a first stitch bond (132) attached to the lead. A second squashed ball (150) of the wire metal attached to the lead as a second ball bond adjacent to the first stitch bond (132). A package (170) of a polymeric compound encapsulating the chip, wire connection, second ball and at least a portion of the elongated lead, the compound adhering to the materials of the encapsulated entities.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: April 18, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Kyle Mitchell Flessner