Patents by Inventor Kyle Shan

Kyle Shan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240186228
    Abstract: In one embodiment, an integrated circuit package substrate includes a core layer comprising a dielectric material and a plurality of metal vias within the core layer. The dielectric material includes Silicon, Oxygen, and at least one of Boron or Phosphorus. The metal vias electrically couple a first side of the core layer and a second side of the core layer opposite the first side. The package substrate further includes a plurality of build-up layers on the core layer, the build-up layers comprising metal vias electrically connected to the metal vias of the core layer.
    Type: Application
    Filed: December 2, 2022
    Publication date: June 6, 2024
    Applicant: Intel Corporation
    Inventors: Haobo Chen, Bohan Shan, Kyle J. Arrington, Yiqun Bai, Kristof Darmawikarta, Gang Duan, Jeremy D. Ecton, Hongxia Feng, Xiaoying Guo, Ziyin Lin, Brandon Christian Marin, Bai Nie, Srinivas V. Pietambaram, Dingying Xu
  • Publication number: 20240186227
    Abstract: In one embodiment, an integrated circuit package substrate includes a core layer comprising a plurality of metal vias electrically coupling a first side of the core layer and a second side of the core layer opposite the first side. The package substrate further includes a build-up layer on the first side of the core layer, the build-up layer comprising metal vias within a dielectric material and electrically connected to the metal vias of the core layer. The dielectric material includes Silicon, Oxygen, and at least one of Boron or Phosphorus.
    Type: Application
    Filed: December 2, 2022
    Publication date: June 6, 2024
    Applicant: Intel Corporation
    Inventors: Haobo Chen, Bohan Shan, Kyle J. Arrington, Kristof Darmawikarta, Gang Duan, Jeremy D. Ecton, Hongxia Feng, Xiaoying Guo, Ziyin Lin, Brandon Christian Marin, Srinivas V. Pietambaram, Dingying Xu
  • Publication number: 20240112971
    Abstract: An integrated circuit (IC) device comprises a substrate comprising a glass core. The glass core comprises a first surface and a second surface opposite the first surface, and a first sidewall between the first surface and the second surface. The glass core may include a conductor within a through-glass via extending from the first surface to the second surface and a build-up layer. The glass cord comprises a plurality of first areas of the glass core and a plurality of laser-treated areas on the first sidewall. A first one of the plurality of laser-treated areas may be spaced away from a second one of the plurality of laser-treated areas. A first area may comprise a first nanoporosity and a laser-treated area may comprise a second nanoporosity, wherein the second nanoporosity is greater than the first nanoporosity.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Applicant: Intel Corporation
    Inventors: Yiqun Bai, Dingying Xu, Srinivas Pietambaram, Hongxia Feng, Gang Duan, Xiaoying Guo, Ziyin Lin, Bai Nie, Haobo Chen, Kyle Arrington, Bohan Shan
  • Publication number: 20240071848
    Abstract: Embodiments disclosed herein include package substrates. In an embodiment, the package substrate comprises a core, where the core comprises glass. In an embodiment, a first layer is under the core, a second layer is over the core, and a via is through the core, the first layer, and the second layer. In an embodiment a width of the via through the core is equal to a width of the via through the first layer and the second layer. In an embodiment, the package substrate further comprises a first pad under the via, and a second pad over the via.
    Type: Application
    Filed: August 25, 2022
    Publication date: February 29, 2024
    Inventors: Bohan SHAN, Haobo CHEN, Brandon C. MARIN, Srinivas V. PIETAMBARAM, Bai NIE, Gang DUAN, Kyle ARRINGTON, Ziyin LIN, Hongxia FENG, Yiqun BAI, Xiaoying GUO, Dingying David XU, Jeremy D. ECTON, Kristof DARMAWIKARTA, Suddhasattwa NAD
  • Patent number: 11455518
    Abstract: Systems and methods are described for user classification with semi-supervised machine learning. The systems and methods may include receiving user information for a first set of users, receiving survey data for a second set of users wherein the second set of users is a proper subset of the first set of users, training a first neural network and a second neural network based on the second set of users, mapping the user information for the first set of users to the embedding space using the first neural network, predicting category membership propensities for the first set of users using a low-density separation algorithm on the user information for the first set of users mapped to the embedding space, updating the first neural network and the second neural network based on the prediction, and reclassifying the first set of users based on the updated first neural network and the updated second neural network.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: September 27, 2022
    Assignee: ADOBE INC.
    Inventors: Michael Burkhart, Kyle Shan
  • Publication number: 20210142152
    Abstract: Systems and methods are described for user classification with semi-supervised machine learning. The systems and methods may include receiving user information for a first set of users, receiving survey data for a second set of users wherein the second set of users is a proper subset of the first set of users, training a first neural network and a second neural network based on the second set of users, mapping the user information for the first set of users to the embedding space using the first neural network, predicting category membership propensities for the first set of users using a low-density separation algorithm on the user information for the first set of users mapped to the embedding space, updating the first neural network and the second neural network based on the prediction, and reclassifying the first set of users based on the updated first neural network and the updated second neural network.
    Type: Application
    Filed: November 12, 2019
    Publication date: May 13, 2021
    Inventors: MICHAEL BURKHART, Kyle Shan