Abstract: A method for rerouting communication in a unified communications network. The method comprises: receiving, at a disaster plan server, a mapping of an original telephony number to a substitute telephony number; storing, at the disaster plan server, the mapping between the original telephony number and the substitute telephone number as part of a disaster plan; receiving, at a disaster plan server, a request to activate the disaster plan; transmitting, from the disaster plan server to a routing server, a message to activate the disaster plan based on receiving the request to activate the disaster plan; revising, at the routing server, routing details to the original telephony number based on the disaster plan; and routing, at a session border controller, a call to the original telephony number to a new destination based on the revised routing details associated with the disaster plan.

Abstract: A secondary control system configured to be provided between a primary control system and at least part of a main system, wherein the primary control system is configured to provide control instructions to the main system, the secondary control system comprising: a monitoring module to determine a current state and/or a future state of the main system; a control switching module configured to switch control of the main system from the primary control system to the secondary control system, wherein the control switching module is configured to: allow the control instructions from the primary control system to be provided to the main system, prevent the control instructions from being provided to the main system, or provide alternative control instructions to the main system.

Abstract: Global shutter image sensors, imaging systems, and methods for operating global shutter image sensor. The global shutter image sensor includes a pixel array and a controller. The pixel array includes a correction pixel and a plurality of image pixels positioned around the correction pixel. The correction pixel and each of the plurality of image pixels include a photodetector, a storage diode, and a frame transfer transistor. The photodetector is configured to accumulate charge in response to incident light. The frame transfer transistor is coupled between the photodetector and the storage diode. The first row driver coupled to the frame transfer transistor in each of the plurality of image pixels. The second row driver coupled to the frame transfer transistor in the correction pixel.

Abstract: An apparatus 10 for performing a medical procedure includes a co-extruded inflatable balloon 13 having an outer layer 13a and an inner layer 13b comprising different materials and a shaft 11 comprising a material compatible the inner layer of the balloon and welded thereto. An inflatable balloon is also provided having an outer layer comprising a polyester and an inner layer comprising a polyamide, as is an apparatus combining an inflatable balloon comprising a polyester and a shaft comprising a polyester connected to the inflatable balloon. Related methods are also disclosed.

Abstract: Global shutter image sensors, imaging systems, and methods for operating global shutter image sensor. The global shutter image sensor includes a pixel array and a controller. The pixel array includes a correction pixel and a plurality of image pixels positioned around the correction pixel. The correction pixel and each of the plurality of image pixels include a photodetector, a storage diode, and a frame transfer transistor. The photodetector is configured to accumulate charge in response to incident light. The frame transfer transistor is coupled between the photodetector and the storage diode. The first row driver coupled to the frame transfer transistor in each of the plurality of image pixels. The second row driver coupled to the frame transfer transistor in the correction pixel.

Abstract: A method for rerouting communication in a unified communications network is disclosed. The method includes receiving an inbound call at a first session border controller and determining a redirect number mapped to the inbound call number. The inbound call can be routed to a first call destination based on the redirect number. During the inbound call, a transfer request may be received from a server associated with the first call destination, and a new destination number may be determined for transferring the inbound call. An out-of-band transfer request may be transmitted to one or more servers maintaining the inbound call, and one or more connections associated with the inbound call to the first call destination may be dropped based on the out-of-band transfer request. The inbound call may then be rerouted to a second call destination based on the new destination number identified in the out-of-band transfer request.

Abstract: An ergonomically designed handle for cleaning machines and other applications may be provided as original equipment or as a retrofit item to minimize physical effort and discomfort while maximizing efficiency during the operation and transport of cleaning machines. The handle of this invention may be conveniently mounted and assembled onto the existing handle structure of the cleaning machine and once installed, provides an ergonomic grip for a variety of user profiles to reduce strain and discomfort when operating and transporting the cleaning machine. The handle has two mounting plates each with a handlebar mounted thereto.

Abstract: A method for rerouting communication in a unified communications network is disclosed. The method includes receiving an inbound call at a first session border controller and determining a redirect number mapped to the inbound call number. The inbound call can be routed to a first call destination based on the redirect number. During the inbound call, a transfer request may be received from a server associated with the first call destination, and a new destination number may be determined for transferring the inbound call. An out-of-band transfer request may be transmitted to one or more servers maintaining the inbound call, and one or more connections associated with the inbound call to the first call destination may be dropped based on the out-of-band transfer request. The inbound call may then be rerouted to a second call destination based on the new destination number identified in the out-of-band transfer request.

Abstract: An apparatus for forming a catheter includes a catheter shaft and a hub including at least one connector for irremovably connecting the catheter shaft to the hub. The catheter shaft may engage one or more push connectors captured within a passage in the hub. Related are methods of manufacturing a catheter hub, including connecting first and second generally symmetrical halves of a hub over a connector, and then inserting a catheter shaft into the connector, such as by pushing it through a ring with inwardly directed fingers to form a secure locking engagement.

Abstract: Implementations of semiconductor packages may include: a digital signal processor having a first side and a second side and an image sensor array, having a first side and a second side. The first side of the image sensor array may be coupled to the second side of the digital signal processor through a plurality of hybrid bond interconnect (HBI) bond pads and an edge seal. One or more openings may extend from the second side of the image sensor array into the second side of the digital signal processor to an etch stop layer in the second side of the digital signal processor. The one or more openings may form a second edge seal between the plurality of HBI bond pads and the edge of the digital signal processor.

Abstract: A method for rerouting communication in a unified communications network. The method comprises: receiving, at a disaster plan server, a mapping of an original telephony number to a substitute telephony number; storing, at the disaster plan server, the mapping between the original telephony number and the substitute telephone number as part of a disaster plan; receiving, at a disaster plan server, a request to activate the disaster plan; transmitting, from the disaster plan server to a routing server, a message to activate the disaster plan based on receiving the request to activate the disaster plan; revising, at the routing server, routing details to the original telephony number based on the disaster plan; and routing, at a session border controller, a call to the original telephony number to a new destination based on the revised routing details associated with the disaster plan.

Abstract: A method for rerouting communication in a unified communications network is disclosed. The method includes receiving an inbound call at a first session border controller and determining a redirect number mapped to the inbound call number. The inbound call can be routed to a first call destination based on the redirect number. During the inbound call, a transfer request may be received from a server associated with the first call destination, and a new destination number may be determined for transferring the inbound call. An out-of-band transfer request may be transmitted to one or more servers maintaining the inbound call, and one or more connections associated with the inbound call to the first call destination may be dropped based on the out-of-band transfer request. The inbound call may then be rerouted to a second call destination based on the new destination number identified in the out-of-band transfer request.

Abstract: Implementations of semiconductor packages may include: a digital signal processor having a first side and a second side and an image sensor array, having a first side and a second side. The first side of the image sensor array may be coupled to the second side of the digital signal processor through a plurality of hybrid bond interconnect (HBI) bond pads and an edge seal. One or more openings may extend from the second side of the image sensor array into the second side of the digital signal processor to an etch stop layer in the second side of the digital signal processor. The one or more openings may form a second edge seal between the plurality of HBI bond pads and the edge of the digital signal processor.

Abstract: Implementations of semiconductor packages may include: a digital signal processor having a first side and a second side and an image sensor array, having a first side and a second side. The first side of the image sensor array may be coupled to the second side of the digital signal processor through a plurality of hybrid bond interconnect (HBI) bond pads and an edge seal. One or more openings may extend from the second side of the image sensor array into the second side of the digital signal processor to an etch stop layer in the second side of the digital signal processor. The one or more openings may form a second edge seal between the plurality of HBI bond pads and the edge of the digital signal processor.

Abstract: Implementations of semiconductor packages may include: a digital signal processor having a first side and a second side and an image sensor array, having a first side and a second side. The first side of the image sensor array may be coupled to the second side of the digital signal processor through a plurality of hybrid bond interconnect (HBI) bond pads and an edge seal. One or more openings may extend from the second side of the image sensor array into the second side of the digital signal processor to an etch stop layer in the second side of the digital signal processor. The one or more openings may form a second edge seal between the plurality of HBI bond pads and the edge of the digital signal processor.

Abstract: Implementations of semiconductor packages may include: a digital signal processor having a first side and a second side and an image sensor array, having a first side and a second side. The first side of the image sensor array may be coupled to the second side of the digital signal processor through a plurality of hybrid bond interconnect (HBI) bond pads and an edge seal. One or more openings may extend from the second side of the image sensor array into the second side of the digital signal processor to an etch stop layer in the second side of the digital signal processor. The one or more openings may form a second edge seal between the plurality of HBI bond pads and the edge of the digital signal processor.

Abstract: Implementations of semiconductor packages may include: a digital signal processor having a first side and a second side and an image sensor array, having a first side and a second side. The first side of the image sensor array may be coupled to the second side of the digital signal processor through a plurality of hybrid bond interconnect (HBI) bond pads and an edge seal. One or more openings may extend from the second side of the image sensor array into the second side of the digital signal processor to an etch stop layer in the second side of the digital signal processor. The one or more openings may form a second edge seal between the plurality of HBI bond pads and the edge of the digital signal processor.

Abstract: An electronic device may include a sensing circuit and a current subtraction circuit. The sensing circuit may output first and second current signals. The current subtraction circuit may mirror the first and second current signals onto first and second current branches. The second current branch may be split into a first sub-path and a second sub-path. An amplifier may control the amount of current flowing through the second sub-path by forcing the current flowing through the first current branch and the current flowing through the first sub-path to be identical. Configured in this way, the current flowing through the second sub-path will be equal to the difference between the first and second current signals. The current flowing through the second sub-path may be optionally amplified using another current mirror.

Abstract: Implementations of semiconductor packages may include: a digital signal processor having a first side and a second side and an image sensor array, having a first side and a second side. The first side of the image sensor array may be coupled to the second side of the digital signal processor through a plurality of hybrid bond interconnect (HBI) bond pads and an edge seal. One or more openings may extend from the second side of the image sensor array into the second side of the digital signal processor to an etch stop layer in the second side of the digital signal processor. The one or more openings may form a second edge seal between the plurality of HBI bond pads and the edge of the digital signal processor.

Abstract: An electronic device may include a sensing circuit and a current subtraction circuit. The sensing circuit may output first and second current signals. The current subtraction circuit may mirror the first and second current signals onto first and second current branches. The second current branch may be split into a first sub-path and a second sub-path. An amplifier may control the amount of current flowing through the second sub-path by forcing the current flowing through the first current branch and the current flowing through the first sub-path to be identical. Configured in this way, the current flowing through the second sub-path will be equal to the difference between the first and second current signals. The current flowing through the second sub-path may be optionally amplified using another current mirror.