Patents by Inventor Kyo Go

Kyo Go has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10714415
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: July 14, 2020
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
  • Publication number: 20190221509
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Application
    Filed: March 20, 2019
    Publication date: July 18, 2019
    Applicants: RENESAS ELECTRONICS CORPORATION, RENESAS ELECTRONICS CORPORATION
    Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
  • Patent number: 10283444
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: May 7, 2019
    Assignee: Renesas Electronics Corporation
    Inventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
  • Publication number: 20180068936
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Application
    Filed: October 27, 2017
    Publication date: March 8, 2018
    Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
  • Patent number: 9831166
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: November 28, 2017
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
  • Publication number: 20170117216
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Application
    Filed: January 4, 2017
    Publication date: April 27, 2017
    Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
  • Patent number: 9576890
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: February 21, 2017
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
  • Publication number: 20160358846
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Application
    Filed: August 19, 2016
    Publication date: December 8, 2016
    Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
  • Patent number: 9496153
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: November 15, 2016
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
  • Patent number: 9449854
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: September 20, 2016
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
  • Publication number: 20160196987
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Application
    Filed: February 17, 2016
    Publication date: July 7, 2016
    Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
  • Patent number: 9299681
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: March 29, 2016
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
  • Publication number: 20150099331
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Application
    Filed: December 12, 2014
    Publication date: April 9, 2015
    Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
  • Patent number: 8928147
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substract, a semiconductor chip by which the flip chip was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: January 6, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
  • Publication number: 20140327137
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.
    Type: Application
    Filed: July 22, 2014
    Publication date: November 6, 2014
    Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
  • Patent number: 8822269
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Grant
    Filed: October 2, 2013
    Date of Patent: September 2, 2014
    Assignee: Renesas Electronics Corporation
    Inventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
  • Publication number: 20140038361
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Application
    Filed: October 2, 2013
    Publication date: February 6, 2014
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
  • Patent number: 8581410
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Grant
    Filed: April 15, 2013
    Date of Patent: November 12, 2013
    Assignee: Renesas Electronics Corporation
    Inventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
  • Patent number: 8575757
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: November 5, 2013
    Assignee: Renesas Electronics Corporation
    Inventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
  • Publication number: 20130228913
    Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
    Type: Application
    Filed: April 15, 2013
    Publication date: September 5, 2013
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA