Abstract: Various embodiments disclosed herein provide for several methods of fabricating p-type semiconductors with industrially relevant hole mobilities that are back end of the line (BEOL) compatible. A first method of fabrication includes forming a buffer layer on a substrate, forming a palladium oxide layer over the buffer layer, annealing the palladium oxide layer, and then forming a cap layer over the palladium oxide layer, then cooling the stack, wherein each step is performed at a variety of predefined temperatures. Each of the substrate, buffer layer and cap layer can be magnesium oxide. A second method includes forming a palladium oxide layer over a titanium dioxide substrate, annealing the stack, and then cooling the stack, all performed at a different variety of predefined temperatures.

Abstract: Disclosed is a method of receiving and processing content-sending inputs received by a head-worn device system including one or more display devices, one or more cameras and a vertically-arranged touchpad. The method includes displaying a content item on the one or more display devices, receiving a touch input on the touchpad corresponding to a send instruction, displaying a carousel of potential recipients, receiving a horizontal touch input on the touchpad, scrolling the carousel left or right on the one or more display devices in response to the horizontal touch input, receiving a tap touch input on the touchpad to select a particular recipient, receiving a further touch input, and in response to the further touch input, transmitting the content item to the selected recipient.

Abstract: In an example implementation, a method includes receiving, at a computing device, borrower information and requested financing plan information. Likewise, a method includes outputting at least a portion of the received information to a second computing device and, after receiving an indication of a decision denying the requested financing plan, outputting at least a portion of the received information to a computing device associated with a lender and confirming, to a computing device associated with a borrower or a merchant that the information has been sent to the lender.

Abstract: A rotisserie assembly connected to at least a portion of a rack of an oven, the rotisserie assembly including a main rod to receive food thereon, a first elevating rack connected to a first end of the main rod and disposed on the rack to elevate the main rod a distance away from the rack, a second elevating rack connected to a second end of the main rod and disposed on the rack to elevate the main rod the distance away from the rack, and a motor connected to at least a portion of the first elevating rack to rotate the main rod in response to rotation of the motor.

Abstract: Techniques for overmolding a composition onto a substrate are disclosed. More particularly but not exclusively, techniques for overmolding a therapeutic composition onto a substrate configured for delivery of the composition to teeth and/or oral tissue are disclosed. The overmolding techniques may include injection molding the therapeutic composition onto the substrate, and the therapeutic composition may include one or more therapeutic agents effective for treating one or more oral conditions.