Abstract: A method of controlling vacuum pressure for vehicle braking may include checking whether a vehicle is idle or enters a deceleration state, comparing an engine vacuum pressure and a booster vacuum pressure of the vehicle with a preset reference value, checking whether a valve control system of the vehicle is operable when the engine vacuum pressure and the booster vacuum pressure are lower less than the preset reference value, controlling the valve control system when the valve control system is operable; and controlling an air conditioner (A/C) or an alternator of the vehicle when the valve control system is inoperable.

Abstract: A printed circuit board (PCB) including an embedded electronic component is provided. The printed circuit board includes a core having a cavity, an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces, insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity, and an external circuit pattern provided on the insulating layers.

Abstract: A method of controlling vacuum pressure for vehicle braking may include checking whether a vehicle is idle or enters a deceleration state, comparing an engine vacuum pressure and a booster vacuum pressure of the vehicle with a preset reference value, checking whether a valve control system of the vehicle is operable when the engine vacuum pressure and the booster vacuum pressure are lower less than the preset reference value, controlling the valve control system when the valve control system is operable; and controlling an air conditioner (A/C) or an alternator of the vehicle when the valve control system is inoperable.

Abstract: Exemplary embodiments provide a computer-implemented method of enabling a recommendation of a software to a user from a software marketplace based on activities of the user's friend of an internet-based social network who is related to the first user within the confines of the social network, said user maintaining an internet-based social network account, the method comprising: receiving, from the first user, a selection of an interface associated with the software marketplace, generating, by a computer-implemented recommendation system, a list of recommended software based on the internet-based social network into which the first user is logged into, sending the list of the of recommended software to the first user, wherein the computer-implemented recommendation system retrieves the information of the user's friend and assigns a weight to a post not displayed based on an attribute thereof.

Abstract: A vehicle electronic module is provided. The vehicle electronic module has a reduced size and improved productivity by replacing a sensor and an offset unit of an electromagnetic interference (EMI) filter module with a printed circuit board (PCB) winding structure. The electronic module includes a sensor that detects EMI noise of a power line and an offset unit that transmits an offset voltage for removing the EMI noise to the power line. A controller is configured to generate the offset voltage that corresponds to the EMI noise detected by the sensor. Then sensor and the offset unit are formed in a stacked structure of the PCB.

Abstract: A substrate for a camera module includes: a first substrate; an image sensor installed on the first substrate and a memory chip installed to be embedded in the first substrate. The first substrate includes a soft substrate portion disposed at a central portion of the first substrate, and a hard substrate portion formed on upper and lower portions of the soft substrate portion, and at least a portion of the memory chip is disposed in an installation hole formed in the soft substrate portion.

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; a pattern layer disposed on the encapsulant and covering at least portions of the encapsulant adjacent to the inactive surface of the semiconductor chip; vias penetrating through the encapsulant and connecting the pattern layer and the inactive surface of the semiconductor chip to each other; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip.

Abstract: A vehicle electronic module is provided. The vehicle electronic module has a reduced size and improved productivity by replacing a sensor and an offset unit of an electromagnetic interference (EMI) filter module with a printed circuit board (PCB) winding structure. The electronic module includes a sensor that detects EMI noise of a power line and an offset unit that transmits an offset voltage for removing the EMI noise to the power line. A controller is configured to generate the offset voltage that corresponds to the EMI noise detected by the sensor. Then sensor and the offset unit are formed in a stacked structure of the PCB.

Abstract: Disclosed herein is a printed circuit board (PCB) including an embedded electronic component, including: a core having a cavity; an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces; insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity; and an external circuit pattern provided on the insulating layers.

Abstract: A method of selecting a target candidate among user devices to which an advertisement content is provided including: receiving, by a data receiving unit of a first server from each user device, a unique data including device identification information and application information of each application installed in the user device; confirming, by the first server for each user device, the application installed in the user device from the unique data; applying, by the first server for each user device, an application weight to each application installed in the user device, the application weight being different for each application; summing, by the first server for each user device, the application weights applied to each installed application, and calculating a score of the user device based on the sum of the application weights; and selecting at least one of the user devices as the target candidate based on the score.

Abstract: Disclosed herein is a printed circuit board (PCB) including an embedded electronic component, including: a core having a cavity; an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces; insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity; and an external circuit pattern provided on the insulating layers.

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; a pattern layer disposed on the encapsulant and covering at least portions of the encapsulant adjacent to the inactive surface of the semiconductor chip; vias penetrating through the encapsulant and connecting the pattern layer and the inactive surface of the semiconductor chip to each other; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip.

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; a pattern layer disposed on the encapsulant and covering at least portions of the encapsulant adjacent to the inactive surface of the semiconductor chip; vias penetrating through the encapsulant and connecting the pattern layer and the inactive surface of the semiconductor chip to each other; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip.

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; a pattern layer disposed on the encapsulant and covering at least portions of the encapsulant adjacent to the inactive surface of the semiconductor chip; vias penetrating through the encapsulant and connecting the pattern layer and the inactive surface of the semiconductor chip to each other; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip.

Abstract: A substrate for a camera module includes: a first substrate; an image sensor installed on the first substrate and a memory chip installed to be embedded in the first substrate. The first substrate includes a soft substrate portion disposed at a central portion of the first substrate, and a hard substrate portion formed on upper and lower portions of the soft substrate portion, and at least a portion of the memory chip is disposed in an installation hole formed in the soft substrate portion.

Abstract: A circuit board includes an inorganic material insulating layer, a first circuit pattern layer formed on a surface of the inorganic material insulating layer, a first build-up insulating layer formed on the inorganic material insulating layer and formed of an organic material, and a second circuit pattern layer formed on a surface of the first build-up insulating layer.

Abstract: A circuit board includes an insulating material; and a heat-transfer structure comprising a plurality of heat-dissipating members and inserted in the insulating material, wherein the plurality of heat-dissipating members each includes a metal wire; and an insulating part disposed on an outer circumferential surface of the metal wire excluding a top surface and a bottom surface of the metal wire.

Abstract: A printed circuit board includes a core layer including a glass core, a first resin layer disposed on a first surface of the glass core, and a second resin layer formed on a second surface of the glass core; build-up layers disposed on the first and second surfaces of the core layer; and a conductive pattern formed in multiple layers on the build-up layers, wherein the core layer has asymmetric coefficients of thermal expansion opposing sides thereof with respect to a center of the glass core in a thickness direction.

Abstract: Disclosed herein are a printed circuit board including an electronic component embedded therein and a method for manufacturing the same. The printed circuit board including an electronic component embedded therein includes: a core formed with a cavity which is formed of a through hole and has a side wall formed with an inclined surface having a top and bottom symmetrically formed based on a central portion thereof; an electronic component embedded in the cavity; insulating layers stacked on upper and lower portions of the core including the electronic component; and external circuit layers formed on the insulating layers.

Abstract: Provided is a service method and system for providing a service by associating an application store (Appstore) with a timeline. A service method configured as a computer may include providing an Appstore service; providing a download page for an application provided by the Appstore; storing and maintaining information about a user registered to the Appstore service and friend information between the user and individuals having set a personal relationship with the user; enabling the user to select an application from among the applications provided by the Appstore and to upload a post through the Appstore service; and producing display content for a set of timelines, including a timeline of the user and timelines of the individuals having a set a personal relationship with the user, based on a user selection of the application and an uploading of a post relating to the selected application.