Abstract: An apparatus for detecting an obstruction in a conduit structure, the apparatus includes a sleeve portion, a plurality of sensor cells, a primary termination cap, and a secondary termination cap. The plurality of sensor cells coupled to the sleeve portion, wherein each sensor cell from the plurality of sensor cells is electrically coupled to the primary termination cap and the secondary termination cap. The sleeve portion configured to wrap around a conduit structure, wherein each sensor cell from the plurality of sensor cells is directed to an exterior surface of the conduit structure. The primary termination cap electrically and mechanically coupled to a first end of the sleeve portion, wherein the primary termination cap includes Wi-Fi transmitter, a primary microcontroller, and a power source connection. The secondary termination cap electrically and mechanically coupled to a second end of the sleeve portion to short the plurality of sensor cells.

Abstract: An apparatus for detecting an obstruction in a conduit structure, the apparatus includes a sleeve portion, a plurality of sensor cells, a primary termination cap, and a secondary termination cap. The plurality of sensor cells coupled to the sleeve portion, wherein each sensor cell from the plurality of sensor cells is electrically coupled to the primary termination cap and the secondary termination cap. The sleeve portion configured to wrap around a conduit structure, wherein each sensor cell from the plurality of sensor cells is directed to an exterior surface of the conduit structure. The primary termination cap electrically and mechanically coupled to a first end of the sleeve portion, wherein the primary termination cap includes Wi-Fi transmitter, a primary microcontroller, and a power source connection. The secondary termination cap electrically and mechanically coupled to a second end of the sleeve portion to short the plurality of sensor cells.

Abstract: A pin assembly is provided for a plated via of a circuit board. The pin assembly includes a pin sized for insertion into the plated via, and a plurality of expandable elements affixed to the pin. A conductive coating is disposed over the pin and over the plurality of expandable elements. With the pin assembly inserted into the plated via, one or more expandable elements of the plurality of expandable elements can be expanded within the plated via to enhance contact of the pin assembly to a wall of the plated via.

Abstract: A method of managing a component manufacturer warranty information is provided. The method may include collecting vital product data (VPD) of an array of components in a server into a database, where the VPD includes at least one of a component manufacturer name, a component manufacturer part number, a component serial number, a component firmware level, a component manufacturer warranty length, a warranty begin date, a warranty end date, a component replacement cost, monitoring the array of components for a failing component, confirming the failing component is covered under the component manufacturer warranty, determining a cost effectiveness for a repair action and a delay repair action, and initiating a service call based on the determined cost effectiveness.

Abstract: A method of managing a component manufacturer warranty information is provided. The method may include collecting vital product data (VPD) of an array of components in a server into a database, where the VPD includes at least one of a component manufacturer name, a component manufacturer part number, a component serial number, a component firmware level, a component manufacturer warranty length, a warranty begin date, a warranty end date, a component replacement cost, monitoring the array of components for a failing component, confirming the failing component is covered under the component manufacturer warranty, determining a cost effectiveness for a repair action and a delay repair action, and initiating a service call based on the determined cost effectiveness.