Patents by Inventor Kyle Springer

Kyle Springer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for vacuum encapsulation of semiconductor chip packages
    Patent number: 6769893
    Abstract: A multi-chamber vacuum encapsulation system for encapsulation of semiconductor chip packages. The encapsulation system includes a dispense chamber, an inlet chamber mounted adjacent an inlet end of the dispense chamber, and an outlet chamber mounted adjacent an outlet end of the dispense chamber. The dispense chamber includes a material dispensing head for dispensing encapsulant material about the peripheral edges of chip packages under at least partial vacuum of the dispense chamber. A transport mechanism is provided in the dispense chamber for moving the chip packages between the inlet and outlet ends of the chamber. Methods of vacuum encapsulating semiconductor chip packages are also disclosed.
    Type: Grant
    Filed: July 3, 2001
    Date of Patent: August 3, 2004
    Assignee: Nordson Corporation
    Inventors: Eric Austin, Steve Majgier, David Padgett, Kyle Springer
  • Apparatus and method for vacuum encapsulation of semiconductor chip packages
    Publication number: 20010040306
    Abstract: A multi-chamber vacuum encapsulation system for encapsulation of semiconductor chip packages. The encapsulation system includes a dispense chamber, an inlet chamber mounted adjacent an inlet end of the dispense chamber, and an outlet chamber mounted adjacent an outlet end of the dispense chamber. The dispense chamber includes a material dispensing head for dispensing encapsulant material about the peripheral edges of chip packages under at least partial vacuum of the dispense chamber. A transport mechanism is provided in the dispense chamber for moving the chip packages between the inlet and outlet ends of the chamber. During the encapsulation process, the dispense chamber remains evacuated at all times while the smaller inlet and outlet chambers are evacuated and vented in a controlled manner to allow transfer of chip packages to and from the dispense chamber without venting of the dispense chamber to atmosphere.
    Type: Application
    Filed: July 3, 2001
    Publication date: November 15, 2001
    Applicant: Nordson Corporation
    Inventors: Eric Austin, Steve Majgier, David Padgett, Kyle Springer
  • Method for vacuum encapsulation of semiconductor chip packages
    Patent number: 6284173
    Abstract: A multi-chamber vacuum encapsulation system for encapsulation of semiconductor chip packages. The encapsulation system includes a dispense chamber, an inlet chamber mounted adjacent an inlet end of the dispense chamber, and an outlet chamber mounted adjacent an outlet end of the dispense chamber. The dispense chamber includes a material dispensing head for dispensing encapsulant material about the peripheral edges of chip packages under at least partial vacuum of the dispense chamber. A transport mechanism is provided in the dispense chamber for moving the chip packages between the inlet and outlet ends of the chamber. During the encapsulation process, the dispense chamber remains evacuated at all times while the smaller inlet and outlet chambers are evacuated and vented in a controlled manner to allow transfer of chip packages to and from the dispense chamber without venting of the dispense chamber to atmosphere.
    Type: Grant
    Filed: May 28, 1999
    Date of Patent: September 4, 2001
    Assignee: Nordson Corporation
    Inventors: Eric Austin, Steve Majgier, David Padgett, Kyle Springer