Abstract: Proposed is a cartridge module that modularizes a probe card and a wafer to maintain positions thereof, and a multi wafer burn-in test device capable of inspecting multiple wafers in one test using the same. The device includes at least two chambers (120), each of which has a test head (121) that electrically connects a probe card and a tester (110) to test a loaded wafer, a cartridge module (200) including a first body (210) provided with the probe card (211), and a second body (220) provided with a wafer chuck (221) on which a wafer (10) is seated, the first body (210) and the second body (220) being detachably assembled with each other, a wafer loading unit (130) for loading the wafer (10) into the second body (220), and a transfer unit (150) configured to transfer and deliver the cartridge module (200).

Abstract: In one or more embodiments, a sub-pixel includes adjacent overhang structures disposed over a substrate. Each overhang structure has an upper portion having a top surface and a bottom surface. The bottom surface wider than a top surface of a lower portion. Adjacent overhang structures define an opening of the sub-pixel. An anode is disposed over the substrate between the adjacent overhang structures. An organic light-emitting diode (OLED) material disposed over the anode. A cathode is disposed over the OLED material. An encapsulation layer is disposed over the cathode. The encapsulation layer extends under at least a portion of the overhang structures along a sidewall of the lower portion and contacts the bottom surface of the upper portion of the overhang structures.

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

Abstract: Particular embodiments may provide an anode material, comprising a compound of formula Li2—X—Y, wherein: X and Y are each independently a metal atom or a metalloid atom; the anode material has a discharge potential of less than about 0.4 V vs. Li/Li+; and the molar ratio of Li:X:Y is 2:1:1.

Abstract: Methods and apparatus for forming organic light emitting diode (OLED) structures disposed on a substrate are provided.

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.

Abstract: Provided is a method for preparing a polyamide by an anionic polymerization reaction, wherein lactam, and based on 100 parts by weight of the entire lactam, 0.01 parts by weight to 20 parts by weight of an alkali metal as an initiator, 0.3 parts by weight to 10 parts by weight of a molecular weight controller, and 0.002 parts by weight to 1.0 part by weight of carbon dioxide as an activator may be included.

Abstract: A display device includes a substrate, a plurality of bank patterns disposed on the substrate, at least one concave portion formed in one of the plurality of bank patterns, a first electrode disposed in the concave portion, a reflection layer disposed on the first electrode, a light-emitting element disposed on the first electrode; and a first optical layer surrounding a side surface of the light-emitting element.

Abstract: Disclosed is an apparatus for treating a substrate, the apparatus including: a process chamber for treating a substrate with a treatment solution; a treatment solution supply pipe for supplying a liquid used for a liquid treatment to the process chamber; a mixing unit connected to the treatment solution supply pipe and having a mixing space formed therein; a first liquid pipe for supplying a first liquid to the mixing space; a second liquid pipe for supplying a second liquid to the mixing space; an intake pipe for decompressing the mixing space; a first valve for regulating the supply of the first liquid to the mixing space; a second valve for regulating the supply of the second liquid to the mixing space; and an intake valve for regulating whether to decompress the mixing space, in which the mixing unit includes a body including the mixing space, and a first inlet port, a second inlet port, a third inlet port, and an outlet port connected with the mixing space, the outlet port is connected with the liquid su

Abstract: The present relates to a micro LED display device and a method for manufacturing the micro LED display device, wherein micro LEDs and a drive substrate can be stably bonded without a reduction in light extraction efficiency. The micro LED display device a drive substrate having a first pad and a second pad that are connected to different potentials; and micro LEDs having a light-emitting structure in which an n-type semiconductor layer, an active layer, and a p-type semiconductor layer are stacked, an n-type pad electrically connecting the n-type semiconductor layer and the first pad, and a p-type pad electrically connecting the p-type semiconductor layer and the second pad. One of the n-type pad or the p-type pad may be provided on a side surface of the light-emitting substrate.

Abstract: Proposed is a probe card holder for wafer testing including a first body part (110) provided with a probe card (111) and through guide holes (112) vertically formed around the probe card (111), a second body part (120) provided with a wafer chuck (121) on which a wafer is seated and a magnet holder (122) corresponding to the guide hole (112), a weight ring (130) provided with a magnet chuck (131) that is inserted into the guide hole (112) and fixed with the magnet holder (122) by magnetic force, and assembled with the second body part (120) at a top of the first body part (110), and a clamping part (140) provided between the first body part (110) and the weight ring (130) to hold spacing between the first body part (110) and the weight ring (130).

Abstract: This specification relates to a packaging substrate and a manufacturing method for the packaging substrate. The packaging substrate according to this specification includes a core layer comprising a glass core having a first surface and a second surface facing each other, as well as a cavity portion penetrating through the glass core. An element module is arranged in the cavity portion, which includes a cavity element and a distribution layer formed on upper side of the cavity element. The cavity distribution layer includes a redistribution circuit layer and a cavity heat dissipation pattern, where the redistribution circuit layer includes i) a cavity bump layer; or ii) vias and circuit layers. The cavity heat dissipation pattern facilitates the movement of heat generated by the cavity element.

Abstract: An embodiments may be related to a display device. A display device may include display layer and an antenna. The display layer may comprise a first display area including an exposed area and a cover area, a folding display area adjacent to the first display area, and a second display area adjacent to the folding area. The antenna disposed on the exposed area of the first display area, wherein the second display area covers the cover area of the first display area and exposes the exposed area of the first display area, when the folding display area is folded.

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

Abstract: An electronic device includes: a display layer in which an active area and a peripheral area adjacent to the active area are defined, the display layer including a common electrode, a sensor layer disposed on the display layer and including a plurality of sensing electrodes and an antenna pattern, and a cover layer spaced apart from the sensor layer with the display layer therebetween, the cover layer having a conductivity. The peripheral area includes a first area and a second area spaced apart from the active area with the first area therebetween, and the common electrode is disposed in the active area and the first area and is spaced apart from the second area. When viewed in a plan view, a portion of the antenna pattern does not overlap the common electrode and overlaps the cover layer.

Abstract: This specification relates to a packaging substrate and a manufacturing method for the packaging substrate. The packaging substrate according to this specification includes a core layer comprising a glass core having a first surface and a second surface facing each other, as well as a cavity portion penetrating through the glass core. An element module is disposed of the cavity portion. The element module comprises one or more cavity elements and a cavity distribution layer that are modularized into a capsule layer, wherein the cavity distribution layer is disposed above the cavity element, and the cavity distribution layer comprises a redistribution distribution circuit layer. A manufacturing method of a packaging substrate comprises preparing operation of a glass core with a cavity portion and an element module; and arranging operation of the element module in the cavity portion.

Abstract: The present invention relates to a 2,7-substituted pyrrolo[2,1-f][1,2,4]triazine compound having a protein kinase inhibitory activity, a pharmaceutically acceptable salt thereof, and a pharmaceutical composition for the prevention, alleviation, or treatment of diseases induced by abnormal cell growth containing the compounds as active ingredients, and the novel cyclic 2,7-substituted pyrrolo[2,1-f][1,2,4]triazine compounds of the present invention exhibit excellent inhibitory effects on various protein kinases involved in growth factor signaling pathways. Therefore, they are useful as preventives, alleviators, or therapeutics for diseases characterized by abnormal cell growth induced by these protein kinases.

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The sub-pixel circuit includes a plurality of contact overhangs. The plurality of contact overhangs are disposed between adjacent sub-pixels of a sub-pixel circuit to be formed. The contact overhangs are formed over a metal grid exposed through a PDL structure. A cathode is deposited via evaporation deposition to be in contact with the contact overhang. The metal grid is perpendicular to a plurality of metal layers disposed on the substrate.

Abstract: Provided is a process of manufacturing light olefins, which is a fluidized bed catalytic naphtha cracking process having improved economic feasibility and decreased greenhouse gas emissions. The process of manufacturing light olefins according to the present invention has a decreased hot spot occurring when supplying an additional fuel oil and decreased tendency of catalyst deactivation by water, thereby improving economic feasibility of the process and reducing greenhouse gas emissions to allow construction of an environmentally friendly process.