Patents by Inventor Kyle S. Mayer

Kyle S. Mayer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnect structures for preventing solder bridging, and associated systems and methods
    Patent number: 10950565
    Abstract: Semiconductor dies having interconnect structures formed thereon, and associated systems and methods, are disclosed herein. In one embodiment, an interconnect structure includes a conductive material electrically coupled to an electrically conductive contact of a semiconductor die. The conductive material includes a first portion vertically aligned with the conductive contact, and a second portion that extends laterally away from the conductive contact. A solder material is disposed on the second portion of the interconnect structure such that the solder material is at least partially laterally offset from the conductive contact of the semiconductor die. In some embodiments, an interconnect structure can further include a containment layer that prevents wicking or other undesirable movement of the solder material during a reflow process.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: March 16, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Kyle S. Mayer, Owen R. Fay
  • INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIATED SYSTEMS AND METHODS
    Publication number: 20200203297
    Abstract: Semiconductor dies having interconnect structures formed thereon, and associated systems and methods, are disclosed herein. In one embodiment, an interconnect structure includes a conductive material electrically coupled to an electrically conductive contact of a semiconductor die. The conductive material includes a first portion vertically aligned with the conductive contact, and a second portion that extends laterally away from the conductive contact. A solder material is disposed on the second portion of the interconnect structure such that the solder material is at least partially laterally offset from the conductive contact of the semiconductor die. In some embodiments, an interconnect structure can further include a containment layer that prevents wicking or other undesirable movement of the solder material during a reflow process.
    Type: Application
    Filed: March 5, 2020
    Publication date: June 25, 2020
    Inventors: Kyle S. Mayer, Owen R. Fay
  • Interconnect structures for preventing solder bridging, and associated systems and methods
    Patent number: 10600750
    Abstract: Semiconductor dies having interconnect structures formed thereon, and associated systems and methods, are disclosed herein. In one embodiment, an interconnect structure includes a conductive material electrically coupled to an electrically conductive contact of a semiconductor die. The conductive material includes a first portion vertically aligned with the conductive contact, and a second portion that extends laterally away from the conductive contact. A solder material is disposed on the second portion of the interconnect structure such that the solder material is at least partially laterally offset from the conductive contact of the semiconductor die. In some embodiments, an interconnect structure can further include a containment layer that prevents wicking or other undesirable movement of the solder material during a reflow process.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: March 24, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Kyle S. Mayer, Owen R. Fay
  • INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIATED SYSTEMS AND METHODS
    Publication number: 20190198470
    Abstract: Semiconductor dies having interconnect structures formed thereon, and associated systems and methods, are disclosed herein. In one embodiment, an interconnect structure includes a conductive material electrically coupled to an electrically conductive contact of a semiconductor die. The conductive material includes a first portion vertically aligned with the conductive contact, and a second portion that extends laterally away from the conductive contact. A solder material is disposed on the second portion of the interconnect structure such that the solder material is at least partially laterally offset from the conductive contact of the semiconductor die. In some embodiments, an interconnect structure can further include a containment layer that prevents wicking or other undesirable movement of the solder material during a reflow process.
    Type: Application
    Filed: November 7, 2018
    Publication date: June 27, 2019
    Inventors: Kyle S. Mayer, Owen R. Fay
  • Interconnect structures for preventing solder bridging, and associated systems and methods
    Patent number: 10297561
    Abstract: Semiconductor dies having interconnect structures formed thereon, and associated systems and methods, are disclosed herein. In one embodiment, an interconnect structure includes a conductive material electrically coupled to an electrically conductive contact of a semiconductor die. The conductive material includes a first portion vertically aligned with the conductive contact, and a second portion that extends laterally away from the conductive contact. A solder material is disposed on the second portion of the interconnect structure such that the solder material is at least partially laterally offset from the conductive contact of the semiconductor die. In some embodiments, an interconnect structure can further include a containment layer that prevents wicking or other undesirable movement of the solder material during a reflow process.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: May 21, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Kyle S. Mayer, Owen R. Fay