Patents by Inventor Kyo Horie
Kyo Horie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10715058Abstract: A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.Type: GrantFiled: May 18, 2017Date of Patent: July 14, 2020Assignee: Seiko Epson CorporationInventor: Kyo Horie
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Patent number: 9800224Abstract: An electronic device includes a heat generator having a terminal, a resonator which has an outer connection terminal and on which the heat generator is disposed, a first substrate having a first surface and a second surface with the resonator connected to the first surface, and a circuit part and other electronic parts disposed on the first surface or the second surface. The outer connection terminal of the resonator is connected to the first surface, and the terminal of the heat generator is connected to the second surface.Type: GrantFiled: February 2, 2016Date of Patent: October 24, 2017Assignee: SEIKO EPSON CORPORATIONInventors: Kazuhiko Shimodaira, Kyo Horie
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Publication number: 20170264214Abstract: A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.Type: ApplicationFiled: May 18, 2017Publication date: September 14, 2017Inventor: Kyo HORIE
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Patent number: 9685889Abstract: A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.Type: GrantFiled: May 2, 2014Date of Patent: June 20, 2017Assignee: Seiko Epson CorporationInventor: Kyo Horie
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Publication number: 20160156330Abstract: An electronic device includes a heat generator having a terminal, a resonator which has an outer connection terminal and on which the heat generator is disposed, a first substrate having a first surface and a second surface with the resonator connected to the first surface, and a circuit part and other electronic parts disposed on the first surface or the second surface. The outer connection terminal of the resonator is connected to the first surface, and the terminal of the heat generator is connected to the second surface.Type: ApplicationFiled: February 2, 2016Publication date: June 2, 2016Applicant: SEIKO EPSON CORPORATIONInventors: Kazuhiko SHIMODAIRA, Kyo HORIE
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Patent number: 9287881Abstract: An electronic device includes a heat generator having a terminal, a resonator which has an outer connection terminal and on which the heat generator is disposed, a first substrate having a first surface and a second surface with the resonator connected to the first surface, and a circuit part and other electronic parts disposed on the first surface or the second surface. The outer connection terminal of the resonator is connected to the first surface, and the terminal of the heat generator is connected to the second surface.Type: GrantFiled: June 12, 2014Date of Patent: March 15, 2016Assignee: SEIKO EPSON CORPORATIONInventors: Kazuhiko Shimodaira, Kyo Horie
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Patent number: 9176013Abstract: A sensor includes a flexible wafer substrate and an oscillator provided on a principal surface of the wafer substrate, and the oscillator deforms when an external force is applied to the wafer substrate.Type: GrantFiled: October 3, 2013Date of Patent: November 3, 2015Assignee: Seiko Epson CorporationInventors: Shogo Inaba, Kyo Horie
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Patent number: 9160254Abstract: A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.Type: GrantFiled: January 13, 2014Date of Patent: October 13, 2015Assignee: Seiko Epson CorporationInventor: Kyo Horie
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Patent number: 9054604Abstract: A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.Type: GrantFiled: May 31, 2013Date of Patent: June 9, 2015Assignee: Seiko Epson CorporationInventor: Kyo Horie
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Publication number: 20140368283Abstract: An electronic device includes a heat generator having a terminal, a resonator which has an outer connection terminal and on which the heat generator is disposed, a first substrate having a first surface and a second surface with the resonator connected to the first surface, and a circuit part and other electronic parts disposed on the first surface or the second surface. The outer connection terminal of the resonator is connected to the first surface, and the terminal of the heat generator is connected to the second surface.Type: ApplicationFiled: June 12, 2014Publication date: December 18, 2014Inventors: Kazuhiko SHIMODAIRA, Kyo HORIE
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Publication number: 20140239773Abstract: A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.Type: ApplicationFiled: May 2, 2014Publication date: August 28, 2014Applicant: Seiko Epson CorporationInventor: Kyo HORIE
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Patent number: 8754718Abstract: A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.Type: GrantFiled: August 25, 2011Date of Patent: June 17, 2014Assignee: Seiko Epson CorporationInventor: Kyo Horie
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Publication number: 20140125420Abstract: A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.Type: ApplicationFiled: January 13, 2014Publication date: May 8, 2014Applicant: Seiko Epson CorporationInventor: Kyo HORIE
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Publication number: 20140102217Abstract: A sensor includes a flexible wafer substrate and an oscillator provided on a principal surface of the wafer substrate, and the oscillator deforms when an external force is applied to the wafer substrate.Type: ApplicationFiled: October 3, 2013Publication date: April 17, 2014Applicant: Seiko Epson CorporationInventors: Shogo Inaba, Kyo Horie
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Publication number: 20130308286Abstract: A manufacturing method according to an embodiment of the invention includes a first step of providing a sheet substrate having a piezoelectric resonator element and an integrated circuit disposed on a mounting surface of each substrate region, having implementation electrodes that are electrically connected to the integrated circuit disposed the side facing away from the mounting surface, and disposing wiring lines on the sheet substrate, the wiring liens electrically connecting the piezoelectric resonator element disposed in a first substrate region to the implementation electrode in a second substrate region in the vicinity of the piezoelectric resonator element, a second step of inputting and outputting a signal to and from the piezoelectric resonator element in the first substrate region via the implementation electrodes connected to the wiring lines, and a third step of dividing the sheet substrate along the substrate regions to cut the wiring lines.Type: ApplicationFiled: May 9, 2013Publication date: November 21, 2013Applicant: Seiko Epson CorporationInventor: Kyo HORIE
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Publication number: 20130307560Abstract: A sheet substrate includes a plurality of substrate regions arranged in a matrix, an integrated circuit disposed in each of the substrate regions, and a first implementation electrode and a second implementation electrode disposed in each of the substrate regions and electrically connected to the integrated circuit. The sheet substrate according to an embodiment of the invention further includes first terminals to each of which the first implementation electrodes arranged in a row of part of the substrate regions are connected in parallel to each other and second terminals to each of which the second implementation electrodes arranged in a column of part of the substrate regions and can activate an arbitrary one of the integrated circuits that is specified by selected ones of the first terminals and the second terminals.Type: ApplicationFiled: May 13, 2013Publication date: November 21, 2013Applicant: Seiko Epson CorporationInventor: Kyo HORIE
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Publication number: 20130300447Abstract: A manufacturing method for an electronic component includes arranging, across boundaries of a first substrate region, wires for electrically connecting a piezoelectric resonator element arranged in the first substrate region and a lid arranged in a second substrate regions to a sheet substrate, performing, after arranging the piezoelectric resonator element and the lid in the substrate regions, input and output of a signal to and from the piezoelectric resonator element via the lid connected to the wires, and dividing the sheet substrate in each of the boundaries.Type: ApplicationFiled: May 10, 2013Publication date: November 14, 2013Applicant: Seiko Epson CorporationInventor: Kyo HORIE
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Publication number: 20130257555Abstract: A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.Type: ApplicationFiled: May 31, 2013Publication date: October 3, 2013Inventor: Kyo HORIE
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Publication number: 20120229225Abstract: A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.Type: ApplicationFiled: August 25, 2011Publication date: September 13, 2012Applicant: SEIKO EPSON CORPORATIONInventor: Kyo HORIE
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Patent number: 7710002Abstract: A piezoelectric resonator for an oscillator contained in an upper concave portion of an insulating case that has a metal lid with which the upper concave portion is air-tightly closed comprises a GND electrode being conductively coupled to an earth pattern of the piezoelectric resonator and provided on an outer bottom face of the insulating case, a piezoelectric connecting electrode being conductively coupled to an excite electrode of the piezoelectric resonator and provided on the outer bottom face of the insulating case, and an adjustment electrode being conductively coupled to the metal lid and provided on the outer bottom face of the insulating case in such a way that a regulator circuit in an IC part conductively contacts with the adjustment electrode if the IC part including the oscillation circuit is attached to the outer bottom face of the insulating case, wherein the metal lid serves as an adjustment terminal.Type: GrantFiled: November 13, 2007Date of Patent: May 4, 2010Assignee: Epson Toyocom CorporationInventors: Kyo Horie, Makoto Komai