Patents by Inventor Kyo TANABIKI
Kyo TANABIKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240096843Abstract: According to one embodiment, a semiconductor device includes: a chip; a first electrode provided on the chip; a first connector provided above the first electrode, extending in a first direction, and provided with a joint portion to be joined to the first electrode, on an end portion in the first direction of the first connector; and a joint member for use in joint between the first electrode and the joint portion. The joint portion is provided with a notch portion on at least one end portion in the first direction of an upper surface of the joint portion. The joint member is in contact with the first electrode, a lower surface of the joint portion facing the first electrode, and at least, part of the notch portion.Type: ApplicationFiled: March 2, 2023Publication date: March 21, 2024Inventor: Kyo TANABIKI
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Publication number: 20240096762Abstract: A first chip on a first lead frame includes a first source electrode on a surface opposite to the first lead frame. A first source terminal is located in a first direction from the first lead frame. A first gate terminal is located in a second direction from the first source terminal. A first conductor contacts the first source electrode and the first source terminal via conductors. A second chip on a second lead frame includes a second source electrode on a surface opposite to the second lead frame. A second gate terminal is located in a second direction from the first gate terminal. A second source terminal is located in the second direction from the second gate terminal. A second conductor contacts the second source electrode and the second source terminal via conductors.Type: ApplicationFiled: February 1, 2023Publication date: March 21, 2024Inventors: Kyo Tanabiki, Yoshihiro Higashikawa, Hajime Takagi
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Publication number: 20240079368Abstract: A device includes a first conductive-member which connects to a first electrode on a first face of a chip. A second conductive-member is spaced from the chip and the first conductive-member. A third conductive-member is spaced from the first and second conductive-members. A first connector connects between the second electrode and the second conductive-member. A second connector is opposed to a third electrode on the second face and connects the third electrode and the third conductive-member. A first connecting-member connects the first connector and the second face. A second connecting-member connects the first connector and the second conductive-member. The first connector includes first protruded portions protruded in a first direction from the first conductive-member to the second conductive-member. The second connecting-member is provided to correspond to each of places between the first protruded portions and the second conductive-member.Type: ApplicationFiled: February 23, 2023Publication date: March 7, 2024Inventors: Satoshi HATTORI, Kyo TANABIKI, Atsushi TANAKA
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Publication number: 20230411337Abstract: According to one embodiment, a semiconductor device includes a bed portion, a semiconductor element, and a connector. The semiconductor element has a first electrode electrically connected to the bed portion and a second electrode facing away from the bed portion. The connector includes a first connection portion with a first surface electrically connected to the second electrode. The first surface is inclined in a direction from an outer edge portion of the first surface toward a center of the first surface. A lead portion of the connector is electrically connected to the first connection portion and spaced away from the bed portion.Type: ApplicationFiled: March 2, 2023Publication date: December 21, 2023Inventor: Kyo TANABIKI
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Patent number: 11735505Abstract: According to one embodiment, a semiconductor device includes a semiconductor chip, first and second conductive members, a first connection member, and a resin portion. The first conductive member includes first and second portions. The second portion is electrically connected to the semiconductor chip. A direction from the semiconductor chip toward the second portion is aligned with a first direction. A direction from the second portion toward the first portion is aligned with a second direction crossing the first direction. The second conductive member includes a third portion. The first connection member is provided between the first and third portion. The first connection member is conductive. The resin portion includes a first partial region. The first partial region is provided around the first and third portions, and the first connection member. The first portion has a first surface opposing the first connection member and including a recess and a protrusion.Type: GrantFiled: May 10, 2021Date of Patent: August 22, 2023Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage CorporationInventors: Hidetoshi Kuraya, Satoshi Hattori, Kyo Tanabiki
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Publication number: 20220301983Abstract: According to one embodiment, a semiconductor device includes a frame with a die pad and terminals extending from the die pad in a first direction. A groove is provided in an upper surface of the die pad. A semiconductor element is on the upper surface of the die pad but does not overlap the groove. A resin material covers the semiconductor element and is in the groove. The groove includes a bottom surface with an irregularity therein.Type: ApplicationFiled: August 24, 2021Publication date: September 22, 2022Inventor: Kyo TANABIKI
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Publication number: 20210265243Abstract: According to one embodiment, a semiconductor device includes a semiconductor chip, first and second conductive members, a first connection member, and a resin portion. The first conductive member includes first and second portions. The second portion is electrically connected to the semiconductor chip. A direction from the semiconductor chip toward the second portion is aligned with a first direction. A direction from the second portion toward the first portion is aligned with a second direction crossing the first direction. The second conductive member includes a third portion. The first connection member is provided between the first and third portion. The first connection member is conductive. The resin portion includes a first partial region. The first partial region is provided around the first and third portions, and the first connection member. The first portion has a first surface opposing the first connection member and including a recess and a protrusion.Type: ApplicationFiled: May 10, 2021Publication date: August 26, 2021Applicants: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage CorporationInventors: Hidetoshi KURAYA, Satoshi HATTORI, Kyo TANABIKI
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Patent number: 11037863Abstract: According to one embodiment, a semiconductor device includes a semiconductor chip, first and second conductive members, a first connection member, and a resin portion. The first conductive member includes first and second portions. The second portion is electrically connected to the semiconductor chip. A direction from the semiconductor chip toward the second portion is aligned with a first direction. A direction from the second portion toward the first portion is aligned with a second direction crossing the first direction. The second conductive member includes a third portion. The first connection member is provided between the first and third portion. The first connection member is conductive. The resin portion includes a first partial region. The first partial region is provided around the first and third portions, and the first connection member. The first portion has a first surface opposing the first connection member and including a recess and a protrusion.Type: GrantFiled: March 7, 2018Date of Patent: June 15, 2021Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage CorporationInventors: Hidetoshi Kuraya, Satoshi Hattori, Kyo Tanabiki
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Publication number: 20190139866Abstract: According to one embodiment, a semiconductor device includes a semiconductor chip, first and second conductive members, a first connection member, and a resin portion. The first conductive member includes first and second portions. The second portion is electrically connected to the semiconductor chip. A direction from the semiconductor chip toward the second portion is aligned with a first direction. A direction from the second portion toward the first portion is aligned with a second direction crossing the first direction. The second conductive member includes a third portion. The first connection member is provided between the first and third portion. The first connection member is conductive. The resin portion includes a first partial region. The first partial region is provided around the first and third portions, and the first connection member. The first portion has a first surface opposing the first connection member and including a recess and a protrusion.Type: ApplicationFiled: March 7, 2018Publication date: May 9, 2019Applicants: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage CorporationInventors: Hidetoshi KURAYA, Satoshi HATTORI, Kyo TANABIKI