Patents by Inventor Kyo Go
Kyo Go has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10714415Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: GrantFiled: March 20, 2019Date of Patent: July 14, 2020Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
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Publication number: 20190221509Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: ApplicationFiled: March 20, 2019Publication date: July 18, 2019Applicants: RENESAS ELECTRONICS CORPORATION, RENESAS ELECTRONICS CORPORATIONInventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
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Patent number: 10283444Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: GrantFiled: October 27, 2017Date of Patent: May 7, 2019Assignee: Renesas Electronics CorporationInventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
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Publication number: 20180068936Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: ApplicationFiled: October 27, 2017Publication date: March 8, 2018Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
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Patent number: 9831166Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: GrantFiled: January 4, 2017Date of Patent: November 28, 2017Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
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Publication number: 20170117216Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: ApplicationFiled: January 4, 2017Publication date: April 27, 2017Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
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Patent number: 9576890Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: GrantFiled: August 19, 2016Date of Patent: February 21, 2017Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
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Publication number: 20160358846Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: ApplicationFiled: August 19, 2016Publication date: December 8, 2016Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
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Patent number: 9496153Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: GrantFiled: February 17, 2016Date of Patent: November 15, 2016Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
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Patent number: 9449854Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: GrantFiled: February 17, 2016Date of Patent: September 20, 2016Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
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Publication number: 20160196987Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: ApplicationFiled: February 17, 2016Publication date: July 7, 2016Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
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Patent number: 9299681Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: GrantFiled: December 12, 2014Date of Patent: March 29, 2016Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
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Publication number: 20150099331Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: ApplicationFiled: December 12, 2014Publication date: April 9, 2015Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
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Patent number: 8928147Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substract, a semiconductor chip by which the flip chip was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: GrantFiled: July 22, 2014Date of Patent: January 6, 2015Assignee: Renesas Electronics CorporationInventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
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Publication number: 20140327137Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.Type: ApplicationFiled: July 22, 2014Publication date: November 6, 2014Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
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Patent number: 8822269Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: GrantFiled: October 2, 2013Date of Patent: September 2, 2014Assignee: Renesas Electronics CorporationInventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
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Publication number: 20140038361Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: ApplicationFiled: October 2, 2013Publication date: February 6, 2014Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
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Patent number: 8581410Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: GrantFiled: April 15, 2013Date of Patent: November 12, 2013Assignee: Renesas Electronics CorporationInventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
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Patent number: 8575757Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: GrantFiled: October 10, 2012Date of Patent: November 5, 2013Assignee: Renesas Electronics CorporationInventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
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Publication number: 20130228913Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: ApplicationFiled: April 15, 2013Publication date: September 5, 2013Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA