Patents by Inventor Kyle W. Kippes

Kyle W. Kippes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6894908
    Abstract: A bridge clip with a leaf holds an integrated heat spreader on a die during curing. The leaf may have at least two metal portions with different coefficients of thermal expansion (CTE) to exert a changing force on the heat spreader over temperature. The die may be coupled to the heat spreader with a polymer interface material which is cured at an elevated temperature. In embodiments in which the die is located off-center under the heat spreader, the clip may exert an off-center force on the heat spreader when curing at the elevated temperature due to the differing CTEs. In other embodiments, in which the die is located toward the center of the heat spreader, a leaf with two layers having different CTEs may help reduce variable contact geometry, which may be especially helpful in higher force situations.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: May 17, 2005
    Assignee: Intel Corporation
    Inventors: Bruno Clark, Kyle W. Kippes
  • Patent number: 6700782
    Abstract: A clip which can be used to retain a component assembly in a carrier during pick-and-place and thermal assembly operations is provided. The clip comprises an elongate bridgepiece having opposed ends; a pair of legs, each depending from one of the opposed ends of the bridgepiece, the legs being shaped in dimensions to mate with complementary apertures in the carrier to releasably lock the bridgepiece to the carrier at a fixed height therefrom; and a plurality of deformable formations on an underside of the bridgepiece in between the legs, the deformable formations being shaped, dimensioned, and positioned to deform when brought to bear against a component in the carrier in a manner that regularly inward forces are applied to the component along at least two intersecting axes, the forces being symmetrically distributed with respect to the component.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: March 2, 2004
    Assignee: Intel Corporation
    Inventors: Timothy F. Bopp, Kyle W. Kippes