Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. The antenna RF module includes an RF filter arranged on a front surface of a main board, a radiation element module arranged on a first side of the RF filter, and a reflector arranged between the RF filter and the radiation element module in such a manner as to ground (GND) the radiation element module and, at the same time, to serve as an intermediary for dissipating heat generated in the RF filter to the outside. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The advantage of greatly improving performance in heat dissipation can be achieved.

Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF module, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.

Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF filter, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.

Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF module, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.

Abstract: The present invention relates to an antenna device, comprising: a front housing including antenna arrangement units in which at least one radiation element is disposed on the front sides thereof, and heat dissipation units formed between adjacent antenna arrangement units and being exposed to outside air to transfer heat generated from the rear side to the front; and a rear housing coupled to the front housing and provided with a filter for filtering RF signals and a main board on which an RF element is mounted, wherein the heat generated from the filter is transferred to the front of the front housing through the contact with the back surface of the front housing by using the filter as a heat transfer medium.

Abstract: The present invention relates to relates to a multi-input and multi-output antenna apparatus, and particularly, to a multi-input and multi-output antenna apparatus including a main board having an accommodation space formed in at least one region and provided in the form of a predetermined space, and a sub-board stacked on a rear surface portion of the main board and configured such that a plurality of heating elements is mounted on a front surface portion of the sub-board that is directed toward the accommodation space, in which heat generated from the heating elements is dissipated to a rear surface portion of the sub-board, which makes it possible to improve heat dissipation performance of the antenna apparatus and improve frequency filtering performance of the antenna apparatus.

Abstract: A massive multiple-input multiple-output (MIMO) antenna apparatus and a heat dissipation device therefor are disclosed. The present disclosure according to at least one embodiment provides a massive MIMO antenna apparatus including a board, a first blowing unit, and a second blowing unit. The board has at least one board surface that holds a distributed arrangement of a plurality of heat-generating components, has a width and a length longer than the width, and includes a first section having a first amount of heat generation and a second section having a second amount of heat generation greater than the first amount of heat generation, the first section and the second section being partitioned along a length direction of the board.

Abstract: The present invention relates to an antenna device, and especially, comprises: a printed board assembly (PBA hereinafter) which has a plurality of antenna-related components mounted to one surface, and has a plurality of filters mounted to the other surface; and an antenna board which is stacked and disposed on the one surface side of the PBA, has a plurality of antenna elements mounted to one surface, and is connected to the filters tightly adhering to the other surface, so as to establish an electrical signal line with the filters, wherein the filters are spaced apart from the other surface of the PBA and have clamshell parts integrally formed so as to prevent a signal leakage from the electrical signal line, and thus an advantage is provided of enabling the improvement of the overall heat dissipation performance and filter performance of the filters.

Abstract: A PCB assembly is disclosed herein. An embodiment of the present disclosure provides a printed circuit board (PCB) assembly on which a plurality of devices is mounted, including: a power supply area disposed at one side of a main printed circuit board; a first area positioned in another direction of the main printed circuit board from the power supply area and including the plurality of devices; a second area positioned in another direction of the main printed circuit board from the first area and including the plurality of devices; a third area positioned in another direction of the main printed circuit board from the second area and including the plurality of devices; and a bridge printed circuit board receiving power from the power supply area and disposed vertically to the main printed circuit board, wherein the bridge printed circuit board crosses the first area, the second area, and the third area, and transmits power and a signal to at least one area.

Abstract: The present invention relates to an antenna device and, particularly, the antenna device comprises: a printed board assembly (hereinafter, referred to as “PBA”) having a plurality of antenna-related components mounted on one surface thereof, and having a plurality of filters mounted on the other surface thereof, an antenna board which is arranged to be stacked on one surface side of the PBA, and which has a plurality of antenna elements mounted on one surface thereof and connected to construct electrical signal lines with the filters in close contact with the other surface thereof, and clamshell units interposed between the other surface of the PBA and one surface of the filters to perform a signal shielding function, wherein the insides of the clamshell units include strip line connectors which absorb the assembly tolerance between the clamshell units while being partially deformed by means of the adhesion of the filters during close-coupling of the filters, and which shield a signal by means of ground surfa

Abstract: An RF connector is disclosed herein.

Abstract: A heat dissipation apparatus and antenna assembly using the same is disclosed herein. According to an embodiment of the present disclosure, a heat dissipation apparatus configured to cool a circuit board including at least one heat generation element is provided, the heat dissipation apparatus including: a plate disposed to face the circuit board; a plurality of first heat dissipation fins disposed in a first direction on one surface of the plate spaced apart from the circuit board; and a blowing unit disposed to face the one surface of the plate, the blowing unit including at least one fan configured to discharge air toward the one surface of the plate, wherein a space between two adjacent first heat dissipation fins defines a side flow path configured to guide the air discharged from the at least one fan.

Abstract: Provided is a heat dissipating apparatus for electronic elements which has the minimum size but has improved heat dissipating performance. To this end, the heat dissipating apparatus for electronic elements, according to the present invention, comprises: a heat dissipating housing having an internal space; a shield case formed of a thermally conductive material, wherein the shield case is disposed in the heat dissipating housing and partitions the internal space into a first chamber which is a vacuum space to be filled with a refrigerant and a second chamber which is a non-vacuum space; and a printed circuit board which is disposed in the shield case and has a heat dissipating element. The shield case evaporates the refrigerant by using sensible heat transferred from the heat dissipating element to the shield case and latent heat transferred from the shield case to the first chamber.